Extended area of sputter deposited n-type and p-type thermoelectric legs in a flexible thin-film based thermoelectric device

• US 10,367,131 B2
• Filed: 05/31/2018
• Issued: 07/30/2019
• Est. Priority Date: 12/06/2013
• Status: Active Grant

• Current Assignee: Nimbus Materials Inc
• Original Assignee: Sridhar Kasichainula
• Inventors: Kasichainula, Sridhar
• Primary Examiner(s): Booth, Richard A
• Application Number:
  US15/995,110
• Publication Number:
  US 20180277732A1
• Time in Patent Office: 425 Days
• CPC Class Codes: H01L 31/0547 comprising light concentrating means of the reflecting type, e.g. parabolic mirrors, concentrators using total internal reflection
• CPC Class Codes: H02S 10/10 including a supplementary source of electric power, e.g. hybrid diesel-PV energy systems combinations with gas-turbine plants F02C6/00
• CPC Class Codes: H02S 30/20 Collapsible or foldable PV modules
• CPC Class Codes: H02S 40/44 Means to utilise heat energy, e.g. hybrid systems producing warm water and electricity at the same time directly associated with the PV cell or integrated with the PV cell H01L31/0525
• CPC Class Codes: H10N 10/01 Manufacture or treatment
• CPC Class Codes: H10N 10/13 characterised by the heat-exchanging means at the junction
• CPC Class Codes: H10N 10/17 characterised by the structure or configuration of the cell or thermocouple forming the device
• CPC Class Codes: H10N 10/817 the junction being non-separable, e.g. being cemented, sintered or soldered
• CPC Class Codes: Y02E 10/52 PV systems with concentrators
• CPC Class Codes: Y02E 10/60 Thermal-PV hybrids

Abstract

A method includes forming a thin-film based thermoelectric module by sputter depositing pairs of N-type and P-type thermoelectric legs electrically in contact with one another on corresponding electrically conductive pads on a flexible substrate having a dimensional thickness less than or equal to 25 μm, with the legs having extended areas compared to the corresponding electrically conductive pads, and rendering the formed thin-film based thermoelectric module flexible and less than or equal to 100 μm in dimensional thickness based on choices of fabrication processes. The method also includes encapsulating the formed thin-film based thermoelectric module with an elastomer to render the flexibility thereto. The elastomer encapsulation has a dimensional thickness less than or equal to 15 μm, and the flexibility enables an array of thin-film based thermoelectric modules to be completely wrappable and bendable around a system element from which the array is configured to derive thermoelectric power.

Claims

1. A method of a thin-film based thermoelectric module, comprising:

forming the thin-film based thermoelectric module by sputter depositing pairs of N-type thermoelectric legs and P-type thermoelectric legs electrically in contact with one another on corresponding electrically conductive pads on a flexible substrate such that an area of each sputter deposited N-type thermoelectric leg and another area of each sputter deposited P-type thermoelectric leg is more than an area of the corresponding electrically conductive pad to allow for extension thereof outside the corresponding electrically conductive pad, the flexible substrate being one of;

aluminum (Al) foil, a sheet of paper, teflon, plastic, a single-sided copper (Cu) clad laminate sheet, and a double-sided Cu clad laminate sheet, and the flexible substrate having a dimensional thickness less than or equal to 25 μ

m;

rendering the formed thin-film based thermoelectric module flexible and less than or equal to 100 μ

m in dimensional thickness based on choices of fabrication processes with respect to layers of the formed thin-film based thermoelectric module including the sputter deposited N-type thermoelectric legs and the P-type thermoelectric legs; and

encapsulating the formed thin-film based thermoelectric module with an elastomer to render the flexibility thereto, the elastomer encapsulation having a dimensional thickness less than or equal to 15 μ

m, the flexibility enabling an array of thin-film based thermoelectric modules, each of which is equivalent to the thin-film based thermoelectric module formed on the flexible substrate with the elastomer encapsulation, to be completely wrappable and bendable around a system element from which the array of the thin-film based thermoelectric modules is configured to derive thermoelectric power, and a layer of the formed thin-film based thermoelectric module including the sputter deposited N-type thermoelectric legs and the P-type thermoelectric legs having a dimensional thickness less than or equal to 25 μ

m.

2. The method of claim 1, comprising utilizing one of:

a photomask and a hard mask with patterns corresponding to one of;

the N-type thermoelectric legs and the P-type thermoelectric legs to aid the sputter deposition thereof.

3. The method of claim 1, further comprising printing and etching a design pattern of metal onto the flexible substrate to form the corresponding electrically conductive pads.

4. The method of claim 3, further comprising sputter depositing a barrier metal layer comprising one of:

Cr, Ni and Au on top of the sputter deposited pairs of the N-type thermoelectric legs and the P-type thermoelectric legs utilizing one of;

another photomask and another hard mask to further aid metallization contact therewith.

5. The method of claim 4, further comprising depositing conductive interconnects on top of the sputter deposited barrier metal layer utilizing a hard mask to assist selective application thereof.

6. The method of claim 5, further comprising depositing the conductive interconnects through screen printing conductive forms of ink on the sputter deposited barrier metal layer.

7. The method of claim 1, comprising:

depositing a moisture barrier thin film on the formed thin-film based thermoelectric module prior to the encapsulation thereof with the elastomer; and

providing the encapsulation through the elastomer around the deposited moisture barrier thin film.

8. A method of a thin-film based thermoelectric module, comprising:

forming the thin-film based thermoelectric module by sputter depositing pairs of N-type thermoelectric legs and P-type thermoelectric legs electrically in contact with one another on corresponding electrically conductive pads on a flexible substrate such that an area of each sputter deposited N-type thermoelectric leg and another area of each sputter deposited P-type thermoelectric leg is more than an area of the corresponding electrically conductive pad to allow for extension thereof outside the corresponding electrically conductive pad, the flexible substrate being one of;

Al foil, a sheet of paper, teflon, plastic, a single-sided Cu clad laminate sheet, and a double-sided Cu clad laminate sheet, and the flexible substrate having a dimensional thickness less than or equal to 25 μ

m;

rendering the formed thin-film based thermoelectric module flexible and less than or equal to 100 μ

m in dimensional thickness based on choices of fabrication processes with respect to layers of the formed thin-film based thermoelectric module including the sputter deposited N-type thermoelectric legs and the P-type thermoelectric legs, a layer of the formed thin-film based thermoelectric module including the sputter deposited N-type thermoelectric legs and the P-type thermoelectric legs having a dimensional thickness less than or equal to 25 μ

m;

encapsulating the formed thin-film based thermoelectric module with an elastomer to render the flexibility thereto, the elastomer encapsulation having a dimensional thickness less than or equal to 15 μ

m; and

wrapping and bending an array of thin-film based thermoelectric modules, each of which is equivalent to the thin-film based thermoelectric module formed on the flexible substrate with the elastomer encapsulation, completely around a system element from which the array of the thin-film based thermoelectric modules is configured to derive thermoelectric power in accordance with the flexibility thereof.

9. The method of claim 8, comprising utilizing one of:

a photomask and a hard mask with patterns corresponding to one of;

the N-type thermoelectric legs and the P-type thermoelectric legs to aid the sputter deposition thereof.

10. The method of claim 8, further comprising printing and etching a design pattern of metal onto the flexible substrate to form the corresponding electrically conductive pads.

11. The method of claim 10, further comprising sputter depositing a barrier metal layer comprising one of:

Cr, Ni and Au on top of the sputter deposited pairs of the N-type thermoelectric legs and the P-type thermoelectric legs utilizing one of;

another photomask and another hard mask to further aid metallization contact therewith.

12. The method of claim 11, further comprising depositing conductive interconnects on top of the sputter deposited barrier metal layer utilizing a hard mask to assist selective application thereof.

13. The method of claim 12, further comprising depositing the conductive interconnects through screen printing conductive forms of ink on the sputter deposited barrier metal layer.

14. The method of claim 8, comprising:

depositing a moisture barrier thin film on the formed thin-film based thermoelectric module prior to the encapsulation thereof with the elastomer; and

providing the encapsulation through the elastomer around the deposited moisture barrier thin film.

15. A method of a thin-film based thermoelectric device comprising:

forming the thin-film based thermoelectric device out of an array of thermoelectric modules, each of which is less than or equal to 100 μ

m in dimensional thickness and is formed by sputter depositing pairs of N-type thermoelectric legs and P-type thermoelectric legs electrically in contact with one another on corresponding electrically conductive pads on a flexible substrate such that an area of each sputter deposited N-type thermoelectric leg and another area of each sputter deposited P-type thermoelectric leg is more than an area of the corresponding electrically conductive pad to allow for extension thereof outside the corresponding electrically conductive pad, the flexible substrate being one of;

Al foil, a sheet of paper, teflon, plastic, a single-sided Cu clad laminate sheet, and a double-sided Cu clad laminate sheet, the flexible substrate having a dimensional thickness less than or equal to 25 μ

m, and a layer of the each thermoelectric module including the sputter deposited N-type thermoelectric legs and the P-type thermoelectric legs having a dimensional thickness less than or equal to 25 μ

m;

rendering the formed thin-film based thermoelectric device flexible based on choices of fabrication processes with respect to layers of the each thermoelectric module including the sputter deposited N-type thermoelectric legs and the P-type thermoelectric legs; and

encapsulating the each thermoelectric module of the formed thin-film based thermoelectric device with an elastomer to render the flexibility thereto, the elastomer encapsulation having a dimensional thickness less than or equal to 15 μ

m, and the flexibility enabling the formed thin-film based thermoelectric device to be completely wrappable and bendable around a system element from which the formed thin-film based thermoelectric device is configured to derive thermoelectric power.

16. The method of claim 15, comprising utilizing one of:

a photomask and a hard mask with patterns corresponding to one of;

the N-type thermoelectric legs and the P-type thermoelectric legs to aid the sputter deposition thereof.

17. The method of claim 15, further comprising printing and etching a design pattern of metal onto the flexible substrate to form the corresponding electrically conductive pads.

18. The method of claim 17, further comprising sputter depositing a barrier metal layer comprising one of:

Cr, Ni and Au on top of the sputter deposited pairs of the N-type thermoelectric legs and the P-type thermoelectric legs utilizing one of;

another photomask and another hard mask to further aid metallization contact therewith.

19. The method of claim 18, further comprising depositing conductive interconnects on top of the sputter deposited barrier metal layer utilizing a hard mask to assist selective application thereof.

20. The method of claim 19, further comprising depositing the conductive interconnects through screen printing conductive forms of ink on the sputter deposited barrier metal layer.