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OLED device encapsulating method and structure, OLED device, and display screen

  • US 10,361,394 B2
  • Filed: 07/26/2017
  • Issued: 07/23/2019
  • Est. Priority Date: 06/20/2017
  • Status: Active Grant
First Claim
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1. An organic light emitting diode (OLED) device encapsulating structure configured to encapsulate an OLED, comprising:

  • a substrate;

    a barrier layer formed on the substrate;

    a surface active layer disposed on the barrier layer;

    a buffer layer stacked on the surface active layer, an orthogonal projection of the buffer layer onto the barrier layer coinciding with that of the surface active layer onto the barrier layer; and

    a composite layer stacked on the buffer layer;

    wherein the surface active layer is sandwiched between and in direct contact with the barrier layer and the buffer layer and the surface active layer is a material that creates a hydrogen bond with a material of the buffer layer to enhance bonding therebetween.

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