Microchannel heat exchanger

• US 10,365,051 B2
• Filed: 08/19/2016
• Issued: 07/30/2019
• Est. Priority Date: 09/09/2015
• Status: Active Grant

• Current Assignee: Fujitsu General Company Limited (Fujifilm Holdings Corporation)
• Original Assignee: Fujitsu General Company Limited (Fujifilm Holdings Corporation)
• Inventors: Wang, Kaijian
• Primary Examiner(s): Flanigan, Allen J
• Application Number:
  US15/758,542
• Publication Number:
  US 20180259273A1
• Time in Patent Office: 1,075 Days
• Field of Search: 165 111, 165288, 165292, 165293
• CPC Class Codes: F25B 49/02 for compression type machines, plants or systems
• CPC Class Codes: F28D 2021/0029 Heat sinks
• CPC Class Codes: F28D 9/0037 the conduits for the other heat-exchange medium also being formed by paired plates touching each other F28D9/0043 takes precedence
• CPC Class Codes: F28D 9/0062 the conduits for one heat-exchange medium being formed by spaced plates with inserted elements F28D9/0012, F28D9/0025, F28D9/0081, F28D9/04 take precedence
• CPC Class Codes: F28F 13/08 by varying the cross-section of the flow channels
• CPC Class Codes: F28F 13/12 by creating turbulence, e.g. by stirring, by increasing the force of circulation F28F13/08 takes precedence
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 27/00 Control arrangements or safety devices specially adapted for heat-exchange or heat-transfer apparatus control arrangements in general G05
• CPC Class Codes: F28F 3/04 the means being integral with the element
• CPC Class Codes: F28F 3/086 having one or more openings therein forming tubular heat-exchange passages
• CPC Class Codes: F28F 9/0263 by varying the geometry or cross-section of header box
• CPC Class Codes: F28F 9/028 by using inserts for modifying the pattern of flow inside the header box, e.g. by using flow restrictors or permeable bodies or blocks with channels
• CPC Class Codes: F28F 9/0282 by varying the geometry of conduit ends, e.g. by using inserts or attachments for modifying the pattern of flow at the conduit inlet or outlet
• CPC Class Codes: G01K 1/024 for remote indication
• CPC Class Codes: G01K 1/14 Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
• CPC Class Codes: G01K 13/02 for measuring temperature of moving fluids or granular materials capable of flow

Abstract

This microchannel heat exchanger includes: a heat exchanger body including a channel layer stack formed in such a manner that a plurality of high-temperature channel layers provided with a channel for a high-temperature fluid and a plurality of low-temperature channels layers provided with a channel for a low-temperature fluid are alternately stacked, an inlet and an outlet for the high-temperature fluid, and an inlet and an outlet for the low-temperature fluid; and a control board that is fixed in a stacking direction of the heat exchanger body, and that at least installs a plurality of temperature sensors that are inserted in the stacking method of the heat exchanger body in such a manner that a sensing point is arranged near each of the inlet and the outlet for the high-temperature fluid and the inlet and the outlet for the low-temperature fluid.

Claims

1. A microchannel heat exchanger, comprising:

a microchannel heat exchanger body including a channel layer stack formed in such a manner that a plurality of high-temperature channel layers provided with a channel for a high-temperature fluid and a plurality of low-temperature channel layers provided with a channel for a low-temperature fluid are alternately stacked, an inlet and an outlet for the high-temperature fluid, and an inlet and an outlet for the low-temperature fluid; and

a printed circuit board that is fixed to a surface of the microchannel heat exchanger body, and that has installed thereon at least a plurality of temperature sensors that are mounted on a surface of the printed circuit board and inserted in a stacking direction of the heat exchanger body in such a manner that each sensing point of the plurality of temperature sensors is arranged to be in direct contact with fluid near each of the inlet and the outlet for the high-temperature fluid and the inlet and the outlet for the low-temperature fluid.

2. The microchannel heat exchanger according to claim 1, characterized in that

a display device that displays temperature data is installed in the printed circuit board.

3. The microchannel heat exchanger according to claim 1, wherein

a transmission device that wiredly or wirelessly sends temperature data to an external device is installed in the printed circuit board.

4. The microchannel heat exchanger according to claim 1, further comprising:

a heater in the printed circuit board, the heater being arranged near the channel for the low-temperature fluid of the microchannel heat exchanger body.

5. The microchannel heat exchanger according to claim 1, further comprising:

a flow adjustment ring disposed near each of the inlet and the outlet of the high-temperature fluid and the inlet and the outlet of the low-temperature fluid so that the temperature of fluid that flows in or flows out of the inlet or the outlet of the heat exchanger body can be correctly measured without being influenced by a velocity boundary layer and a temperature boundary layer.