Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

• US 10,355,113 B2
• Filed: 03/29/2016
• Issued: 07/16/2019
• Est. Priority Date: 06/04/2004
• Status: Active Grant

• Current Assignee: Board of Trustees of The University of Illinois
• Original Assignee: Board of Trustees of The University of Illinois
• Inventors: Rogers, John A., Meitl, Matthew, Sun, Yugang, Ko, Heung Cho, Carlson, Andrew, Choi, Won Mook, Stoykovich, Mark, Jiang, Hanqing, Huang, Yonggang, Nuzzo, Ralph G., Zhu, Zhengtao, Menard, Etienne, Khang, Dahl-Young
• Primary Examiner(s): Phan, Thiem D
• Application Number:
  US15/084,112
• Publication Number:
  US 20160381789A1
• Time in Patent Office: 1,204 Days
• Field of Search: 29832, 29830, 29842, 29843, 29874, 29876, 29879
• CPC Class Codes: H01L 21/02422 Non-crystalline insulating materials, e.g. glass, polymers
• CPC Class Codes: H01L 21/02628 using solutions
• CPC Class Codes: H01L 21/4846 Leads on or in insulating or insulated substrates, e.g. metallisation H01L21/4821 takes precedence; metallisation of ceramics in general C04B41/51; printed circuits H05K3/00
• CPC Class Codes: H01L 21/8258 the substrate being a semiconductor, using a combination of technologies covered by H01L21/8206, H01L21/8213 , H01L21/822, H01L21/8252, H01L21/8254 or H01L21/8256
• CPC Class Codes: H01L 23/5387 Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 29/0657 characterised by the shape of the body
• CPC Class Codes: H01L 29/72 Transistor-type devices, i.e. able to continuously respond to applied control signals
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H05K 1/0283 Stretchable printed circuits
• CPC Class Codes: H05K 2201/0133 Elastomeric or compliant polymer elastomeric conductor H05K2201/0314
• CPC Class Codes: H05K 2201/09045 Locally raised area or protrusion of insulating substrate rigid curved substrate H05K2201/09018
• CPC Class Codes: H05K 2203/0271 Mechanical force other than pressure, e.g. shearing or pulling
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/22 Secondary treatment of printed circuits H05K3/1283 takes precedence; embedding circuits in grooves by pressure H05K3/107
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

In an aspect, the present invention provides stretchable, and optionally printable, components such as semiconductors and electronic circuits capable of providing good performance when stretched, compressed, flexed or otherwise deformed, and related methods of making or tuning such stretchable components. Stretchable semiconductors and electronic circuits preferred for some applications are flexible, in addition to being stretchable, and thus are capable of significant elongation, flexing, bending or other deformation along one or more axes. Further, stretchable semiconductors and electronic circuits of the present invention are adapted to a wide range of device configurations to provide fully flexible electronic and optoelectronic devices.

Claims

1. A method of making a stretchable and flexible device, the method comprising the steps of:

providing a flexible substrate having a receiving surface;

bonding a plurality of device components to said receiving surface, wherein at least one device component is connected to another device component by one or more interconnects, wherein at least two interconnects are electrically connected to a first device component; and

wherein during said bonding step said at least two interconnects extend along at least two different directions from said first device component in a plane of said receiving surface to form a two-dimensional device array;

generating a change in a level of strain to said flexible substrate receiving surface in a first direction and a second direction;

wherein said at least one device component is bonded to said flexible substrate at a first level of strain and said change in strain causes a portion of a first interconnect to bend and separate from said flexible substrate in said first direction and a portion of a second interconnect to bend and separate from said flexible substrate in a second direction;

and each of said at least two interconnects have a region that is curved and physically separated from said flexible substrate.

2. The method of claim 1, wherein said interconnect is an electrical interconnect and said at least one device component is one or more of a contact pad;

a photodiode, a light emitting diode, an electrode, a transistor, an integrated circuit, a biosensor, a chemical sensors, an accelerometer, a pressure sensor, or a transducer.

3. The method of claim 1, wherein at least one of said curved region has a separation distance from said flexible substrate that is between 100 nm and 1 mm.

4. The method of claim 1, wherein each of said at least two interconnect curved regions have a separation distance from said flexible substrate that is between 100 nm and 1 mm.

9. The method of claim 1, wherein said first device component comprises one or more materials selected from the group consisting of:

a metal, a semiconductor, an insulator, a piezoelectric material, a ferroelectric material, a magnetostrictive material, an electrostrictive material, a superconductor, a ferromagnetic material, and a thermoelectric material.

10. The method of claim 1, wherein said first device component is an electronic device, an optical device, an opto-electronic device, a mechanical device, a microelectromechanical device, a nanoelectromechanical device, a microfluidic device or a thermal device.

11. The method of claim 10, wherein said at least two interconnects are tunable device components each having at least one electronic property, optical property or mechanical property that changes selectively with a level of strain of said curved region.

12. The method of claim 1, wherein said at least two interconnects is a plurality of stretchable interconnects, and wherein at least one of said plurality of stretchable interconnects comprises said at least one contact point that is in physical communication with said flexible substrate receiving surface and three or more bent configuration regions extend from said at least one contact point.

13. The method of claim 1, wherein each of the at least two curved regions comprises a folded region, a convex region, a concave region, or any combination thereof.

14. The method of claim 1, wherein the flexible substrate comprises an elastomeric material.

15. The method of claim 1, wherein the at least one device component is a plurality of device components, and wherein the at least two interconnects is a plurality of interconnects.

16. The method of claim 15, wherein the two-dimensional device array has a grid configuration, floral configuration, bridge configuration, or any combination thereof.

17. The method of claim 15, wherein one or more of said plurality of device components is connected to adjacent device components by said plurality of interconnects.

18. The method of claim 15, wherein at least a portion of the two-dimensional device array comprises two or more of the plurality of interconnects aligned in a direction parallel to each other or two or more of the plurality of interconnects oriented in two or more different directions.

19. The method of claim 15, wherein the two-dimensional device array comprises two or more device layers, and wherein each device layer comprises a plurality of the device components and a plurality of the interconnects.

20. The method of claim 15, wherein at least a portion of the receiving surface of the flexible substrate is curved, concave, convex or hemispherical.

21. The method of claim 15, wherein the two-dimensional device array comprises one or more of a photodetector, a photodiode array, a display, a light-emitting device, a photovoltaic device, a sensor array, a sheet scanner, a LED display, a semiconductor laser array, an optical imaging system, a large-area electronic device, a transistor array, a logic gate array, a microprocessor, an integrated circuit, or any combination of thereof.

22. The method of claim 15, wherein the two-dimensional device array has a floral configuration, wherein the at least two interconnects is a plurality of interconnects, and wherein at least one of the plurality of interconnects comprises:

at least one contact point that is in physical communication with the receiving surface; and

three or more bent configuration regions extending from the at least one contact point.

23. The method of claim 1, wherein said first level of strain elongates said receiving surface, and said step of generating a change in the level of strain is an at least partial relaxation of said elongated receiving surface.

24. The method of claim 1, wherein each of said change in said level of strain in said first direction and said second direction elongates said receiving surface in said first direction and in said second direction, and said step of generating said change in the level of strain is an at least partial relaxation of said elongated receiving surface in said first direction and in said second direction.

5. The method of 1, wherein the at least two interconnects each have a first end and a second end, wherein said region that is curved and physically separated from said flexible substrate is a central portion between said first and said second ends;

wherein;

the first end of each of the at least two interconnects is in electrical communication with said first device component;

each central portion of each of the at least two interconnects comprises at least two bent configuration regions and at least one contact point disposed between the at least two bent configuration regions; and

each of the at least one contact point is in physical communication with the receiving surface of the flexible substrate.

6. The method of claim 5, wherein the at least one contact point is bonded to said flexible substrate receiving surface.

7. The method of claim 5, wherein each of the at least two interconnects further comprises one or more contact pads in electrical contact with the first end, the second end or both the first end and the second end.

8. The method of claim 7, wherein the first device component is in electrical contact with the one or more contact pads.