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Electronics cooling with multi-phase heat exchange and heat spreader

  • US 10,365,047 B2
  • Filed: 04/26/2017
  • Issued: 07/30/2019
  • Est. Priority Date: 06/21/2016
  • Status: Active Grant
First Claim
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1. A system for cooling a surface comprising:

  • a housing comprising;

    an evaporator portion; and

    a multi-domain heat exchanger having at least one trifurcated heat exchange portion comprising an array of unit cells defining a plurality of nested trifurcated domains, the array of unit cells of the multi-domain heat exchanger comprising;

    a first structure comprising a trifurcated condenser portion, the trifurcated condenser portion coupled to the evaporator portion;

    a second structure comprising a trifurcated coolant portion, the trifurcated coolant portion substantially surrounded by the trifurcated condenser portion; and

    a trifurcated phase change material portion substantially surrounding the trifurcated condenser portion, the trifurcated phase change material portion configured to receive a phase change material.

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