Integrated package containing MEMS acoustic sensor and environmental sensor and methodology for fabricating same

• US 10,343,897 B2
• Filed: 03/23/2017
• Issued: 07/09/2019
• Est. Priority Date: 05/09/2014
• Status: Active Grant

• Current Assignee: Invensense Incorporated (TDK Corporation)
• Original Assignee: Invensense Incorporated (TDK Corporation)
• Inventors: Tsai, Julius Ming-Lin, Cagdaser, Baris, Lim, Martin, Khenkin, Aleksey S.
• Primary Examiner(s): Kaufman, Joshua
• Application Number:
  US15/468,066
• Publication Number:
  US 20170190571A1
• Time in Patent Office: 838 Days
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2201/0278 Temperature sensors
• CPC Class Codes: B81B 2201/0292 Sensors not provided for in B81B2201/0207 - B81B2201/0285
• CPC Class Codes: B81B 2207/012 the micromechanical device and the control or processing electronics being separate parts in the same package
• CPC Class Codes: B81B 2207/07 Interconnects
• CPC Class Codes: B81B 7/02 containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] B81B7/04 takes precedence
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: B81C 2203/0792 Forming interconnections between the electronic processing unit and the micromechanical structure
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H04R 1/04 Structural association of microphone with electric circuitry therefor in deaf-aid sets H04R25/00
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005
• CPC Class Codes: H04R 29/004 for microphones H04R29/007 takes precedence

Abstract

An integrated package of at least one environmental sensor and at least one MEMS acoustic sensor is disclosed. The package contains a shared port that exposes both sensors to the environment, wherein the environmental sensor measures characteristics of the environment and the acoustic sensor measures sound waves. The port exposes the environmental sensor to an air flow and the acoustic sensor to sound waves. An example of the acoustic sensor is a microphone and an example of the environmental sensor is a humidity sensor.

Claims

1. A microelectromechanical systems (MEMS) device package comprising:

a package comprising a package substrate and a lid;

an environmental sensor comprising a gas sensor with a heating element configured to sense a composition parameter of a gas, wherein the composition parameter of the gas is associated with at least one of a chemical parameter, a biological parameter, a nanoparticle parameter, a spore parameter, or a pathogen parameter of the gas, and wherein the environmental sensor is disposed on the package substrate;

a MEMS acoustic sensing element comprising a diaphragm and disposed in the package;

an integrated circuit (IC) disposed in the package and configured to process data generated by the MEMS acoustic sensing element and the environmental sensor; and

a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the environmental sensor, wherein the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC.

2. The MEMS device package of claim 1, wherein the MEMS acoustic sensing element is disposed on the IC.

3. The MEMS device package of claim 1, wherein the MEMS acoustic sensing element is disposed on the package substrate.

4. The MEMS device package of claim 1, wherein the IC comprising the environmental sensor is disposed on the package substrate.

5. The MEMS device package of claim 1, wherein the gas sensor comprises an environmental sensing material in a configuration sensitive to a change in the composition parameter.

6. The MEMS device package of claim 5, wherein the environmental sensing material is configured in a plurality of segments interspersed between and in direct contact with a plurality of metal electrodes.

7. The MEMS device package of claim 6, wherein the plurality of metal electrodes are arranged such that a variable electrical characteristic results from a change in the composition parameter at the environmental sensing material.

8. The MEMS device package of claim 6, wherein at least one of the plurality of metal electrodes comprises the heating element of the gas sensor.

9. A method for fabricating a microelectromechanical systems (MEMS) device package comprising:

forming a package substrate;

forming a MEMS acoustic sensor element comprising a diaphragm in the MEMS device package;

forming, in the MEMS device package, a gas sensor comprising a heating element and an environmental sensing material in a configuration sensitive to a change in an environmental characteristic associated with a gas composition parameter of a gas at the environmental sensing material, wherein the composition parameter of the gas is associated with at least one of a chemical parameter, a biological parameter, a nanoparticle parameter, a spore parameter, or a pathogen parameter of the gas, and wherein the forming the gas sensor includes depositing a plurality of segments of the environmental sensing material interspersed between a plurality of metal electrodes in direct contact with the environmental sensing material;

forming electrical connections between an application specific integrated circuit (ASIC) disposed in the MEMS device package and the MEMS acoustic sensor element and between the ASIC and the gas sensor;

forming a cover attached to the package substrate to encompass the MEMS acoustic sensor element, the ASIC, and the gas sensor; and

forming an opening in the MEMS device package, wherein the opening is configured to receive sound waves and the gas.

10. The method of claim 9, wherein the forming the gas sensor comprises fabricating a gas sensor arrangement that enables providing a variable electrical characteristic in response to the change in the environmental characteristic at the environmental sensing material.

11. The method of claim 9, wherein the forming the gas sensor comprises configuring at least one of the plurality of metal electrodes as the heating element of the gas sensor.

12. The method of claim 9, further comprising:

forming the MEMS acoustic sensor element on the ASIC.

13. The method of claim 12, wherein the forming the gas sensor comprises at least one of forming the gas sensor on the ASIC or forming the gas sensor on the package substrate adjacent to the ASIC.

14. A microelectromechanical systems (MEMS) device package, comprising:

a package comprising a package substrate and a lid;

a gas sensor comprising a heating element, wherein the gas sensor is disposed on the package substrate and configured to sense a composition parameter of a gas comprising at least one of a chemical parameter, a biological parameter, a nanoparticle parameter, a spore parameter, or a pathogen parameter of the gas;

a MEMS acoustic sensing element comprising a diaphragm and disposed in the package; and

an integrated circuit (IC) disposed in the package and configured to process data generated by the MEMS acoustic sensing element and the gas sensor;

a port disposed in the package configured to receive acoustic waves for the MEMS acoustic sensing element and air for the gas sensor, wherein the package includes an acoustically sealed back cavity that encompasses the MEMS acoustic sensing element and the IC.

15. The MEMS device package of claim 14, wherein the MEMS acoustic sensing element is disposed on the IC, or wherein the IC comprising the gas sensor is disposed on the package substrate.

16. The MEMS device package of claim 14, wherein the gas sensor comprises an environmental sensing material in a configuration sensitive to a change in the composition parameter, wherein the environmental sensing material is configured in a plurality of segments interspersed between and in direct contact with a plurality of metal electrodes, and wherein the plurality of metal electrodes are arranged such that a variable electrical characteristic results from a change in the composition parameter at the environmental sensing material.

17. The MEMS device package of claim 16, wherein at least one of the plurality of metal electrodes comprises the heating element of the gas sensor.