Antenna-like matching component

• US 10,355,363 B2
• Filed: 01/04/2018
• Issued: 07/16/2019
• Est. Priority Date: 03/14/2013
• Status: Active Grant

• Current Assignee: Kyocera AVX Components San Diego Inc (Kyocera Corporation)
• Original Assignee: Ethertronics, Inc. (Kyocera Corporation)
• Inventors: Pajona, Olivier, Rowson, Sebastian, Desclos, Laurent
• Primary Examiner(s): Levi, Dameon E
• Assistant Examiner(s): Islam, Hasan Z
• Application Number:
  US15/862,553
• Publication Number:
  US 20180131097A1
• Time in Patent Office: 558 Days
• Field of Search: 343702, 343745, 343749-752, 343850-853, 343860-862
• CPC Class Codes: H01Q 1/52 Means for reducing coupling between antennas; Means for reducing coupling between an antenna and another structure absorbing means H01Q17/00
• CPC Class Codes: H01Q 5/50 Feeding or matching arrangements for broad-band or multi-band operation
• CPC Class Codes: H01Q 9/36 with top loading

Abstract

An antenna-like matching component is provided, comprising one or more conductive portions formed on a substrate. Shapes and dimensions of the one or more conductive portions are determined to provide impedance matching for one or more antennas coupled to the matching component.

Claims

1. A matching component comprising:

a substrate; and

conductive patches formed on the substrate, the conductive patches comprising driving elements and parasitic elements;

wherein the conductive patches of the matching component provide impedance matching for two different antennas that are separate from the conductive patches of the matching component and coupled to the matching component;

wherein the conductive patches further include one or more inductive elements, each of which is connected to a pair of driving elements coupled to the two different antennas, respectively, to increase isolation between the two different antennas.

2. The matching component of claim 1, wherein at least one of the parasitic elements is coupled to a circuit block to facilitate impedance matching.

3. The matching component of claim 1, wherein the substrate is a single-layer substrate.

4. The matching component of claim 1, wherein the substrate is a multi-layer substrate.

5. The matching component of claim 1, wherein at least one of the conductive patches comprises an L-shaped arm.

6. The matching component of claim 5, wherein the L-shaped arm is coupled to a circuit block to facilitate impedance matching.

7. An antenna system comprising:

a front end module;

at least one RF path coupling the front end module with two different antennas;

a matching component coupled with the at least one RF path and configured to provide impedance matching for the two different antennas, the matching component comprising;

a substrate; and

conductive patches formed on the substrate, the conductive patches comprising driving elements and parasitic elements;

wherein the conductive patches further include one or more inductive elements, each of which is connected to a pair of driving elements coupled to the two different antennas, respectively, to increase isolation between the two different antennas.

8. A matching component comprising:

a substrate having a top surface, a side surface, and a bottom surface opposite the top surface;

conductive patches formed on the substrate, the conductive patches at least partially formed on the top surface of the substrate; and

at least one solder pad disposed on the bottom surface of the substrate;

wherein the conductive patches comprise driving elements and parasitic elements;

wherein the conductive patches provide impedance matching for two different antennas coupled to the matching component; and

wherein at least one of the conductive patches is formed at least partially on the side surface of the substrate and extends from the top surface to the bottom surface to electrically connect the at least one of the conductive patches that is formed on the top surface with the at least one solder pad disposed on the bottom surface of the substrate.

9. The matching component of claim 8, wherein at least one of the parasitic elements is coupled to a circuit block to facilitate impedance matching.

10. The matching component of claim 8, wherein at least one of the conductive patches comprises an L-shaped arm.

11. The matching component of claim 10, wherein the L-shaped arm is coupled to a circuit block to facilitate impedance matching.