LED package having protrusions for alignment of package within a housing

• US 10,344,923 B2
• Filed: 01/27/2017
• Issued: 07/09/2019
• Est. Priority Date: 09/20/2007
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Willwohl, Harald, Sweegers, Norbertus A. M., Kloosterman, Jan
• Primary Examiner(s): Sufleta, II, Gerald J
• Application Number:
  US15/418,538
• Publication Number:
  US 20170138550A1
• Time in Patent Office: 893 Days
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21K 9/66 Details of globes or covers forming part of the light source
• CPC Class Codes: F21K 9/90 Methods of manufacture
• CPC Class Codes: F21S 41/143 the main emission direction of the LED being parallel to the optical axis of the illuminating device
• CPC Class Codes: F21S 41/151 arranged in one or more lines
• CPC Class Codes: F21S 41/192 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21S 43/14 Light emitting diodes [LED]
• CPC Class Codes: F21S 43/195 Details of lamp holders, terminals or connectors
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: G03B 21/20 Lamp housings
• CPC Class Codes: G03B 21/2033 LED or laser light sources
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H05K 1/0269 for visual or optical inspection
• CPC Class Codes: H05K 3/303 Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence

Abstract

A LED package (10) for use in a lamp as well as a method for manufacturing such kind of a LED package (10) are disclosed, wherein the LED package (10) comprises at least one LED (16), an optical element (18) for guiding light emitted by the LED (16), and a cover (26) for covering, at least partially, electrical components (20, 22, 24) connectable to the LED (16). The cover (26) includes three protrusions (38) that form the highest points on the package. The protrusions (38) abut a surface in a housing for accurately positioning the LED package relative to a lens (52) in the housing. The LED package (10) may be spring-loaded. Side protrusions (28) of the cover (26) additionally help to position the package within the housing.

Claims

1. A device comprising a light emitting diode (LED) package, the LED package comprising:

at least one LED mounted over a base having electrical connectors; and

a cover provided over the base,

wherein the cover comprises at least three alignment first protrusions on its top surface, the at least three alignment first protrusions having a same height above the base and forming the highest points of the LED package, for concurrently contacting a surface during positioning of the LED package in a housing for positioning the LED package at a correct height in the housing relative to a first optical element.

2. The device of claim 1 further comprising second protrusions from a side of the cover, the second protrusions contacting the housing for positioning the package at a correct position within the housing.

3. The device of claim 2 wherein the second protrusions are received by a recess in the housing.

4. The device of claim 1 wherein the base comprises a substrate onto which the at least one LED is mounted.

5. The device of claim 1 wherein the base comprises a heat sink configured to conduct heat away from the at least one LED.

6. The device of claim 1 further comprising a second optical element affixed to the base overlying the at least one LED.

7. The device of claim 6 wherein the first optical element comprises a lens, wherein the housing includes the lens, and the first protrusions cause the LED package to be positioned with respect to the lens.

8. The device of claim 7 wherein the housing is part of a motor vehicle lamp.

9. The device of claim 7 wherein the housing is part of a projection system.

10. The device of claim 6 wherein the second optical element is a collimator.

11. A method of positioning an LED package in a housing comprising:

providing at least three alignment first protrusions on a top surface of the package, forming the highest points of the LED package, the first protrusions having a same height above a base of the package; and

positioning the LED package in a housing such that the three alignment first protrusions concurrently contact a surface in the housing for positioning the LED package at a correct height in the housing relative to a first optical element.

12. The method of claim 11 wherein the package also comprises second protrusions from a side of the package, the second protrusions contacting the housing for positioning the package at a correct position within the housing.

13. The method of claim 12 wherein the second protrusions are received by a recess in the housing.

14. The method of claim 11 wherein the first optical element comprises a lens, and wherein the first protrusions position the LED package relative to the lens in the housing.

15. The method of claim 11 wherein the housing is part of a motor vehicle lamp.

16. The method of claim 11 wherein the housing is part of a projection system.