Medical apparatus and X-ray high voltage apparatus

• US 10,349,507 B2
• Filed: 04/28/2014
• Issued: 07/09/2019
• Est. Priority Date: 09/11/2012
• Status: Active Grant

• Current Assignee: Toshiba Medical Systems Corporation (Canon Inc.)
• Original Assignee: Toshiba Medical Systems Corporation (Canon Inc.)
• Inventors: Ishiyama, Fumio, Hirohata, Kenji
• Primary Examiner(s): Charioui, Mohamed
• Assistant Examiner(s): Rastovski, Catherine T.
• Application Number:
  US14/263,173
• Publication Number:
  US 20140233708A1
• Time in Patent Office: 1,898 Days
• Field of Search: None
• CPC Class Codes: A61B 6/03 Computed tomography [CT] echo-tomography A61B8/14
• CPC Class Codes: A61B 6/4488 Means for cooling A61B6/045 takes precedence
• CPC Class Codes: A61B 6/56 Details of data transmission or power supply, e.g. use of slip rings
• CPC Class Codes: G01K 1/12 for preventing damage due to heat overloading
• CPC Class Codes: G01R 33/3614 RF power amplifiers
• CPC Class Codes: G01R 33/3852 Gradient amplifiers; means for controlling the application of a gradient magnetic field to the sample, e.g. a gradient signal synthesizer
• CPC Class Codes: G06F 17/40 Data acquisition and logging for input to computer G06F3/00
• CPC Class Codes: G07C 3/00 Registering or indicating the condition or the working of machines or other apparatus, other than vehicles
• CPC Class Codes: G08B 21/182 Level alarms, e.g. alarms responsive to variables exceeding a threshold
• CPC Class Codes: G16H 40/40 for the management of medical equipment or devices, e.g. scheduling maintenance or upgrades
• CPC Class Codes: G16Z 99/00 Subject matter not provided for in other main groups of this subclass
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/06155 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 23/34 : Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements thermal treatment apparatus H01L21/00
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/072 : the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1203 : Rectifying Diode
• CPC Class Codes: H01L 2924/1301 : Thyristor
• CPC Class Codes: H01L 2924/1302 : GTO - Gate Turn-Off thyristor
• CPC Class Codes: H01L 2924/13033 : TRIAC - Triode for Alternating Current - A bidirectional switching device containing two thyristor structures with common gate contact
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13055 : Insulated gate bipolar transistor [IGBT]
• CPC Class Codes: H01L 2924/1306 : Field-effect transistor [FET]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3512 : Cracking
• CPC Class Codes: H02H 5/04 : responsive to abnormal temperature specially adapted for electric machines H02H7/0852
• CPC Class Codes: H05G 1/10 : Power supply arrangements for feeding the X-ray tube supply circuits with converters in general H02M; supply circuits for emitters and amplifiers H04B1/16 - H04B1/1623
• CPC Class Codes: H05G 1/54 : Protecting or lifetime predictionoverload protection combined with control H05G1/46

Abstract

A medical apparatus includes a power device, a temperature sensor, a conversion processing unit and a prediction time period calculation unit. The temperature sensor detects temperature data. The conversion processing unit refers to temperature data obtained by the temperature sensor in a table in which at least one of temperature data for inside a case covering the power device and temperature data for a wire bonded to the power device is associated with data of actually measured temperatures, and obtains at least one of the temperature data for inside the case and the temperature data for the wire. The prediction time period calculation unit calculates a prediction time period until a failure of the power device based on the obtained temperature data.

Claims

1. A medical apparatus, comprising:

an X-ray tube configured to emit an X-ray;

an X-ray high voltage apparatus configured to apply X-ray high voltage to the X-ray tube;

a power device;

a temperature sensor configured to detect a temperature while the X-ray high voltage apparatus applies the high voltage to the X-ray tube;

processing circuitry configured to

refer, using the detected temperature, to a table in which at least one of a case temperature for inside a case covering the power device and a wire temperature for a wire bonded to the power device is associated with data of actually detected temperatures, and obtain at least one of the case temperature and the wire temperature; and

calculate a prediction time period until a failure of the power device based on the obtained temperature data,

wherein the processing circuitry is further configured to

calculate a cycle count for each temperature amplitude of a plurality of temperature amplitudes using a rainflow counting algorithm that takes as the temperature amplitude a temperature change from one temperature peak value to another temperature peak value of the obtained at least one of the case temperature and the wire temperature,

calculate a cumulative damage value based on the plurality of temperature amplitudes and cycle counts corresponding to the plurality of temperature amplitudes, respectively, and

calculate the prediction time period based on the cumulative damage value.

2. The medical apparatus according to claim 1, wherein the processing circuitry is further configured to:

compare the prediction time period and a threshold value; and

output when the prediction time period is less than the threshold value, information to that effect.

3. The medical apparatus according to claim 2, wherein the processing circuitry is further configured to cause a display device to display information indicating that the prediction time period is less than the threshold value, or to transmit such information to an external apparatus through a communication line.

4. The medical apparatus according to claim 1, wherein the processing circuitry is further configured to:

compare the prediction time period and a threshold value; and

change an operating condition of the power device when the prediction time period is less than the threshold value.

5. The medical apparatus according to claim 1, wherein the processing circuitry is further configured to calculate the cumulative damage value using a rainflow-counting algorithm as the cycle counting algorithm.

6. An X-ray high voltage apparatus, comprising:

a power device;

a temperature sensor configured to detect a temperature while the X-ray high voltage apparatus applies a high voltage to an X-ray tube;

processing circuitry configured to

refer, using the detected temperature data obtained by the temperature sensor, to a table in which at least one of a case temperature for inside a case covering the power device and a wire temperature for a wire bonded to the power device is associated with data of actually detected temperatures, and obtain at least one of the case temperature and the wire temperature; and

calculate a prediction time period until a failure of the power device based on the obtained temperature data,

wherein the processing circuitry is further configured to

calculate a cycle count for each temperature amplitude of a plurality of temperature amplitudes using a rainflow counting algorithm that takes as the temperature amplitude a temperature change from one temperature peak value to another temperature peak value of the obtained at least one of the case temperature and the wire temperature,

calculate a cumulative damage value based on the plurality of temperature amplitudes and cycle counts corresponding to the plurality of temperature amplitudes, respectively and

calculate the prediction time period based on the cumulative damage value.

7. The X-ray high voltage apparatus according to claim 6, wherein the processing circuitry is further configured to:

compare the prediction time period and a threshold value; and

output when the prediction time period is less than the threshold value, information to that effect.

8. The X-ray high voltage apparatus according to claim 7, wherein

the processing circuitry is further configured to cause a display device to display information indicating that the prediction time period is less than the threshold value, or to transmit such information to an external apparatus through a communication line.

9. The X-ray high voltage apparatus according to claim 6, wherein the processing circuitry is further configured to:

compare the prediction time period and a threshold value; and

change an operating condition of the power device when the prediction time period is less than the threshold value.

10. The X-ray high voltage apparatus according to claim 6, wherein the processing circuitry is further configured to calculate the cumulative damage value using a rainflow-counting algorithm as the cycle counting algorithm.