Methods for reducing surface defects
First Claim
Patent Images
1. A method for removing a defective area in a strengthened substrate comprising:
- heating a salt bath comprising at least one monovalent salt to a temperature of from greater than or equal to 95°
C.;
contacting at least a portion of a strengthened substrate with the salt bath, wherein, before the strengthened substrate is contacted with the salt bath, the strengthened substrate has one or more non-defective areas having an average concentration of total metal monovalent cations, and at least one defective area having an average concentration of total metal monovalent cations that deviates from the average concentration of the one or more non-defective areas by greater than or equal to 10 mol %; and
removing the at least a portion of the strengthened substrate from the salt bath, wherein, after removal, the at least one defective area has an average concentration of total metal monovalent cations that deviates from the average concentration of total metal monovalent cations of the one or more non-defective areas by less than 10 mol %, and wherein the strengthened substrate has an Arithmetic Average Roughness (Ra) of greater than or equal to 0.002 μ
m before contact with the salt bath and an Ra of less than 0.002 μ
m after removal from the salt bath, as measured over an area having dimensions of 0.18 mm by 0.13 mm.
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Accused Products
Abstract
Methods for reducing a defective area in a strengthened substrate to produce a non-defective substrate are provided. The methods include contacting a strengthened defective substrate with a heated salt bath containing at least one monovalent salt, and removing the strengthened substrate from the bath. The strengthened substrate, before being contacted with the salt bath, is a defective substrate having at least one defective area and one or more non-defective area. Upon removal from the salt bath, at least one defective area has been reduced or substantially removed to produce a non-defective substrate.
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Citations
20 Claims
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1. A method for removing a defective area in a strengthened substrate comprising:
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heating a salt bath comprising at least one monovalent salt to a temperature of from greater than or equal to 95°
C.;contacting at least a portion of a strengthened substrate with the salt bath, wherein, before the strengthened substrate is contacted with the salt bath, the strengthened substrate has one or more non-defective areas having an average concentration of total metal monovalent cations, and at least one defective area having an average concentration of total metal monovalent cations that deviates from the average concentration of the one or more non-defective areas by greater than or equal to 10 mol %; and removing the at least a portion of the strengthened substrate from the salt bath, wherein, after removal, the at least one defective area has an average concentration of total metal monovalent cations that deviates from the average concentration of total metal monovalent cations of the one or more non-defective areas by less than 10 mol %, and wherein the strengthened substrate has an Arithmetic Average Roughness (Ra) of greater than or equal to 0.002 μ
m before contact with the salt bath and an Ra of less than 0.002 μ
m after removal from the salt bath, as measured over an area having dimensions of 0.18 mm by 0.13 mm. - View Dependent Claims (2, 3, 4, 5)
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6. A method for producing a non-defective ion-exchanged substrate comprising:
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heating a salt bath comprising at least one monovalent salt to a temperature of from greater than or equal to 95°
C. and less than or equal to 430°
C.;contacting at least a portion of a defective ion-exchanged substrate with the salt bath, wherein, the defective ion-exchanged substrate has an Arithmetic Average Roughness (Ra) of greater than or equal to about 0.002 μ
m, as measured over an area having dimensions of 0.18 mm by 0.13 mm; andremoving the at least a portion of the defective ion-exchanged substrate from the salt bath to produce a non-defective ion-exchanged substrate having an Ra of less than 0.002 μ
m. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method for removing a defective area in a strengthened substrate comprising:
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heating a salt bath comprising at least one monovalent salt to a temperature of from greater than or equal to 95°
C.;contacting at least a portion of a strengthened substrate with the salt bath, wherein, before the strengthened substrate is contacted with the salt bath, the strengthened substrate has one or more non-defective areas having an average concentration of total metal monovalent cations, and at least one defective area having an average concentration of total metal monovalent cations that deviates from the average concentration of the one or more non-defective areas by greater than or equal to 10 mol %; and removing the at least a portion of the strengthened substrate from the salt bath, wherein, after removal, the at least one defective area has an average concentration of total metal monovalent cations that deviates from the an average concentration of total metal monovalent cations of the one or more non-defective areas by less than 10 mol %, wherein the average concentration of the at least one defective area comprises greater than or equal to 60 mol % of a first metal monovalent cation before the strengthened substrate is contacted with the salt bath and after removing the at least a portion of the strengthened substrate from the salt bath, the average concentration of the at least one defective area comprises less than 60 mol % of the first metal monovalent cation. - View Dependent Claims (20)
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Specification