3D semiconductor device with stacked memory
First Claim
Patent Images
1. A 3D semiconductor device, the device comprising:
- a first level comprising a single crystal layer, a plurality of first transistors and at least one metal layer,wherein said at least one metal layer comprises interconnects between said first transistors forming memory peripheral circuits;
a second level overlaying said at least one metal layer, said second level comprising a plurality of second transistors and a plurality of first memory cells, said first memory cells each comprising at least one of said second transistors;
a third level overlaying said second level, said third level comprising a plurality of third transistors and a plurality of second memory cells, said second memory cells each comprising at least one of said third transistors;
polysilicon pillars,wherein at least one of said second transistors comprises a first channel region and at least one of said third transistors comprises a second channel region,wherein a portion of at least one of said polysilicon pillars is in direct contact with said first channel region and said second channel region,wherein said memory peripheral circuits comprise a plurality of decoders,wherein at least one of said first memory cells at least partially overlays at least one of said decoders; and
a staircase structure,wherein said staircase structure comprises a portion of connections from said memory peripheral circuits to at least one of said memory cells.
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Abstract
A semiconductor device, the device including: a first stratum including memory periphery circuits; a second stratum including an array of first memory cells, where the first stratum is overlaid by the second stratum; a third stratum including an array of second memory cells, where the second stratum is overlaid by the third stratum, where the first memory cells include a plurality of first polysilicon structures and the second memory cells include a plurality of second polysilicon structures, and where at least one of the first memory cells is self-aligned to at least one of the second memory cells.
853 Citations
20 Claims
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1. A 3D semiconductor device, the device comprising:
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a first level comprising a single crystal layer, a plurality of first transistors and at least one metal layer, wherein said at least one metal layer comprises interconnects between said first transistors forming memory peripheral circuits; a second level overlaying said at least one metal layer, said second level comprising a plurality of second transistors and a plurality of first memory cells, said first memory cells each comprising at least one of said second transistors; a third level overlaying said second level, said third level comprising a plurality of third transistors and a plurality of second memory cells, said second memory cells each comprising at least one of said third transistors; polysilicon pillars, wherein at least one of said second transistors comprises a first channel region and at least one of said third transistors comprises a second channel region, wherein a portion of at least one of said polysilicon pillars is in direct contact with said first channel region and said second channel region, wherein said memory peripheral circuits comprise a plurality of decoders, wherein at least one of said first memory cells at least partially overlays at least one of said decoders; and a staircase structure, wherein said staircase structure comprises a portion of connections from said memory peripheral circuits to at least one of said memory cells. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A 3D semiconductor device, the device comprising:
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a first level comprising a single crystal layer, a plurality of first transistors and at least one metal layer, wherein said at least one metal layer comprises interconnects between said first transistors forming memory peripheral circuits; a second level overlaying said at least one metal layer, said second level comprising a plurality of second transistors and a plurality of first memory cells, said first memory cells each comprising at least one of said second transistors; a third level overlaying said second level, said third level comprising a plurality of third transistors and a plurality of second memory cells, said second memory cells each comprising at least one of said third transistors; and polysilicon pillars, wherein at least one of said second transistors comprises a first channel region and at least one of said third transistors comprises a second channel region, wherein a portion of at least one of said polysilicon pillars is in direct contact with said first channel region and said second channel region, wherein said memory peripheral circuits comprise a plurality of decoders, and wherein at least one of said first memory cells at least partially overlays at least one of said decoders. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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15. A 3D semiconductor device, the device comprising:
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a first level comprising a single crystal layer, a plurality of first transistors and at least one metal layer, wherein said at least one metal layer comprises interconnects between said first transistors forming memory peripheral circuits; a second level overlaying said at least one metal layer, said second level comprising a plurality of second transistors and a plurality of first memory cells, said first memory cells each comprising at least one of said second transistors; a third level overlaying said second level, said third level comprising a plurality of third transistors and a plurality of second memory cells, said second memory cells each comprising at least one of said third transistors; and polysilicon pillars, wherein at least one of said second transistors comprises a first channel region and at least one of said third transistors comprises a second channel region, and wherein a portion of at least one of said polysilicon pillars is in direct contact with said first channel region and said second channel region. - View Dependent Claims (16, 17, 18, 19, 20)
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Specification