Spinal implant system and method

• US 10,362,982 B2
• Filed: 04/28/2017
• Issued: 07/30/2019
• Est. Priority Date: 04/28/2017
• Status: Active Grant

• Current Assignee: Warsaw Orthopedic
• Original Assignee: Warsaw Orthopedic Incorporated (Medtronic Plc)
• Inventors: Stevenson, Tyler S., Benson, Nicholas M., Metcalf, Jr., Newton H., Taylor, Harold S., Brown, Richard L.
• Primary Examiner(s): Philogene, Pedro
• Application Number:
  US15/582,055
• Publication Number:
  US 20180310964A1
• Time in Patent Office: 823 Days
• Field of Search: 606246-279
• CPC Class Codes: A61B 17/7032 Screws or hooks with U-shaped head or back through which longitudinal rods pass
• CPC Class Codes: A61B 17/7049 Connectors, not bearing on the vertebrae, for linking longitudinal elements together A61B17/7055, A61B17/7053, A61B17/7019 take precedence
• CPC Class Codes: A61B 2017/00212 using remote controls
• CPC Class Codes: A61B 5/0538 invasively, e.g. using a catheter
• CPC Class Codes: A61B 5/076 Permanent implantations telemetry using implanted circuitry A61B5/0031; implanted stimulators for therapy A61N1/3605, A61N1/362, A61N1/372
• CPC Class Codes: A61B 5/407 Evaluating the spinal cord A61B5/4896 takes precedence
• CPC Class Codes: A61B 5/6867 specially adapted to be attached or implanted in a specific body part A61B5/6847 takes precedence
• CPC Class Codes: A61B 5/6877 Nerve
• CPC Class Codes: A61B 5/6878 Bone
• CPC Class Codes: A61B 5/6882 Anchoring means
• CPC Class Codes: A61F 2/4455 for the fusion of spinal bodies, e.g. intervertebral fusion of adjacent spinal bodies, e.g. fusion cages intervertebral discs A61F2/442
• CPC Class Codes: A61F 2002/2821 Bone stimulation by electromagnetic fields or electric current for enhancing ossification
• CPC Class Codes: A61F 2002/285 Fixation appliances for attaching bone substitute support means to underlying bone
• CPC Class Codes: A61N 1/0558 Anchoring or fixation means therefor
• CPC Class Codes: A61N 1/326 for promoting growth of cells, e.g. bone cells
• CPC Class Codes: A61N 1/3614 based on impedance measurement
• CPC Class Codes: A61N 1/3787 from an external energy source

Abstract

A spinal implant includes a link having a first surface and a second surface connectable with a spinal construct. The spinal construct is attachable with one or more vertebral levels. A plurality of electrodes includes at least one electrode disposed with the first surface and at least one electrode disposed with the second surface such that the electrodes conduct an electric current to stimulate tissue growth adjacent the spinal construct. Systems, surgical instruments and methods are disclosed.

Claims

1. A spinal implant system comprising:

a link including a first surface and a second surface connectable with a spinal construct, the spinal construct being attachable with one or more vertebral levels, the link extending between a first end and an opposite second end, the second end being integrally formed with the first end, the first end and the second end each comprising an attachment mechanism configured to matingly engage the spinal construct;

a plurality of electrodes including at least one electrode disposed with the first surface and at least one electrode disposed with the second surface, the electrodes being configured to conduct an electric current to stimulate tissue growth adjacent the spinal construct; and

a spinal implant,

wherein the link is configured to act as a power hub to the spinal implant to allow the spinal implant to apply electrical stimulation.

2. A spinal implant system as recited in claim 1, wherein the first surface includes an anode and the second surface includes a cathode, the anode being electrically isolated from the cathode and disposed to conduct an electric current to stimulate tissue growth adjacent the spinal construct.

3. A spinal implant system as recited in claim 1, wherein the link includes a transverse connector connecting the first end with the second end.

4. A spinal implant system as recited in claim 1, wherein each attachment mechanism comprises a hook.

5. A spinal implant system as recited in claim 1, wherein the attachment mechanism of the first end includes a first hook engageable with a first spinal rod of the spinal construct and the attachment mechanism of the second end includes a second hook engageable with a second spinal rod of the spinal construct.

6. A spinal implant system as recited in claim 1, wherein the link includes a transverse connector connecting the first end with the second end, the at least one electrode of the first surface being centrally disposed with the connector.

7. A spinal implant system as recited in claim 1, wherein the link includes at least one diagnostic sensor in communication with at least one diagnostic sensor of the spinal implant to measure diagnostic conditions of the one or more vertebral levels.

8. A spinal implant system as recited in claim 1, wherein the at least one electrode of the second surface is oriented to face the one or more vertebral levels.

9. A spinal implant system as recited in claim 1, wherein the at least one electrode of the second surface is disposed with the ends.

10. A spinal implant system as recited in claim 1, wherein the electrodes are disposed in a selected configuration relative to the spinal construct to conduct the electric current through the spinal construct including at least one bone fastener.

11. A spinal implant system as recited in claim 1, wherein the link includes an integrated circuit for wireless communication with an external power source.

12. A spinal implant system as recited in claim 1, wherein the link includes an integrated circuit for wireless communication with the spinal construct.

13. A spinal implant system as recited in claim 1, wherein the link includes at least one diagnostic sensor configured to communicate with at least one diagnostic sensor disposed with the spinal construct.

14. A spinal implant system comprising:

a spinal construct comprising;

a first spinal rod configured to be attached with a plurality of vertebral levels via a plurality of bone fasteners, and

a second spinal rod configured to be attached with the plurality of vertebral levels via a plurality of bone fasteners, the spinal rods being configured for disposal in a bi-lateral orientation with the vertebral levels, and

a transverse connector extending between a first end connected with the first spinal rod and a second end connected with the second spinal rod, the second end being integrally formed with the first end, the connector including an anode and a cathode, the anode and the cathode being electrically isolated and oriented to conduct an electric current through the rods and fasteners to stimulate tissue growth; and

a spinal implant,

wherein the connector is configured to act as a power hub to the spinal implant to allow the spinal implant to apply electrical stimulation.

15. A spinal implant system as recited in claim 14, wherein the first end includes an attachment mechanism including a portion of the cathode engageable with the first spinal rod and the second end includes an attachment mechanism including a portion of the cathode engageable with the second spinal rod.

16. A spinal implant system as recited in claim 14, wherein the connector includes an integrated circuit for wireless communication with an external power source.

17. A spinal implant system comprising:

a spinal construct attachable with one or more vertebral levels;

a link connected with the spinal construct and including an anode and a cathode, the electrode and the cathode being electrically isolated and oriented to conduct electric current in a bone growth stimulation path adjacent the spinal construct, the link extending between a first end and an opposite second end, the second end being integrally formed with the first end, the first end and the second end each comprising an attachment mechanism configured to matingly engage the spinal construct; and

an interbody implant configured to be disposed with the one or more vertebral levels, the interbody implant comprising a sensor configured to communicate with the link,

wherein the link is configured to act as a power hub to the interbody implant to allow the interbody implant to apply electrical stimulation.

18. A spinal implant system as recited in claim 17, wherein the link includes an integrated circuit for wireless communication with an external power source.

19. A spinal implant system as recited in claim 17, wherein the link includes an integrated circuit for wireless communication with the spinal construct.

20. A spinal implant system as recited in claim 17, wherein the link communicates with the interbody implant.