Coupling structures for electronic device housings
First Claim
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1. A housing for an electronic device, comprising:
- a first conductive component defining;
a first portion of a curved exterior surface of the housing;
a first interface surface; and
a first interlock feature;
a second conductive component defining;
a second portion of the curved exterior surface of the housing;
a second interface surface facing the first interface surface; and
a second interlock feature; and
a joint structure between the first and second interface surfaces, comprising;
a molded element defining;
first and second corresponding interlock features engaged with the first and second interlock features, respectively, and fixing the first conductive component to the second conductive component; and
a third portion of the curved exterior surface of the housing, the third portion positioned between and adjacent to the first and second portions of the curved exterior surface; and
a sealing member abutting the molded element and forming a watertight seal between the first and second conductive components.
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Abstract
A housing for an electronic device is disclosed. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first and second interface surfaces. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member forming a watertight seal between the first and second conductive components. Methods of forming the electronic device housing are also disclosed.
82 Citations
15 Claims
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1. A housing for an electronic device, comprising:
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a first conductive component defining; a first portion of a curved exterior surface of the housing; a first interface surface; and a first interlock feature; a second conductive component defining; a second portion of the curved exterior surface of the housing; a second interface surface facing the first interface surface; and a second interlock feature; and a joint structure between the first and second interface surfaces, comprising; a molded element defining; first and second corresponding interlock features engaged with the first and second interlock features, respectively, and fixing the first conductive component to the second conductive component; and a third portion of the curved exterior surface of the housing, the third portion positioned between and adjacent to the first and second portions of the curved exterior surface; and a sealing member abutting the molded element and forming a watertight seal between the first and second conductive components. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An electronic device, comprising:
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a display; a cover over the display; and a housing configured to receive the display and the cover, comprising; a first component receiving the cover thereon and defining; a first exterior surface region of the housing; and a first interlock feature; a second component forming at least part of an interior cavity of the housing and defining; a second exterior surface region of the housing; and a second interlock feature; and a joint structure positioned in a gap between the first and second components, comprising; a molded element mechanically engaged with the first and second interlock features to inhibit expansion of the gap, the molded element defining a third exterior surface region between the first and second exterior surface regions; and an elastomeric sealing member abutting the molded element and between the first and second components;
whereinthe third exterior surface region, a portion of the first exterior surface region adjacent the molded element, and a portion of the second exterior surface region adjacent the molded element together define a continuous surface. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification