Radio IC device
First Claim
1. A radio IC device of an apparatus, the radio IC device comprising:
- a radio IC arranged to process transmitted and received signals;
a coil element electrically connected to or electromagnetically coupled to the radio IC; and
a radiation plate defined by at least a metal component disposed in the apparatus;
whereinthe metal component includes a ground electrode on a wiring board;
the radiation plate includes a loop portion;
the loop portion includes a circumference portion of an opening provided in the ground electrode;
the coil element is coupled to the loop portion via a magnetic field; and
the metal component further includes a first wiring electrode disposed in the apparatus, a shielding case, a wiring electrode on the wiring board, or a connector connected to the wiring electrode or the ground electrode.
1 Assignment
0 Petitions
Accused Products
Abstract
A radio IC device includes an electromagnetic coupling module includes a radio IC chip arranged to process transmitted and received signals and a feed circuit board including an inductance element. The feed circuit board includes an external electrode electromagnetically coupled to the feed circuit, and the external electrode is electrically connected to a shielding case or a wiring cable. The shielding case or the wiring cable functions as a radiation plate. The radio IC chip is operated by a signal received by the shielding case or the wiring, and the answer signal from the radio IC chip is radiated from the shielding case or the wiring cable to the outside. A metal component functions as the radiation plate, and the metal component may be a ground electrode disposed on the printed wiring board.
11 Citations
6 Claims
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1. A radio IC device of an apparatus, the radio IC device comprising:
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a radio IC arranged to process transmitted and received signals; a coil element electrically connected to or electromagnetically coupled to the radio IC; and a radiation plate defined by at least a metal component disposed in the apparatus;
whereinthe metal component includes a ground electrode on a wiring board; the radiation plate includes a loop portion; the loop portion includes a circumference portion of an opening provided in the ground electrode; the coil element is coupled to the loop portion via a magnetic field; and the metal component further includes a first wiring electrode disposed in the apparatus, a shielding case, a wiring electrode on the wiring board, or a connector connected to the wiring electrode or the ground electrode. - View Dependent Claims (2, 3, 4)
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5. A radio IC device of an apparatus, the radio IC device comprising:
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a radio IC arranged to process transmitted and received signals; a coil element electrically connected to or electromagnetically coupled to the radio IC; and a radiation plate defined by at least a metal component disposed in the apparatus;
wherein the metal component includes a ground electrode on a wiring board;the radiation plate includes a loop portion; the loop portion includes a circumference portion of an opening provided in the ground electrode; the coil element is coupled to the loop portion via a magnetic field; the radiation plate is also defined by a case of the apparatus; and the case is made of a metal material, and the case itself functions as the radiation plate.
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6. A radio IC device of an apparatus, the radio IC device comprising:
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a radio IC arranged to process transmitted and received signals; a coil element electrically connected to or electromagnetically coupled to the radio IC; and a radiation plate defined by at least a metal component disposed in the apparatus;
whereinthe metal component includes a ground electrode on a wiring board; the radiation plate includes a loop portion; the loop portion includes a circumference portion of an opening provided in the ground electrode; the coil element is coupled to the loop portion via a magnetic field; the radiation plate is also defined by a case of the apparatus; and the case is made of a non-conductive material, an electrode film which is made of a conductive material is provided on the case, and the electrode film functions as the radiation plate.
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Specification