Flip chip integration on qubit chips
First Claim
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1. A method for forming a quantum bit (qubit) flip-chip assembly, the method comprising:
- forming a qubit on a first chip;
forming an optically transmissive path in a second chip; and
bonding the first chip to the second chip; and
wherein the optically transmissive path is located above the qubit.
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Abstract
A quantum bit (qubit) flip chip assembly may be formed when a qubit it formed on a first chip and an optically transmissive path is formed on a second chip. The two chips may be bonded using solder bumps. The optically transmissive path may provide optical access to the qubit on the first chip.
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Citations
20 Claims
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1. A method for forming a quantum bit (qubit) flip-chip assembly, the method comprising:
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forming a qubit on a first chip; forming an optically transmissive path in a second chip; and bonding the first chip to the second chip; and wherein the optically transmissive path is located above the qubit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A flip chip apparatus comprising:
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a first chip comprising a qubit; a second chip bonded to the first chip, wherein the first chip and the second chip are bonded by a plurality of solder bumps; and wherein an optically transmissive path in the second chip provides for optical access to the qubit on the first chip. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification