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Method for manufacturing light emitting device

  • US 10,355,173 B2
  • Filed: 12/11/2017
  • Issued: 07/16/2019
  • Est. Priority Date: 06/18/2013
  • Status: Active Grant
First Claim
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1. A method for manufacturing a light emitting device comprising:

  • integrally molding a package and a lead, the package forming at least part of an inner peripheral face of a recess portion in which a light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material;

    covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation properties; and

    forming a plurality of microcracks in the cover film after the covering of the inner peripheral face with the cover film, the plurality of microcracks penetrating through the cover film and being generated by the particles tearing the cover film.

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