×

Embedded bridge with through-silicon vias

  • US 10,373,893 B2
  • Filed: 06/30/2017
  • Issued: 08/06/2019
  • Est. Priority Date: 06/30/2017
  • Status: Active Grant
First Claim
Patent Images

1. An apparatus, comprising:

  • a package substrate having a first side opposing a second side, and comprising a first conductive layer on the first side of the package substrate, and a second conductive layer between the first side and the second side of the package substrate, the package substrate having a dielectric between the first conductive layer and the second conductive layer, wherein the first and second conductive layers comprise a plurality of pads and traces; and

    at least one bridge die within the package substrate, the at least one bridge die having a first side opposing a second side, and comprising a plurality of vias extending from the first side to the second side of the at least one bridge die, wherein the at least one bridge die comprises a plurality of pads and traces on the first side of the at least one bridge die and a plurality of pads on the second side of the at least one bridge die, wherein the pads on the first side of the at least one bridge die are interconnected by the plurality of vias to the pads on the opposing second side of the at least one bridge die, and wherein the at least one bridge die comprises an adhesive conductive film on a bottom surface of a layer of silicon oxide on the second side of the at least one bridge die,wherein a first active die and a second active die are coupled to the first side of the bridge die, wherein the second conductive layer between the first and second sides of the package substrate is coupled to the plurality of vias extending from the first side of the at least one bridge die to the second side of the at least one bridge die, wherein at least a portion of the plurality of vias extending between the first side and the second side of the at least one bridge die are coupled to power routing traces in the second conductive layer of the package substrate, and wherein the portion of the plurality of vias are to couple power from the package substrate to the first and second active dies.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×