Diodes offering asymmetric stability during fluidic assembly

• US 10,347,513 B2
• Filed: 01/01/2018
• Issued: 07/09/2019
• Est. Priority Date: 06/23/2016
• Status: Active Grant

• Current Assignee: Elux Inc.
• Original Assignee: Elux Inc.
• Inventors: Schuele, Paul John, Heine, David Robert, Crowder, Mark Albert, Garner, Sean Mathew, Zhan, Changqing, Shinde, Avinash Tukaram, Sasaki, Kenji Alexander, Ulmer, Kurt Michael
• Primary Examiner(s): Gebreyesus, Yosef
• Application Number:
  US15/859,673
• Publication Number:
  US 20180144957A1
• Time in Patent Office: 554 Days
• CPC Class Codes: H01L 21/67121 Apparatus for making assemblies not otherwise provided for, e.g. package constructions
• CPC Class Codes: H01L 21/67333 Trays for chips magazine for components H05K13/0084
• CPC Class Codes: H01L 2224/95001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 2224/95101 in a liquid medium
• CPC Class Codes: H01L 2224/95123 by applying a pressurised fluid flow, e.g. liquid or gas flow
• CPC Class Codes: H01L 2224/95136 involving guiding structures, e.g. shape matching, spacers or supporting members
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 33/0095 Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
• CPC Class Codes: H01L 33/20 with a particular shape, e.g. curved or truncated substrate
• CPC Class Codes: H01L 33/38 with a particular shape
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating

Abstract

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

Claims

1. A substrate for fluidic assembly, the substrate comprising:

a plurality of wells extending from a top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode, wherein the post enhanced diode includes a post extending from a top surface of a diode structure, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a non-inverted orientation, and wherein an orientation of a post enhanced diode where the post extends toward the substrate is an inverted orientation; and

at least one groove extending into the top surface of the substrate and configured such that the post enhanced diode traversing the at least one groove in the non-inverted orientation is more mechanically stable than the post enhanced diode traversing the at least one groove in the inverted orientation.

2. The substrate of claim 1, wherein a depth of the groove into the substrate is less than a distance from an edge of a top surface of the diode structure to an edge of the post.

3. The substrate of claim 1, wherein a width of the groove at the top surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

4. The substrate of claim 1, wherein the at least one groove is a series of two or more parallel grooves.

5. The substrate of claim 4, wherein the series of two or more parallel grooves are co-located in a region of the substrate that does not include any of the plurality of wells.

6. The substrate of claim 1, wherein the at least one groove extends in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a first height, wherein the diode structure of the post enhanced diode exhibits a second height, wherein an overall height of the post enhanced diode is the first height plus the second height, and wherein the width of the at least one groove is less than the second height.

7. The substrate of claim 6, wherein the line is selected from a group consisting of:

a straight line, and a curvilinear line.

8. The substrate of claim 1, wherein the at least one groove extends in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a distance from an upper surface at an outer perimeter of the diode structure to an upper surface of an outer perimeter of the post, and wherein the width of the at least one groove is less than the distance.

9. The substrate of claim 8, wherein the line is selected from a group consisting of:

a straight line, and a curvilinear line.

10. The substrate of claim 1, wherein the at least one groove extends in a line across a portion of the substrate, and wherein:

the line is selected from a group consisting of;

a straight line, and a curvilinear line; and

wherein at least one sidewall of the line extending into the substrate is tapered.

11. The substrate of claim 10, wherein the opposing sidewall of the line extending into the substrate is substantially vertical.

12. The substrate of claim 1, wherein the at least one groove is/are located together at a first region on the substrate and the plurality of wells are located together at a second region on the substrate, and wherein the first region does not overlap the second region.

13. The substrate of claim 1, wherein the at least one groove is/are intermixed between the plurality of wells across the top surface of the substrate.

14. A substrate for fluidic assembly, the substrate comprising:

a plurality of wells extending from a top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode, wherein the post enhanced diode includes a post extending from a top surface of a diode structure, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a non-inverted orientation, and wherein an orientation of a post enhanced diode where the post extends toward the substrate is an inverted orientation; and

at least one structure disposed about the top surface of the substrate and configured such that the post enhanced diode traversing the at least one structure in the non-inverted orientation is more mechanically stable than the post enhanced diode traversing the at least one structure in the inverted orientation.

15. The substrate of claim 14, wherein the at least one structure includes a groove extending into the top surface, and wherein a depth of the groove into the substrate is less than a distance from an edge of a top surface of the diode structure to an edge of the post.

16. The substrate of claim 15, wherein the groove extends in a line across a portion of the substrate, and wherein:

the line is selected from a group consisting of;

a straight line, and a curvilinear line; and

wherein at least one sidewall of the line extending into the substrate is tapered.

17. The substrate of claim 16, wherein the opposing sidewall of the line extending into the substrate is substantially vertical.

18. The substrate of claim 14, wherein a width of the structure at the top surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

19. The substrate of claim 14, wherein the at least one structure includes a series of two or more parallel grooves extending into the top surface.

20. The substrate of claim 19, wherein the series of two or more parallel grooves are co-located in a region of the substrate that does not include any of the plurality of wells.

21. The substrate of claim 14, wherein the at least one structure includes a groove extending in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a first height, wherein the diode structure of the post enhanced diode exhibits a second height, wherein an overall height of the post enhanced diode is the first height plus the second height, and wherein the width of the at least one groove is less than the second height.

22. The substrate of claim 21, wherein the line is a straight line.

23. The substrate of claim 14, wherein the at least one structure includes a groove extending in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a distance from an upper surface at an outer perimeter of the diode structure to an upper surface of an outer perimeter of the post, and wherein the width of the at least one groove is less than the distance.

24. The substrate of claim 23, wherein the line is a straight line.