OLED device encapsulating method and structure, OLED device, and display screen
First Claim
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1. An organic light emitting diode (OLED) device encapsulating structure configured to encapsulate an OLED, comprising:
- a substrate;
a barrier layer formed on the substrate;
a surface active layer disposed on the barrier layer;
a buffer layer stacked on the surface active layer, an orthogonal projection of the buffer layer onto the barrier layer coinciding with that of the surface active layer onto the barrier layer; and
a composite layer stacked on the buffer layer;
wherein the surface active layer is sandwiched between and in direct contact with the barrier layer and the buffer layer and the surface active layer is a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween.
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Abstract
An OLED device encapsulating structure used to encapsulate an OLED is disclosed. The OLED device encapsulating structure includes a substrate, a barrier layer formed on the substrate, a surface active layer disposed on the barrier layer, and a buffer layer stacked on the surface active layer. An orthogonal projection of the buffer layer onto the barrier layer may coincide with that of the surface active layer onto the barrier layer. A composite layer may further be stacked on the buffer layer. An OLED device and a display screen are also disclosed.
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Citations
14 Claims
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1. An organic light emitting diode (OLED) device encapsulating structure configured to encapsulate an OLED, comprising:
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a substrate; a barrier layer formed on the substrate; a surface active layer disposed on the barrier layer; a buffer layer stacked on the surface active layer, an orthogonal projection of the buffer layer onto the barrier layer coinciding with that of the surface active layer onto the barrier layer; and a composite layer stacked on the buffer layer; wherein the surface active layer is sandwiched between and in direct contact with the barrier layer and the buffer layer and the surface active layer is a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween. - View Dependent Claims (2, 3, 4, 12, 13, 14)
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5. An organic light emitting diode (OLED) device comprising an OLED device encapsulating structure, the OLED device encapsulating structure being configured to encapsulate an OLED and comprising:
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a substrate; a barrier layer formed on the substrate; a surface active layer disposed on the barrier layer; a buffer layer stacked on the surface active layer, an orthogonal projection of the buffer layer onto the barrier layer coinciding with that of the surface active layer onto the barrier layer; and a composite layer stacked on the buffer layer; wherein the surface active layer is sandwiched between and in direct contact with the barrier layer and the buffer layer and the surface active layer is a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween. - View Dependent Claims (6, 7, 8, 9, 10, 11)
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Specification