Strengthened LED package and method therefor

• US 10,367,125 B2
• Filed: 07/12/2013
• Issued: 07/30/2019
• Est. Priority Date: 07/30/2012
• Status: Active Grant

• Current Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Original Assignee: Lumileds LLC (Apollo Global Management, Inc.)
• Inventors: Soong, Chee Weng, Ishikawa, Tomonari, Tan, Su Ping, Goh, Chiou Bee
• Primary Examiner(s): Woldegeorgis, Ermias T
• Application Number:
  US14/418,094
• Publication Number:
  US 20150162512A1
• Time in Patent Office: 2,209 Days
• CPC Class Codes: H01L 23/495 Lead-frames or other flat leads H01L23/498 takes precedence; lead frame interconnections between components H01L23/52
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49544 Deformation absorbing parts in the lead frame plane, e.g. meanderline shape H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence
• CPC Class Codes: H01L 23/49551 characterised by bent parts
• CPC Class Codes: H01L 23/49555 the bent parts being the outer leads
• CPC Class Codes: H01L 23/49575 Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Crimping of an LED leadframe to a subassembly may stress the leadframe. Flat leadframes cannot accommodate these stresses. Strain relief sections are added to the leadframe to accommodate crimping or other stresses on the leadframe. Strain relief sections are created in the leadframe in the form of openings, notches or bulges. The strain relief sections may be symmetric or asymmetric.

Claims

1. An apparatus comprising:

an electronic component; and

a leadframe comprising at least one leadframe member connected to the electronic component, the at least one leadframe member having an upper surface, a lower surface opposite the upper surface, and at least one bulge indented into the lower surface and extending above a plane of the upper surface, the bulge having an upper section in which a thickness between the upper surface and lower surface of the leadframe member is smaller than a thickness between the upper surface and lower surface of the leadframe member outside of the bulge; and

a subassembly facing the lower surface of the at least one leadframe member and connected to the at least one leadframe member at a clinching position, the bulge positioned between and spaced apart from the electronic component and the clinching position.

2. The apparatus of claim 1 wherein the electronic component is an LED.

3. The apparatus of claim 1 wherein the at least one leadframe member is connected to a bottom surface of the electronic component.

4. The apparatus of claim 1 wherein the at least one leadframe member is connected to at least one side surface of the electronic component.

5. The apparatus of claim 1 further comprising at least two leadframe members, the at least two leadframe members being connected to different side surfaces of the electronic component.

6. The apparatus of claim 1, wherein the at least one leadframe member does not have a bend.