Multi-processor device
First Claim
1. A semiconductor device comprising:
- a semiconductor chip with four sides and, in plan view, having;
a first edge extending in a first direction,a second edge extending in a second direction crossing the first direction,a third edge opposite the second edge and extending in the second direction, anda fourth edge opposite the first edge and extending in the first direction;
a first type processor formed on the semiconductor chip;
a second type processor formed on the semiconductor chip;
a first external bus interface coupled to the first type processor through a first bus; and
a second external bus interface coupled to the second type processor through a second bus,wherein the first type processor operates at a first operating speed greater than a second operating speed of the second type processor,wherein, in plan view, the first type processor is located closer to the first edge than the fourth edge, and located closer to the first edge than both the first external bus interface and the second external bus interface,wherein, in plan view, the first external bus interface is located closer to the second edge than the third edge, and having a portion located closer to the fourth edge than the first edge,wherein, in plan view, the second external bus interface is located closer to the third edge than the second edge, and having a portion located closer to the fourth edge than the first edge,wherein the first type processor has access to both the first external bus interface and the second external bus interface, and the second type processor and elements coupled to the second bus have access to the second external bus interface and do not have access to the first external bus interface.
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Abstract
The present invention intends to provide a high-performance multi-processor device in which independent buses and external bus interfaces are provided for each group of processors of different architectures, if a single chip includes a plurality of multi-processor groups. A multi-processor device of the present invention comprises a plurality of processors including first and second groups of processors of different architectures such as CPUs, SIMD type super-parallel processors, and DSPs, a first bus which is a CPU bus to which the first processor group is coupled, a second bus which is an internal peripheral bus to which the second processor group is coupled, independent of the first bus, a first external bus interface to which the first bus is coupled, and a second external bus interface to which the second bus is coupled, over a single semiconductor chip.
98 Citations
12 Claims
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1. A semiconductor device comprising:
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a semiconductor chip with four sides and, in plan view, having; a first edge extending in a first direction, a second edge extending in a second direction crossing the first direction, a third edge opposite the second edge and extending in the second direction, and a fourth edge opposite the first edge and extending in the first direction; a first type processor formed on the semiconductor chip; a second type processor formed on the semiconductor chip; a first external bus interface coupled to the first type processor through a first bus; and a second external bus interface coupled to the second type processor through a second bus, wherein the first type processor operates at a first operating speed greater than a second operating speed of the second type processor, wherein, in plan view, the first type processor is located closer to the first edge than the fourth edge, and located closer to the first edge than both the first external bus interface and the second external bus interface, wherein, in plan view, the first external bus interface is located closer to the second edge than the third edge, and having a portion located closer to the fourth edge than the first edge, wherein, in plan view, the second external bus interface is located closer to the third edge than the second edge, and having a portion located closer to the fourth edge than the first edge, wherein the first type processor has access to both the first external bus interface and the second external bus interface, and the second type processor and elements coupled to the second bus have access to the second external bus interface and do not have access to the first external bus interface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification