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Coupling structures for electronic device housings

  • US 10,372,166 B2
  • Filed: 07/15/2016
  • Issued: 08/06/2019
  • Est. Priority Date: 07/15/2016
  • Status: Active Grant
First Claim
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1. A housing for an electronic device, comprising:

  • a first conductive component defining;

    a first portion of a curved exterior surface of the housing;

    a first interface surface; and

    a first interlock feature;

    a second conductive component defining;

    a second portion of the curved exterior surface of the housing;

    a second interface surface facing the first interface surface; and

    a second interlock feature; and

    a joint structure between the first and second interface surfaces, comprising;

    a molded element defining;

    first and second corresponding interlock features engaged with the first and second interlock features, respectively, and fixing the first conductive component to the second conductive component; and

    a third portion of the curved exterior surface of the housing, the third portion positioned between and adjacent to the first and second portions of the curved exterior surface; and

    a sealing member abutting the molded element and forming a watertight seal between the first and second conductive components.

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