Method for manufacturing light emitting device

• US 10,355,173 B2
• Filed: 12/11/2017
• Issued: 07/16/2019
• Est. Priority Date: 06/18/2013
• Status: Active Grant

• Current Assignee: Nichia Corporation
• Original Assignee: Nichia Corporation
• Inventors: Oshima, Yukiko, Sato, Yoshiki, Okazaki, Toshiyuki, Wakaki, Takayoshi
• Primary Examiner(s): Campbell, Shaun M
• Application Number:
  US15/837,434
• Publication Number:
  US 20180108813A1
• Time in Patent Office: 582 Days
• Field of Search: None
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 33/44 characterised by the coatings, e.g. passivation layer or anti-reflective coating
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

A method for manufacturing a light emitting device includes: integrally molding a package and a lead, the package arranged to form at least part of an inner peripheral face of a recess portion in which the light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material; and covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation.

Claims

1. A method for manufacturing a light emitting device comprising:

integrally molding a package and a lead, the package forming at least part of an inner peripheral face of a recess portion in which a light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material;

covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation properties; and

forming a plurality of microcracks in the cover film after the covering of the inner peripheral face with the cover film, the plurality of microcracks penetrating through the cover film and being generated by the particles tearing the cover film.

2. The method for manufacturing a light emitting device according to claim 1, wherein

the covering of the inner peripheral face includes forming the cover film by atomic layer deposition.

3. The method for manufacturing a light emitting device according to claim 1, wherein

the covering of the inner peripheral face includes covering a surface of the lead with the cover film.

4. The method for manufacturing a light emitting device according to claim 1, wherein

the forming of the microcracks includes heating or cooling the package.

5. A method for manufacturing a light emitting device comprising:

integrally molding a package and a lead, the package forming at least part of an inner peripheral face of a recess portion in which a light emitting element is housed, the package including a base material and a plurality of particles, the base material including a resin, a coefficient of thermal expansion of the particles being different from a coefficient of thermal expansion of the base material;

covering the inner peripheral face of the recess portion with a cover film, the cover film having light transmissive and electrical insulation properties; and

heating or cooling the package so as to reduce a thickness of the cover film over the particles such that a distance between an upper surface of the particles and an upper surface of a portion of the cover film over the particles is smaller than a distance between an upper surface of the base material and an upper surface of other portion of the cover film.