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System reliability and operating life enhancement in field through thermal profiling

  • US 10,365,643 B2
  • Filed: 12/19/2016
  • Issued: 07/30/2019
  • Est. Priority Date: 12/19/2016
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a processing device;

    a rack; and

    a plurality of input/output module (IOM) configured to interface with a field device in an industrial process control and automation system,wherein each IOM of the plurality of IOMs comprises;

    a terminal block including a plurality of inputs or outputs, each of the inputs or outputs configured to send and receive signals to and from the field device;

    a plurality of temperature sensors, each of the plurality of temperature sensors configured to measure a temperature in the vicinity of the temperature sensor within each IOM;

    a connector configured to transmit the temperature measured by each of the plurality of temperature sensors to the processing device,wherein the processing device compares each of the plurality of measured temperatures to a threshold,wherein the plurality of temperature sensors are positioned evenly across a field side of the IOM and the temperature measured evenly across the rack where the plurality of IOMs are positioned, andwherein the rack is configured to mount each of the plurality of IOMs, and the processing device.

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