Semiconductor device and method for atomic layer deposition of a dielectric over a substrate
First Claim
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1. A method comprising:
- performing multiple cycles of an atomic layer deposition (ALD) process, wherein the performing of one cycle includes;
supplying a gas comprising SiH3N(C3H7)2 and O3 to a deposition chamber having a substrate to deposit a dielectric material over the substrate; and
supplying an O2 plasma to the deposition chamber after the supplying of the gas;
curing the deposited dielectric material using an ultra violet (UV) light; and
annealing the deposited dielectric material after the curing, wherein the annealing comprises a steam anneal process performed at a temperature below about 450°
C. and for a time interval greater than about 30 minutes.
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Abstract
A method includes performing an atomic layer deposition (ALD) process to deposit a dielectric material over a substrate, curing the deposited dielectric material using an ultra violet (UV) light, and annealing the deposited dielectric material after the curing.
9 Citations
20 Claims
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1. A method comprising:
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performing multiple cycles of an atomic layer deposition (ALD) process, wherein the performing of one cycle includes; supplying a gas comprising SiH3N(C3H7)2 and O3 to a deposition chamber having a substrate to deposit a dielectric material over the substrate; and supplying an O2 plasma to the deposition chamber after the supplying of the gas; curing the deposited dielectric material using an ultra violet (UV) light; and annealing the deposited dielectric material after the curing, wherein the annealing comprises a steam anneal process performed at a temperature below about 450°
C. and for a time interval greater than about 30 minutes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method comprising:
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filling a recess over a substrate with an insulation material using an atomic layer deposition (ALD) process comprising a first deposition cycle including; forming a first layer of the insulation material using a gas comprising SiH3N(C3H7)2 and O3; and treating the first layer using an O2 plasma; and performing a post treatment to reduce an etching rate of the insulation material, wherein the performing the post treatment comprises; curing the insulation material using an ultra violet (UV) light; and performing a steam anneal process over a time interval greater than about 30 minutes at temperatures below about 450°
C. to the insulation material after the curing. - View Dependent Claims (15, 16)
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17. A method of forming a Fin-Field Effect Transistor (FinFET) comprising:
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forming a fin protruding above a substrate; performing multiple cycles of an atomic layer deposition (ALD) process to deposit an oxide film in a recess adjacent to the fin, wherein the performing of one cycle of the ALD process comprises; supplying a gas comprising a precursor SiH3N(C3H7)2 and an oxidant O3 to a deposition chamber having the substrate to form a first layer of the oxide film; removing the gas from the deposition chamber; and performing a plasma process using an O2 plasma to treat the first layer of the oxide film; curing the oxide film using an ultra violet light; and annealing the oxide film using a steam anneal process performed at a temperature between about 350°
C. and about 450°
C. over a time interval greater than about 30 minutes. - View Dependent Claims (18, 19, 20)
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Specification