Electronic/photonic chip integration and bonding
First Claim
1. An optical waveguide device comprising:
- one or more photonic chips, the one or more photonic chips including;
a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and
a second portion of a photonic chip comprising;
an array of second components each having an electrical input and an optical output, anda plurality of output waveguides each connected to the optical output of a respective second component,the second components and the output waveguides being within one plane parallel to a surface of the second portion of a photonic chip;
the optical waveguide device further comprising an integrated circuit, the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components;
wherein the second components are modulators, each having an input waveguide and an output waveguide, there being an electrical path from a first one of the first components to a first modulator of the modulators andwherein the electrical path extends over;
a second modulator of the modulators, different from the first modulator;
orthe input waveguide of the second modulator;
orthe output waveguide of the second modulator.
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Accused Products
Abstract
An optical waveguide device comprising: one or more photonic chips, the one or more photonic chips including: a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising an array of second components, each of the second components configured to receive an electrical input; the optical waveguide device further comprising: an integrated circuit; the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the integrated circuit is directly mounted onto the one or more photonic chips; and/or wherein the integrated circuit is located between the first portion of a photonic chip and the second portion of a photonic chip.
33 Citations
20 Claims
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1. An optical waveguide device comprising:
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one or more photonic chips, the one or more photonic chips including; a first portion of a photonic chip comprising an array of first components, each of the first components having an optical input and an electrical output; and a second portion of a photonic chip comprising; an array of second components each having an electrical input and an optical output, and a plurality of output waveguides each connected to the optical output of a respective second component, the second components and the output waveguides being within one plane parallel to a surface of the second portion of a photonic chip; the optical waveguide device further comprising an integrated circuit, the integrated circuit forming an electrical bridge between the electrical outputs of the first components and respective electrical inputs of the second components; wherein the second components are modulators, each having an input waveguide and an output waveguide, there being an electrical path from a first one of the first components to a first modulator of the modulators and wherein the electrical path extends over; a second modulator of the modulators, different from the first modulator;
orthe input waveguide of the second modulator;
orthe output waveguide of the second modulator. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification