System and method for laser beveling and/or polishing

• US 10,343,237 B2
• Filed: 08/28/2015
• Issued: 07/09/2019
• Est. Priority Date: 02/28/2014
• Status: Active Grant

• Current Assignee: IPG Photonics Corporation
• Original Assignee: IPG Photonics Corporation
• Inventors: Sercel, Jeffrey P., Mendes, Marco, Sarrafi, Rouzbeh, Schoenly, Joshua, Song, Xiangyang, Hannon, Mathew, Sokol, Miroslaw
• Primary Examiner(s): Ochylski, Ryan M
• Application Number:
  US14/838,837
• Publication Number:
  US 20160059354A1
• Time in Patent Office: 1,411 Days
• CPC Class Codes: B23K 2103/50 Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
• CPC Class Codes: B23K 2103/52 Ceramics
• CPC Class Codes: B23K 2103/54 Glass
• CPC Class Codes: B23K 2103/56 semiconducting semiconducting devices B23K2101/40
• CPC Class Codes: B23K 26/0853 Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
• CPC Class Codes: B23K 26/361 for deburring or mechanical trimming B23K26/351 takes precedence
• CPC Class Codes: B23K 26/38 by boring or cutting
• CPC Class Codes: B23K 26/402 involving non-metallic material, e.g. isolators

Abstract

Laser processing of hard dielectric materials may include cutting a part from a hard dielectric material using a continuous wave laser operating in a quasi-continuous wave (QCW) mode to emit consecutive laser light pulses in a wavelength range of about 1060 nm to 1070 nm. Cutting using a QCW laser may be performed with a lower duty cycle (e.g., between about 1% and 15%) and in an inert gas atmosphere such as nitrogen, argon or helium. Laser processing of hard dielectric materials may further include post-cut processing the cut edges of the part cut from the dielectric material, for example, by beveling and/or polishing the edges to reduce edge defects. The post-cut processing may be performed using a laser beam with different laser parameters than the beam used for cutting, for example, by using a shorter wavelength (e.g., 193 nm excimer laser) and/or a shorter pulse width (e.g., picosecond laser).

Claims

1. A method for processing edges of a part, the method comprising:

generating a laser beam from a laser system with parameters capable of providing sufficient absorption in the material to modify the material such that edge defects are reduced;

directing the laser beam at an edge of the part such that the laser beam is angled with an angle of incidence greater than 0° and

less than a critical angle; and

controlling a motion stage supporting the cut part to move the cut part with coordinated motion in multiple axes relative to the angled laser beam such that the angled laser beam bevels and/or polishes the edge of the part to reduce the edge defects, wherein the coordinate motion of the cut part changes the orientation of the angled laser beam relative to the cut part to change the cut angle at the edge of the part while the laser angle remains the same, wherein the cut angle of the laser beam is changed within a range of cut angles to form a rounded bevel on at least a portion of the edge of the part.

2. The method of claim 1 wherein the laser beam is generated from an excimer laser.

3. The method of claim 2 wherein the laser beam generated by the excimer laser has a wavelength of 193 nm or 248 nm.

4. The method of claim 2 wherein the laser beam generated by the ultrafast laser has a wavelength in the IR range, the green range or the UV range.

5. The method of claim 1 wherein the laser beam is generated from an ultrafast laser.

6. The method of claim 1 wherein the laser beam ablates material at the edges of the part.

7. The method of claim 1 wherein the laser beam melts material at the edges of the part.

8. The method of claim 1 wherein the part is circular.

9. The method of claim 1 wherein the part is a cut part having cut edges with the edge defects being formed by cutting the cut part.

10. The method of claim 9 wherein the cut part is cut from a hard dielectric material.

11. A laser processing system for processing edges of a part, the laser processing system comprising:

a laser system for generating a laser beam and directing the laser beam such that the laser beam is angled with an angle of incidence greater than 0° and

less than a critical angle;

at least one motion stage for supporting the part and moving the part in multiple axes relative to the angled laser beam; and

a control system configured to control the motion stage with coordinated motion in the multiple axes relative to the angled laser beam such that the angled laser beam bevels and/or polishes edges of the part to reduce edge defects, wherein the control system is configured to move the motion stage such that the orientation of the angled laser beam changes relative to an edge of the part to change a cut angle at the edge of the part while the laser angle remains the same, wherein the cut angle of the laser beam is changed within a range of cut angles to form a rounded bevel on at least a portion of the edge of the part.

12. The laser processing system of claim 11 wherein the laser system includes an excimer laser.

13. The laser processing system of claim 11 wherein the laser system includes an ultrafast laser.

14. The laser processing system of claim 13 wherein the laser beam generated by the ultrafast laser has a wavelength in the IR range, the green range or the UV range.