Thermal flow meter

• US 10,345,131 B2
• Filed: 06/01/2018
• Issued: 07/09/2019
• Est. Priority Date: 12/07/2011
• Status: Active Grant

• Current Assignee: Hitachi Astemo Ltd. (Hitachi, Ltd.)
• Original Assignee: Hitachi Automotive Systems Limited (Hitachi, Ltd.)
• Inventors: Tokuyasu, Noboru, Tashiro, Shinobu, Hanzawa, Keiji, Morino, Takeshi, Doi, Ryosuke
• Primary Examiner(s): Walsh, Ryan D
• Application Number:
  US15/995,410
• Publication Number:
  US 20180274959A1
• Time in Patent Office: 403 Days
• CPC Class Codes: F01N 11/002 the diagnostic devices measuring or estimating temperature or pressure in, or downstream of the exhaust apparatus
• CPC Class Codes: F01N 2560/07 the means being an exhaust gas flow rate or velocity meter or sensor, intake flow meters only when exclusively used to determine exhaust gas parameters
• CPC Class Codes: F02D 41/187 using a hot wire flow sensor
• CPC Class Codes: G01F 1/684 Structural arrangements; Mounting of elements, e.g. in relation to fluid flow
• CPC Class Codes: G01F 1/692 Thin-film arrangements
• CPC Class Codes: G01F 15/04 of gases to be measured
• CPC Class Codes: G01F 5/00 Measuring a proportion of the volume flow

Abstract

A thermal-type flowmeter includes a chip package. The chip package is formed through encapsulation with a resin of a sensor element, a drive circuit, a metal lead frame adapted to have mounted thereon the sensor element and the drive circuit, and a temperature detecting element. The chip package has an exposed structure in which a surface of the sensor element having the diaphragm is exposed. The temperature detecting element is mounted on the lead frame via an electrically conductive member.

Claims

1. An air flow meter comprising a sensor element,

the air flow meter comprising a chip package, wherein

the chip package includes a drive circuit electrically connected to the sensor element,

the chip package includes a chip capacitor that protects the drive circuit,

the chip package includes a metal lead frame on which the drive circuit and the chip capacitor are mounted,

the chip package includes a resin mold within which the drive circuit and the chip capacitor are encapsulated,

wherein the lead frame includes

an input-output terminal for communicating signal with the outside on the side opposite to the sensor element with respect to the drive circuit;

a mounting portion on which the drive circuit is mounted;

wherein the input-output terminal comprises

a first terminal is formed integrally with the mounting portion;

a plurality of second terminals is formed independently of the mounting portion and electrically connected to the drive circuit through wire bonding,

wherein the plurality of second terminals are disposed on both sides of the first terminal, and

wherein the chip capacitor is mounted directly on the first terminal and the second terminal via an electrically conductive adhesive, so that the chip capacitor is fixed directly to the lead frame.

2. The air flow meter according to claim 1, wherein the height of the sensor element is higher than that of the drive circuit.

3. The air flow meter according to claim 1, wherein the chip package includes multiple chip capacitors that are encapsulated by the resin.

4. The air flow meter according to claim 1, wherein the chip package includes a temperature detecting element is encapsulated by the resin.

5. The air flow meter according to claim 4, wherein the chip package is in a shape with a portion thereof, where the temperature detecting element is mounted, being protruded.

6. The air flow meter according to claim 5, wherein a direction of the protrusion of the portion of the chip package is an upstream direction of a flow of the fluid under measurement.

7. The air flow meter according to claim 5, wherein a direction of the protrusion of the portion of the chip package is a direction perpendicular to the flow of the fluid under measurement.

8. The air flow meter according to claim 4, wherein the lead frame is in a shape with a portion thereof, where the temperature detecting element is mounted, being protruded from the mounting portion.

9. The air flow meter as in one of claims 1-8, wherein the sensor element is mounted on the lead frame and is encapsulated by the resin so that the diaphragm is exposed.

10. The air flow meter according to claim 9, wherein the sensor element and the drive circuit are directly electrically connected by a wire bonding, and the wire bonding is encapsulated by resin.