Integrated circuits having shielded MEMS devices and methods for fabricating shielded MEMS devices
First Claim
1. An integrated circuit having a shielded MEMS device comprising:
- a substrate;
a ground plane including conductive material over the substrate;
a dielectric layer over the ground plane;
a MEMS device over the ground plane;
a first conductive pillar through the dielectric layer and in contact with the ground plane;
a second conductive pillar through the dielectric layer and in contact with the ground plane, wherein the MEMS device is located between the first conducive pillar and the second conductive pillar;
a metallic film over the MEMS device and in contact with the first and second conductive pillars, wherein the metallic film, first and second conductive pillars and the ground plane form an electromagnetic shielding structure surrounding the MEMS device; and
an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure.
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Accused Products
Abstract
Integrated circuits having shielded micro-electromechanical system (MEMS) devices and method for fabricating shielded MEMS devices are provided. In an example, an integrated circuit having a shielded MEMS device includes a substrate, a ground plane including conductive material over the substrate, and a dielectric layer over the ground plane. The integrated circuit further includes a MEMS device over the ground plane. Also, the integrated circuit includes a conductive pillar through the dielectric layer and in contact with the ground plane. The integrated circuit includes a metallic thin film over the MEMS device and in contact with the conductive pillar, wherein the metallic thin film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device. Further, the integrated circuit includes an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure.
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Citations
20 Claims
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1. An integrated circuit having a shielded MEMS device comprising:
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a substrate; a ground plane including conductive material over the substrate; a dielectric layer over the ground plane; a MEMS device over the ground plane; a first conductive pillar through the dielectric layer and in contact with the ground plane; a second conductive pillar through the dielectric layer and in contact with the ground plane, wherein the MEMS device is located between the first conducive pillar and the second conductive pillar; a metallic film over the MEMS device and in contact with the first and second conductive pillars, wherein the metallic film, first and second conductive pillars and the ground plane form an electromagnetic shielding structure surrounding the MEMS device; and an acoustic shielding structure over the substrate and adjacent the electromagnetic shielding structure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. An integrated circuit having a shielded MEMS device comprising:
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a substrate; a ground plane including conductive material over the substrate; a dielectric layer over the ground plane; a MEMS device over the ground plane and having a footprint; and an acoustic shielding structure formed from a dielectric material patterned to form a periodic structure overlying the dielectric layer outside the footprint. - View Dependent Claims (10, 11)
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12. A method for fabricating a shielded MEMS device, the method comprising:
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providing a substrate; forming a ground plane including conductive material over the substrate; depositing a MEMS device layer over the substrate and forming a MEMS device over the ground plane; forming a first conductive pillar in contact with the ground plane; depositing a metallic film over the MEMS device and in contact with the first conductive pillar, wherein the metallic film, the conductive pillar and the ground plane form an electromagnetic shielding structure surrounding the MEMS device; and forming a seal ring by; forming a seal ring conductive pillar in electrical connection with the ground plane; and forming a conductive material in the MEMS device layer, in electrical connection with the seal ring conductive pillar, and adjacent the electromagnetic shielding structure. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification