Strategic placement of plastic structures for EMI management of transceiver module
First Claim
Patent Images
1. An optoelectronic module comprising:
- a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers;
a printed circuit board (“
PCB”
) within the housing that includes an electrical connector at the second end portion of the housing;
at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers;
at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB and optically coupled with at least another one of the one or more optical fibers;
at least one electromagnetic interference (“
EMI”
) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module and wherein the EMI attenuating component is selected from a group consisting of;
a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement;
a three-dimensional EMI absorber including a first portion defining a first plane extending transverse to the longitudinal axis of the housing and positioned between the PCB and one or both of a transmitter optical subassembly (“
TOSA”
) and a receiver optical subassembly (“
ROSA”
), and a second portion defining a second plane extending transverse to the first plane and parallel to the longitudinal axis of the housing, wherein the second portion is positioned between the housing and the TOSA or the ROSA.
5 Assignments
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Accused Products
Abstract
An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (“PCB”) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (“EMI”) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.
8 Citations
10 Claims
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1. An optoelectronic module comprising:
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a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers; a printed circuit board (“
PCB”
) within the housing that includes an electrical connector at the second end portion of the housing;at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers; at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB and optically coupled with at least another one of the one or more optical fibers; at least one electromagnetic interference (“
EMI”
) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module and wherein the EMI attenuating component is selected from a group consisting of;a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement; a three-dimensional EMI absorber including a first portion defining a first plane extending transverse to the longitudinal axis of the housing and positioned between the PCB and one or both of a transmitter optical subassembly (“
TOSA”
) and a receiver optical subassembly (“
ROSA”
), and a second portion defining a second plane extending transverse to the first plane and parallel to the longitudinal axis of the housing, wherein the second portion is positioned between the housing and the TOSA or the ROSA. - View Dependent Claims (2, 3, 4)
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5. A method comprising:
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forcing a molten plastic material that includes nickel-coated carbon fiber or electrically conductive filler into a mold cavity of a mold; solidifying the molten plastic material that includes the nickel-coated carbon fiber or electrically conductive filler into a shape that conforms to a contour of the mold to form a component of an optoelectronic module from the plastic material that includes the nickel-coated carbon fiber or electrically conductive filler, wherein the component comprises an electromagnetic interference (“
EMI”
) attenuating component selected from a group consisting of;a PCB spacer, wherein the PCB spacer is positioned between the PCB and a second PCB in a double-deck PCB arrangement; a three-dimensional EMI absorber including a first portion defining a first plane extending transverse to the longitudinal axis of the housing and positioned between the PCB and one or both of a transmitter optical subassembly (“
TOSA”
) and a receiver optical subassembly (“
ROSA”
), and a second portion defining a second plane extending transverse to the first plane and parallel to the longitudinal axis of the housing, wherein the second portion is positioned between the housing and the TOSA or the ROSA. - View Dependent Claims (6, 7, 8, 9)
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10. An optoelectronic module comprising:
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a housing that extends along a longitudinal axis between a first end portion and a second end portion, the first end portion configured to interface with at least one fiber optic cable including one or more optical fibers; a printed circuit board (“
PCB”
) within the housing that includes an electrical connector at the second end portion of the housing;at least one transmitter positioned inside of the housing, the transmitter electrically coupled to the PCB and optically coupled with at least one of the one or more optical fibers; at least one receiver positioned inside of the housing, the receiver electrically coupled to the PCB and optically coupled with at least another one of the one or more optical fibers; at least one electromagnetic interference (“
EMI”
) attenuating component formed of a plastic material that is configured to attenuate EMI, wherein the at least one EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module, the EMI attenuating comprising;a fiber tray supporting one or more internal optical cables positioned inside of the housing.
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Specification
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Current AssigneeII-VI Delaware, Inc. (Coherent Corp.)
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Original AssigneeFinisar Corporation (II-VI Incorporated)
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InventorsTeo, Tat Ming, Hsieh, John, Wang, William H., Liu, Jinxiang, Wee, Hon Siu, Chiang, Troy Wy Piew
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Primary Examiner(s)Mooney, Michael P
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Application NumberUS14/873,743Publication NumberTime in Patent Office1,390 DaysField of Search385 88- 94, 385134-139US Class CurrentCPC Class CodesG02B 6/3874 using tubes, sleeves to ali...G02B 6/423 using guiding surfaces for ...G02B 6/4246 Bidirectionally operating p...G02B 6/4255 Moulded or casted packagesG02B 6/4277 Protection against electrom...G02B 6/428 containing printed circuit ...G02B 6/4284 of optical modules with dis...G02B 6/4292 the light guide being disco...H05K 1/0216 Reduction of cross-talk, no...H05K 1/0274 Optical details, e.g. print...H05K 2201/10121 Optical component, e.g. opt...H05K 7/1427 HousingsH05K 9/0058 specially adapted for optoe...
