Metrology method and apparatus, computer program and lithographic system

• US 10,369,752 B2
• Filed: 04/26/2016
• Issued: 08/06/2019
• Est. Priority Date: 05/07/2015
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Mossavat, Seyed Iman, Van Leest, Adriaan Johan
• Primary Examiner(s): Ali, Mohammad
• Assistant Examiner(s): Azad, Md
• Application Number:
  US15/138,903
• Publication Number:
  US 20160325504A1
• Time in Patent Office: 1,197 Days
• Field of Search: 700 98
• CPC Class Codes: B29C 64/386 Data acquisition or data processing for additive manufacturing
• CPC Class Codes: B33Y 50/02 for controlling or regulating additive manufacturing processes
• CPC Class Codes: G03F 7/705 Modelling or simulating from physical phenomena up to complete wafer processes or whole workflow in wafer productions
• CPC Class Codes: G03F 7/70625 Dimensions, e.g. line width, critical dimension [CD], profile, sidewall angle or edge roughness
• CPC Class Codes: G05B 19/4099 Surface or curve machining, making 3D objects, e.g. desktop manufacturing
• CPC Class Codes: G05B 2219/35134 3-D cad-cam
• CPC Class Codes: G05B 2219/49007 Making, forming 3-D object, model, surface

Abstract

Disclosed are a method, computer program and associated apparatuses for metrology. The method includes acquiring inspection data comprising a plurality of inspection data elements, each inspection data element having been obtained by inspection of a corresponding target structure formed using a lithographic process; and performing an unsupervised cluster analysis on said inspection data, thereby partitioning said inspection data into a plurality of clusters in accordance with a metric. In an embodiment, a cluster representative can be identified for each cluster. The cluster representative may be reconstructed and the reconstruction used to approximate the other members of the cluster.

Claims

1. A method of metrology comprising:

acquiring inspection data, the inspection data comprising a plurality of inspection data elements, each inspection data element having been obtained by inspection of a corresponding target structure formed using a lithographic process in a lithographic system;

performing an unsupervised cluster analysis on the inspection data, thereby partitioning the inspection data into a plurality of clusters in accordance with a metric;

determining a representative inspection data element for each of the plurality of clusters, each representative inspection data element corresponding to a representative target structure formed using the lithographic process;

performing a reconstruction operation to obtain at least one reconstructed parameter value from each representative inspection data element, the at least one reconstructed parameter value comprising a value for at least one parameter of the corresponding representative target structure formed using the lithographic process; and

performing a targeted reconstruction operation of each target structure, other than the representative target structures, based upon the at least one reconstructed parameter value of at least one of the representative target structures,

wherein the targeted reconstruction operation for each target structure is based upon the at least one reconstructed parameter value for the representative target structure of the cluster of which that target structure is a member.

2. The method as claimed in claim 1, wherein:

the inspection data comprises measured intensities within spectra or images, and

the spectra or images comprise diffraction spectra or images obtained by the inspection using a scatterometer.

3. The method as claimed in claim 1, wherein the inspection data comprises values for at least one parameter of the corresponding target structure as determined by a subsequent reconstruction operation on the inspection data.

4. The method as claimed in claim 1, wherein the partitioning of the inspection data is performed in accordance with a relative distance, as defined by the metric, between each inspection data element and a cluster center of each cluster.

5. The method as claimed in claim 1, wherein the partitioning of the inspection data is performed in accordance with one or more statistical distribution models, such that each cluster is defined as comprising the inspection data elements belonging to the same distribution.

6. The method as claimed in claim 1, wherein each representative inspection data element is a closest to an average inspection data element, in terms of the metric, for its corresponding cluster.

7. The method as claimed in claim 1, wherein the at least one reconstructed parameter value for each representative target structure is used to derive a nominal value for at least one model parameter in subsequent reconstruction operations.

8. The method as claimed in claim 1, wherein the targeted reconstruction operation for each target is further based upon a weighted average of reconstructed parameter values for all, or a subset of, the representative target structures.

9. The method as claimed in claim 1, wherein a number of clusters is automatically learned.

10. The method as claimed in claim 9, wherein the number of clusters is automatically learned by:

performing the clustering analysis multiple times, each time partitioning the inspection data into n clusters, wherein n is chosen to be between 3 and 8 and is increased each time a cluster analysis is performed,

determining an average within cluster distance according to the metric for each cluster analysis, and

selecting the cluster analysis for which the average within cluster distance meets a threshold criterion.

11. The method as claimed in claim 1, wherein the acquiring inspection data comprises:

inspecting the target structures by illuminating each one of the target structures with measurement radiation and detecting the radiation scattered by each one of the target structures.

12. A metrology apparatus comprising:

a support configured to support a substrate having a plurality of target structures thereon, the plurality of target structures formed using a lithographic process in a lithographic system;

an optical system used in inspection of the plurality of target structures; and

a processor configured to;

acquire inspection data, the inspection data comprising a plurality of inspection data elements, each inspection data element having been obtained by the inspection of a corresponding target structure;

perform an unsupervised cluster analysis on the inspection data, thereby partitioning the inspection data into a plurality of clusters in accordance with a metric;

determine a representative inspection data element for each of the plurality of clusters, each representative inspection data element corresponding to a representative target structure formed using the lithographic process;

perform a reconstruction operation to obtain at least one reconstructed parameter value from each representative inspection data element, the at least one reconstructed parameter value comprising a value for at least one parameter of the corresponding representative target structure formed using the lithographic process; and

for each of the plurality of clusters, perform a second reconstruction operation of each target structure, other than the corresponding representative target structure, based at least on the at least one reconstructed parameter value of the corresponding representative target structure,

wherein the targeted reconstruction operation for each target is based upon a weighted average of reconstructed parameter values for all, or a subset of, the representative target structures.

13. A lithographic system comprising:

a lithographic apparatus comprising;

an illumination optical system configured to illuminate a pattern; and

a projection optical system configured to project an image of the pattern onto a substrate; and

a metrology apparatus configured to;

acquire inspection data, the inspection data comprising a plurality of inspection data elements, each inspection data element having been obtained by inspection of a corresponding target structure formed using the lithographic apparatus;

perform an unsupervised cluster analysis on the inspection data, thereby partitioning the inspection data into a plurality of clusters in accordance with a metric;

determine a representative inspection data element for each of the plurality of clusters, each representative inspection data element corresponding to a representative target structure formed using the lithographic apparatus;

perform a reconstruction operation to obtain at least one reconstructed parameter value from each representative inspection data element, the at least one reconstructed parameter value comprising a value for at least one parameter of the corresponding representative target structure formed using the lithographic apparatus; and

perform a targeted reconstruction operation of each target structure, other than the representative target structures, based upon the at least one reconstructed parameter value of at least one of the representative target structures,

wherein the targeted reconstruction operation for each target structure is based upon the at least one reconstructed parameter value for the representative target structure of the cluster of which that target structure is a member.

14. A computer program comprising processor readable instructions which, when run on a suitable processor controlled apparatus, cause the processor controlled apparatus to perform a method comprising:

acquiring inspection data, the inspection data comprising a plurality of inspection data elements, each inspection data element having been obtained by inspection of a corresponding target structure formed using a lithographic process in a lithographic system;

performing an unsupervised cluster analysis on the inspection data, thereby partitioning the inspection data into a plurality of clusters in accordance with a metric;

determining a representative inspection data element for each of the plurality of clusters, each representative inspection data element corresponding to a representative target structure formed using the lithographic process;

performing a reconstruction operation to obtain at least one reconstructed parameter value from each representative inspection data element, the at least one reconstructed parameter value comprising a value for at least one parameter of the corresponding representative target structure formed using the lithographic process; and

performing a targeted reconstruction operation of each target structure, other than the representative target structures, based upon the at least one reconstructed parameter value of at least one of the representative target structures,

wherein the targeted reconstruction operation for each target structure is based upon the at least one reconstructed parameter value for the representative target structure of the cluster of which that target structure is a member.

15. A computer program carrier comprising a computer program comprising processor readable instructions which, when run on a suitable processor controlled apparatus, cause the processor controlled apparatus to perform a method comprising:

acquiring inspection data, the inspection data comprising a plurality of inspection data elements, each inspection data element having been obtained by inspection of a corresponding target structure formed using a lithographic process in a lithographic system;

performing an unsupervised cluster analysis on the inspection data, thereby partitioning the inspection data into a plurality of clusters in accordance with a metric;

determining a representative inspection data element for each of the plurality of clusters, each representative inspection data element corresponding to a representative target structure formed using the lithographic process;

performing a reconstruction operation to obtain at least one reconstructed parameter value from each representative inspection data element, the at least one reconstructed parameter value comprising a value for at least one parameter of the corresponding representative target structure formed using the lithographic process; and

performing a targeted reconstruction operation of each target structure, other than the representative target structures, based upon the at least one reconstructed parameter value of at least one of the representative target structures,

wherein the targeted reconstruction operation for each target is based upon a weighted average of reconstructed parameter values for all, or a subset of, the representative target structures.