Integrated assemblies, and methods of forming integrated assemblies
First Claim
1. An integrated assembly, comprising:
- a first semiconductor material configured to comprise a pair of pedestals;
the pedestals having upper regions which are separated from one another by a space, and having lower regions which join to one another at a floor region beneath the space;
the pedestals being a first pedestal and a second pedestal;
a second semiconductor material configured as a bridge extending between the pedestals;
the bridge being above the floor region, and being spaced from the floor region by an intervening gap;
the bridge having a first end adjacent the first pedestal, a second end adjacent the second pedestal, and body region between the first and second ends;
the body region having an outer periphery which surrounds the body region;
a first source/drain region within the first pedestal, a second source/drain region within the second pedestal, and a channel region within the bridge;
a dielectric material outward of the bridge and extending entirely around the outer periphery of the body region of the bridge; and
a conductive material outward of the dielectric material and extending entirely around the outer periphery of the body region of the bridge;
the conductive material comprising a transistor gate which gatedly couples the first and second source/drain regions to one another through the channel region.
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Accused Products
Abstract
Some embodiments include an integrated assembly having a first semiconductor material configured to comprise a pair of pedestals. The pedestals have upper regions which are separated from one another by a space, and have lower regions which join to one another at a floor region beneath the space. A second semiconductor material is configured as a bridge extending between the pedestals. The bridge is spaced from the floor region by a gap. The bridge has ends adjacent the pedestals, and has a body region between the ends. The body region has an outer periphery. Source/drain regions are within the pedestals, and a channel region is within the bridge. A dielectric material extends around the outer periphery of the body region of the bridge. A conductive material extends around the dielectric material. Some embodiments include methods of forming integrated assemblies.
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Citations
26 Claims
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1. An integrated assembly, comprising:
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a first semiconductor material configured to comprise a pair of pedestals;
the pedestals having upper regions which are separated from one another by a space, and having lower regions which join to one another at a floor region beneath the space;
the pedestals being a first pedestal and a second pedestal;a second semiconductor material configured as a bridge extending between the pedestals;
the bridge being above the floor region, and being spaced from the floor region by an intervening gap;
the bridge having a first end adjacent the first pedestal, a second end adjacent the second pedestal, and body region between the first and second ends;
the body region having an outer periphery which surrounds the body region;a first source/drain region within the first pedestal, a second source/drain region within the second pedestal, and a channel region within the bridge; a dielectric material outward of the bridge and extending entirely around the outer periphery of the body region of the bridge; and a conductive material outward of the dielectric material and extending entirely around the outer periphery of the body region of the bridge;
the conductive material comprising a transistor gate which gatedly couples the first and second source/drain regions to one another through the channel region. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A memory array, comprising:
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active regions;
each of the active regions including a first semiconductor material configured to comprise three pedestals;
the pedestals being a first pedestal, a second pedestal and a third pedestal;
the first and second pedestals having upper regions separated from one another by a first space, and having lower regions joining to one another at a first floor region beneath the first space;
the second and third pedestals having upper regions separated from one another by a second space, and having lower regions joining to one another at a second floor region beneath the second space;first bridges extending between the first and second pedestals;
the first bridges being above the first floor regions, and being spaced from the first floor regions by first intervening gaps;
the first bridges each having a first body region, and each having a first outer periphery which surrounds the first body region;second bridges extending between the second and third pedestals;
the second bridges being above the second floor regions, and being spaced from the second floor regions by second intervening gaps;
the second bridges each having a second body region, and each having a second outer periphery which surrounds the second body region;first, second and third source/drain regions within the first, second and third pedestals, respectively, of each of the active regions; the first and second bridges comprising second semiconductor material; first channel regions within each of the first bridges; second channel regions within each of the second bridges; wordlines having gate regions which extend entirely around the first and second outer peripheries; charge-storage devices coupled with the first and third source/drain regions; and bitlines coupled with the second source/drain regions. - View Dependent Claims (8, 9, 10, 11, 12, 13)
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14. A method of forming an integrated assembly, comprising:
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providing a substrate comprising, along a cross-section, active regions spaced from one another by intervening locations;
the cross-section being along a plane which extends along a first direction;forming trenches extending along a second direction which crosses the first direction and intersects the first plane;
the trenches comprising a pair of trenches extending through one of the active regions along the cross-section, and a pair of trenches passing along outer edges of said one of the active regions along the cross-section;
the trenches passing through said one of the active regions being first and second trenches;
the trenches passing along the outer edges of said one of the active regions being third and fourth trenches;forming spacers along bottom regions of the first and second trenches; forming semiconductor material over the spacers and configured as bridges;
the bridges being a first bridge within the first trench and a second bridge within the second trench;
the first bridge having a first body region and having a first outer periphery which surrounds the first body region;
the second bridge having a second body region and having a second outer periphery which surrounds the second body region;removing the spacers from under the bridges; forming dielectric material to surround the first and second outer peripheries of the first and second bridges; and after forming the dielectric material, forming wordline material within the first, second, third and fourth trenches;
the wordline material within the first and second trenches surrounding the first and second outer peripheries of the first and second bridges. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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Specification