Method and device of MEMS process control monitoring and packaged MEMS with different cavity pressures

• US 10,343,896 B2
• Filed: 12/21/2015
• Issued: 07/09/2019
• Est. Priority Date: 01/25/2013
• Status: Active Grant

• Current Assignee: mCube, Inc.
• Original Assignee: mCube, Inc.
• Inventors: Lee, Te-Hsi "Terrence"
• Primary Examiner(s): Nguyen, Duy T
• Application Number:
  US14/977,481
• Publication Number:
  US 20160107883A1
• Time in Patent Office: 1,296 Days
• Field of Search: 438 51
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 7/0041 maintaining a controlled atmosphere with techniques not provided for in B81B7/0038
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/00198 comprising elements which are movable in relation to each other, e.g. comprising slidable or rotatable elements
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 1/00293 maintaining a controlled atmosphere with processes not provided for in B81C1/00285
• CPC Class Codes: B81C 99/004 during manufacturing

Abstract

A method for fabricating an integrated MEMS device and the resulting structure therefore. A control process monitor comprising a MEMS membrane cover can be provided within an integrated CMOS-MEMS package to monitor package leaking or outgassing. The MEMS membrane cover can separate an upper cavity region subject to leaking from a lower cavity subject to outgassing. Differential changes in pressure between these cavities can be detecting by monitoring the deflection of the membrane cover via a plurality of displacement sensors. An integrated MEMS device can be fabricated with a first and second MEMS device configured with a first and second MEMS cavity, respectively. The separate cavities can be formed via etching a capping structure to configure each cavity with a separate cavity volume. By utilizing an outgassing characteristic of a CMOS layer within the integrated MEMS device, the first and second MEMS cavities can be configured with different cavity pressures.

Claims

1. A method for forming a process control monitor comprising:

receiving a semiconductor substrate having a plurality of CMOS devices formed thereon, wherein the semiconductor substrate includes an upper surface;

forming a membrane cover upon at least a portion of the semiconductor substrate, wherein the membrane cover includes an upper surface and a lower surface, wherein the lower surface of the membrane cover and a portion of the upper surface of the semiconductor substrate enable definition of a lower volumetric cavity;

coupling a capping structure to the membrane cover at a bonding interface on the membrane cover, wherein the capping structure includes a lower surface, wherein the upper surface of the membrane cover and lower surface of the capping structure enable definition of an upper volumetric cavity;

wherein the upper volumetric cavity and the lower volumetric cavity are separated by the membrane cover, the membrane cover is configured to make a displacement towards the lower volumetric cavity as a result of leakage from the bonding interface, and the membrane cover is configured to make a displacement towards the upper volumetric cavity as a result from outgassing from the upper surface of the semiconductor substrate; and

forming one or more displacement sensors adjacent to the membrane cover, wherein the one or more displacement sensors are configured to determine a displacement of the membrane cover towards the upper volumetric cavity or towards the lower volumetric cavity as a result of outgassing from the upper surface of the semiconductor substrate or leakage from the bonding interface.

2. The method of claim 1 wherein an initial gas pressure of the lower volumetric cavity and an initial gas pressure of the upper volumetric cavity are substantially similar.

3. The method of claim 1 wherein the one or more displacement sensors comprise capacitors.

4. The method of claim 1 further comprising:

prior to the forming of the membrane cover, forming sidewall structures upon the semiconductor substrate;

wherein the sidewall structures enable definition of the lower volumetric cavity.

5. The method of claim 1 further comprising:

forming a capping structure from another semiconductor substrate, wherein the capping structure comprises a plurality of sidewall structures upon the other semiconductor substrate, wherein the sidewall structures enable definition of the upper volumetric cavity.

6. The method of claim 1 wherein the forming of the membrane cover comprises forming the membrane cover upon a portion of the semiconductor substrate within a first low pressure environment.

7. The method of claim 6

wherein the coupling of the capping structure comprises coupling the capping structure to the membrane cover within a second low pressure environment;

and

wherein the first low pressure environment and the second low pressure environment are substantially similar.

8. The method of claim 6 wherein the first low pressure environment is approximately a vacuum.

9. The method of claim 1 wherein the upper volumetric cavity and the lower volumetric cavity have dissimilar volumes.

10. A method for monitoring MEMS (Micro Electro Mechanical System) device fabrication processes comprising:

receiving a semiconductor substrate having a plurality of CMOS devices formed thereon, wherein the semiconductor substrate includes an upper surface;

forming a membrane cover upon at least a portion of the semiconductor substrate, wherein the membrane cover includes an upper surface and a lower surface, wherein the lower surface of the membrane cover and a portion of the upper surface of the semiconductor substrate enable definition of a lower volumetric cavity; and

coupling a capping structure to the membrane cover at a bonding interface on the membrane cover, wherein the capping structure includes a lower surface, wherein the upper surface of the membrane cover and the lower surface of the capping structure enable definition of an upper volumetric cavity;

wherein the upper volumetric cavity and the lower volumetric cavity are separated by the membrane cover, wherein the membrane cover is configured to make a displacement towards the lower volumetric cavity as a result of leakage from the bonding interface, and the membrane cover is configured to make a displacement towards the upper volumetric cavity as a result from outgassing from the upper surface of the semiconductor substrate.

11. The method of claim 10 wherein an initial gas pressure of the lower volumetric cavity and an initial gas pressure of the upper volumetric cavity are substantially similar.

12. The method of claim 10 wherein a change in pressure in the upper volumetric cavity with respect to changes in pressure in the lower volumetric cavity are determined by a plurality of displacement sensors adjacent to the membrane cover.

13. The method of claim 10 wherein the semiconductor substrate comprises sidewall structures, and wherein the sidewall structures enable definition of the lower volumetric cavity.

14. The method of claim 10 wherein the capping structure comprises a plurality of sidewall structures, wherein the plurality of sidewall structures enable definition of the upper volumetric cavity.

15. The method of claim 10 wherein the upper volumetric cavity is initially associated with a first low pressure environment.

16. The method of claim 15

wherein the lower volumetric cavity is initially associated with a second low pressure environment;

and

wherein the first low pressure environment and the second low pressure environment are substantially similar.

17. The method of claim 15 wherein the first low pressure environment is approximately a vacuum.

18. The method of claim 10 wherein the upper volumetric cavity and the lower volumetric cavity have dissimilar volumes.

19. The method of claim 10 further comprising reporting a change in pressure, wherein the reporting of change in pressure comprises outputting a change in capacitance value.