Method of manufacturing winged coil structure

• US 10,366,822 B2
• Filed: 02/20/2019
• Issued: 07/30/2019
• Est. Priority Date: 10/08/2015
• Status: Active Grant

• Current Assignee: Kinsus Interconnect Technology Corporation
• Original Assignee: Kinsus Interconnect Technology Corporation
• Inventors: Lin, Ting-Hao, Chang, Chiao-Cheng, Lin, Yi-Nong
• Primary Examiner(s): Hinson, Ronald
• Application Number:
  US16/280,435
• Publication Number:
  US 20190180919A1
• Time in Patent Office: 160 Days
• Field of Search: 336200, 336223, 336232, 296021
• CPC Class Codes: H01F 2027/2809 on stacked layers
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H05K 1/00 Printed circuits
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 3/00 Apparatus or processes for manufacturing printed circuits
• CPC Class Codes: H05K 3/4635 laminating flexible circuit boards using additional insulating adhesive materials between the boards

Abstract

A method of manufacturing a winged coil structure is provided. The method includes preparing an upper flexible plate having a middle region and two side regions bordering the middle region; preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate; preparing a lower flexible plate having a middle region and two side regions bordering the middle region; preparing a bottom flexible plate attached to the lower surface of the lower flexible plate to form a stack body; and performing a process of thermal pressing to sequentially from bottom to top stack and combine the stack body, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold.

Claims

1. A method of manufacturing a winged coil structure for providing a function of magnetic induction and a flexible and bendable feature, comprising:

preparing an upper flexible plate having a middle region and two side regions bordering the middle region, and provided with at least one upper magnetic induction coil, at least one upper connection pad, and at least one connection plug, the at least one upper magnetic induction coil and the at least one upper connection pad being electrically connected and embedded in the middle region of the upper flexible plate and close to an upper surface of the upper flexible plate, the at least one connection plug being provided on the lower surface of the middle region of the upper flexible plate and attached to a bottom of the corresponding upper connection pad;

preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate;

preparing a lower flexible plate having a middle region and two side regions bordering the middle region, and provided with at least one lower magnetic induction coil and at least one lower connection pad, the at least one lower magnetic induction coil and the at least one lower connection pad being electrically connected and embedded in the middle region of the lower flexible plate and close to a lower surface of the lower flexible plate; and

performing a process of thermal pressing to sequentially from bottom to top stack and combine the lower flexible plate, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold, the at least one connection plug being formed of an electrically conductive metal material configured to penetrate the dielectric layer, and provided between the corresponding upper and lower connection pads such that the at least one connection plug combines the corresponding upper and lower connection pads after the process of thermal pressing to form electrical connection,

wherein a notched line is provided along each adjacency of the lower surface of the upper flexible plate and the lower flexible plate, the notched line has a trench recessing upwards or inwards such that the two side regions of the upper flexible plate are bendable upwards or downwards, and the dielectric layer is not extended to the notched line.

2. The method as claimed in claim 1, wherein the upper flexible plate and the lower flexible plate are formed of a resin or plastic material, and wherein the at least one connection plug is formed of copper, tin, copper alloy, or tin alloy, and has a shape of ball, column, or block.

3. The method as claimed in claim 1, wherein base surfaces of the two side regions of the upper flexible plate are attached to or covered by an external dielectric layer, and the external dielectric layer is formed of a dielectric material the same as or different from the dielectric material of the dielectric layer.

4. The method according to claim 1, wherein a middle through-hole is provided at the middle region of the upper flexible plate, at least one middle through-hole is provided at a middle region of the dielectric layer, and a middle through-hole is provided at the middle region of the lower flexible plate.

5. The method according to claim 4, wherein the respective middle through-holes of the lower flexible plate, the dielectric layer, and the upper flexible plate are vertically aligned in the multiple layered stack structure, and the at least one connection plug is configured to penetrate the at least one middle through-hole of the dielectric layer.

6. The method according to claim 1, wherein the upper flexible plate is further provided with at least one gold finger, and the at least one gold finger is provided on lower surfaces of the two side regions of the upper flexible plate.

7. The method as claimed in claim 6, wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower connection pad, and the at least one gold finger are formed of the same or different electrical conductive material, and wherein the electrical conductive material comprises copper, copper alloy, or gold, and the dielectric layer is formed of a dielectric material.

8. A method of manufacturing a winged coil structure for providing a function of magnetic induction and a flexible and bendable feature, comprising:

preparing an upper flexible plate having a middle region and two side regions bordering the middle region, and provided with at least one upper magnetic induction coil, at least one upper connection pad, and at least one connection plug, the at least one upper magnetic induction coil and the at least one upper connection pad being electrically connected and embedded in the middle region of the upper flexible plate and close to an upper surface of the upper flexible plate, the at least one connection plug being provided on the lower surface of the middle region of the upper flexible plate and attached to a bottom of the corresponding upper connection pad;

preparing a dielectric layer with a lateral size of the dielectric layer being the same as a lateral size of the middle region of the upper flexible plate;

preparing a lower flexible plate having a middle region and two side regions bordering the middle region, and provided with at least one lower magnetic induction coil and at least one lower connection pad, the at least one lower magnetic induction coil and the at least one lower connection pad being electrically connected and embedded in the middle region of the lower flexible plate and close to an lower surface of the lower flexible plate;

preparing a bottom flexible plate attached to the lower surface of the lower flexible plate to form a stack body, the bottom flexible plate having a middle region and two side regions bordering the middle region, and provided with at least one bottom magnetic induction coil and at least one bottom connection pad, the at least one bottom magnetic induction coil and the at least one bottom connection pad being electrically connected, embedded in the middle region of the bottom flexible plate, and close to a lower surface of the bottom flexible plate; and

performing a process of thermal pressing to sequentially from bottom to top stack and combine the stack body, the dielectric layer, and the upper flexible plate as a multiple layered stack structure via a press mold, the at least one connection plug being formed of an electrically conductive metal material, configured to penetrate the dielectric layer, and provided between the corresponding upper and lower connection pads such that the at least one connection plug combines the corresponding upper and lower connection pads after the process of thermal pressing to form electrical connection,

wherein a notched line is provided along each adjacency of the lower surface of the upper flexible plate and the lower flexible plate, the notched line has a trench recessing upwards or inwards such that the two side regions of the upper flexible plate are bendable upwards or downwards, and the dielectric layer is not extended to the notched line.

9. The method as claimed in claim 8, wherein the upper flexible plate, the lower flexible plate, and the bottom flexible plate are formed of a resin or plastic material, and wherein the at least one connection plug is formed of copper, tin, copper alloy, or tin alloy, and has a shape of ball, column, or block.

10. The method according to claim 8, wherein a middle through-hole is provided at the middle region of the upper flexible plate, at least one middle through-hole is provided at a middle region of the dielectric layer, a middle through-hole is provided at the middle region of the lower flexible plate, and a middle through-hole is provided at the middle region of the bottom flexible plate, the respective middle through-holes of the bottom flexible plate.

11. The method according to claim 10, wherein the lower flexible plate, the dielectric layer, and the upper flexible plate are vertically aligned in the multiple layered stack structure, and the at least one connection plug is configured to penetrate the at least one middle through-hole of the dielectric layer.

12. The method according to claim 8, wherein the upper flexible plate is further provided with at least one gold finger, and the at least one gold finger is provided on lower surfaces of the two side regions of the upper flexible plate.

13. The method as claimed in claim 12, wherein the upper magnetic induction coil, the upper connection pad, the lower magnetic induction coil, the lower connection pad, the bottom magnetic induction coil, the bottom connection pad, and the at least one gold finger are formed of the same or different electrical conductive material, and wherein the electrical conductive material comprises copper, copper alloy, or gold, and the dielectric layer is formed of a dielectric material.

14. The method as claimed in claim 12, wherein base surfaces of the two side regions of the upper flexible plate are attached to or covered by an external dielectric layer, and the external dielectric layer is formed of a dielectric material the same as or different from the dielectric material of the dielectric layer.

15. The method according to claim 12, further comprising:

prior to the process of thermal pressing, supporting a bottom of the bottom flexible plate by an auxiliary stuff, wherein the auxiliary stuff is larger than or equal to the upper flexible plate and has two projecting parts at two ends aligned to the at least one gold finger, so that the two side regions of the upper flexible plate and the dielectric layer are supported by the auxiliary stuff during the process of thermal pressing;

removing the auxiliary stuff after the process of thermal pressing; and

covering a covering layer on the upper surface of the upper flexible plate, the lower surface of the lower flexible plate, and a surrounding area of the at least one gold finger, wherein the covering layer is formed of an electrical insulation material with transparency or opaqueness.