Infrared sensor array circuit breaker monitoring

• US 10,371,576 B2
• Filed: 09/28/2015
• Issued: 08/06/2019
• Est. Priority Date: 09/28/2015
• Status: Active Grant

• Current Assignee: Eaton Intelligent Power Limited (Eaton Corporation PLC.)
• Original Assignee: Eaton Intelligent Power Limited (Eaton Corporation PLC.)
• Inventors: Freer, Benjamin Avery, Iannce, Stephan P., Manahan, Joseph Michael, Rothenberger, Rick, Bonaccio, John
• Primary Examiner(s): Williams, Jeffery A
• Application Number:
  US14/867,745
• Publication Number:
  US 20170089763A1
• Time in Patent Office: 1,408 Days
• Field of Search: 348 82
• CPC Class Codes: G01J 2005/106 Arrays
• CPC Class Codes: G01J 5/0096 for measuring wires, electrical contacts or electronic systems
• CPC Class Codes: G01J 5/10 using electric radiation detectors
• CPC Class Codes: G01R 19/0092 measuring current only all subgroups of G01R19/00 take precedence
• CPC Class Codes: G01R 31/308 using non-ionising electromagnetic radiation, e.g. optical radiation investigating or analysing materials by the use of optical means G01N21/00; image analysis G06T7/00
• CPC Class Codes: H04N 23/23 from thermal infrared radiation
• CPC Class Codes: H04N 5/33 Transforming infrared radiation cameras or camera modules for generating image signals from infrared radiation H04N23/20; circuitry of SSIS for transforming infrared radiation into image signals H04N25/20
• CPC Class Codes: H04N 7/183 for receiving images from a single remote source

Abstract

A thermal monitoring system includes at least one of an infrared sensor and a plurality of infrared sensors arranged in an array. Each infrared sensor has a resolution including a plurality of pixels. A controller is configured to create a thermal image of an area to be monitored based at least in part on the plurality of pixels of each infrared sensor. A thermal monitoring assembly includes an electrical panel including a plurality of electrical components located within the electrical panel. The at least one of an infrared sensor and the plurality of infrared sensors arranged in an array, either alone or in combination with additional sensors, are located inside the electrical panel. Methods of monitoring various parameters including a temperature of the plurality of electrical components located inside the electrical panel are also provided.

Claims

1. A thermal monitoring system comprising:

a plurality of infrared sensors, each infrared sensor having a resolution comprising a plurality of pixels, the plurality of infrared sensors configured to monitor a cabinet having a plurality of electrical components; and

a controller configured to;

create a thermal image of a monitoring area of the cabinet based at least in part on the plurality of pixels, and

determine a characteristic of the cabinet based at least in part on the plurality of pixels,

wherein the plurality of pixels are arranged in a plurality of arrays, wherein each of the plurality of arrays is dedicated to one of the plurality of electrical components.

2. The thermal monitoring system of claim 1, further comprising:

an additional sensor comprising at least one of a current transformer and an ambient temperature sensor configured to respectively determine at least one of a current and measure an ambient temperature with respect to the monitoring area.

3. The thermal monitoring system of claim 1, wherein the cabinet is an electrical panel and the plurality of infrared sensors are arranged inside the electrical panel, and wherein the monitoring area comprises the plurality of electrical components located within the electrical panel.

4. The thermal monitoring system of claim 3, wherein the monitoring area comprises an entire area within the electrical panel comprising the plurality of electrical components located within the electrical panel, and wherein the thermal image is created of the entire area based at least in part on the plurality of pixels of each of the plurality of infrared sensors.

5. The thermal monitoring system of claim 1, wherein the controller is further configured to digitally overlay the thermal image onto a visual representation of the monitoring area.

6. The thermal monitoring system of claim 5, wherein the visual representation of the monitoring area comprises at least one of a picture of the area, a wireframe drawing of the monitoring area, a block diagram of the monitoring area, and a photograph of the monitoring area.

7. The thermal monitoring system of claim 5, wherein the visual representation of the monitoring area is stored electronically within a memory of the controller, the controller being configured to access the visual representation of the monitoring area from the memory and digitally overlay the thermal image onto the visual representation of the monitoring area to produce a composite thermal map of the monitoring area.

8. The thermal monitoring system of claim 1, wherein the controller is configured to map each of the plurality of pixels of the infrared sensor to a corresponding plurality of points, wherein each of the corresponding plurality of points is located within the monitoring area.

9. The thermal monitoring system of claim 8, wherein the controller is further configured to determine a temperature at each of the corresponding plurality of points based on the plurality of pixels, and to create a thermal map of the monitoring area based at least in part on the temperature at each of the corresponding plurality of points.

19. The thermal monitoring assembly of claim 1, wherein the controller is configured to stitch together a plurality of adjacent images from each of the plurality of infrared sensors to produce a combined thermal image from a plurality of adjacent thermal images.

20. The thermal monitoring system of claim 1, wherein the controller creates a plurality of thermal images and is further configured to compensate for pixel overlap or gap between the plurality of thermal images when patching or stitching together adjacent thermal images to produce a combined thermal image.

10. A thermal monitoring assembly comprising:

an electrical panel comprising a plurality of electrical components located within the electrical panel;

a plurality of infrared sensors arranged in an array, wherein each of the plurality of infrared sensors has a resolution comprising a plurality of pixels and can cover at least a 60 degree field of view, and wherein the array of infrared sensors is located within the electrical panel, wherein each of the plurality of infrared sensors includes an array of pixels dedicated to monitoring one of the plurality of electrical components; and

a controller configured to;

map each of the pluralities of pixels of each of the plurality of infrared sensors to a corresponding plurality of points within a monitoring area,

determine a temperature at each of the corresponding plurality of points based on the pluralities of pixels, and

determine a characteristic of the electrical panel based at least in part on the temperature.

11. The thermal monitoring assembly of claim 10, further comprising an ambient temperature sensor configured to measure an ambient temperature with respect to the monitoring area, wherein the controller is configured to determine the characteristic further based at least in part on the ambient temperature.

12. The thermal monitoring assembly of claim 10, wherein the controller is further configured to at least one of report and analyze the characteristic to at least one of diagnose and predict at least one of a status or problem of the electrical panel.

13. The thermal monitoring assembly of claim 10, wherein the controller is configured to create a thermal image of the monitoring area based at least in part on the temperature at each of the corresponding plurality of points.

14. The thermal monitoring assembly of claim 13, wherein the controller is configured to associate the temperature at each of the corresponding plurality of points with the monitoring area, and wherein the controller is configured to create a composite thermal map comprising the thermal image and a visual representation of the monitoring area.

15. The thermal monitoring assembly of claim 14, wherein the visual representation of the monitoring area comprises a visual representation of the electrical components, and wherein the controller is configured to create the composite thermal map by digitally overlaying the thermal image onto the visual representation of the electrical components.

16. The thermal monitoring assembly of claim 13, further comprising a monitor, wherein the controller is configured to at least one of display the thermal image on the monitor and identify the characteristic on the monitor.

17. The thermal monitoring assembly of claim 10, wherein the electrical panel comprises a door configured to selectively provide and restrict access to an interior of the electrical panel, and wherein the array is arranged on at least one of the door and a frame structure inside the electrical panel such that each of the plurality of infrared sensors faces the interior of the electrical panel when the door is arranged to restrict access to the interior of the electrical panel, and wherein the thermal monitoring assembly is configured to determine a position of the door with respect to the interior of the electrical panel based at least in part on the pluralities of pixels.

18. The thermal monitoring assembly of claim 10, further comprising a current transformer configured to measure an electrical current of the plurality of electrical components with respect to the monitoring area, wherein the controller is configured to determine the characteristic further based at least in part on the electrical current.