Semiconductor device packages

• US 10,373,916 B2
• Filed: 07/28/2016
• Issued: 08/06/2019
• Est. Priority Date: 07/28/2016
• Status: Active Grant

• Current Assignee: Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Lin, Ji-Min, Liao, Ming-Wen, Huang, Chun-Ying
• Primary Examiner(s): Chin, Edward
• Application Number:
  US15/222,820
• Publication Number:
  US 20180033736A1
• Time in Patent Office: 1,104 Days
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

A semiconductor device package includes a substrate, a component on a surface of the substrate, a package body encapsulating the component, and an electromagnetic interference (EMI) shield conformally formed on the package body, where the EMI shield has a side portion defining an opening.

Claims

1. A semiconductor device package comprising:

a substrate having a top surface and a lateral surface perpendicular to the top surface;

at least one component on the top surface of the substrate;

a package body encapsulating the at least one component and having a lateral surface; and

an electromagnetic interference (EMI) shield conformally formed on the package body and covering the lateral surface of the package body, the EMI shield having a first side portion defining a first opening;

wherein the lateral surface of the package body covered by the EMI shield is substantially coplanar with the lateral surface of the substrate,

the at least one component is configured to operate at a frequency of operation, and the EMI shield having the first opening is configured to shift a resonant frequency that corresponds to the frequency of operation of the at least one component, and

the first opening has a first length L₁ determined by 0.026λ

≤

L₁≤

0.155λ and

λ

is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.

2. The semiconductor device package of claim 1, wherein the first opening has a height, wherein the first length L₁ is greater than the height.

3. The semiconductor device package of claim 1, wherein the first length L₁ is further determined by 0.029λ

≤

L₁≤

0.139λ

.

4. The semiconductor device package of claim 1, wherein the EMI shield further defines a second opening on the first side portion, the second opening has a second length L₂, a sum L_s of the first length L₁ and the second length L₂ is determined by 0.026λ

<

L_s≤

0.155λ

.

5. The semiconductor device package of claim 1, wherein the EMI shield further defines a plurality of second openings on the first side portion, each of the plurality of second openings has a second length L₂, a sum L_s of the first length L₁ and the second lengths L₂ is determined by 0.026λ

<

L_s≤

0.155λ and

λ

is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.

6. The semiconductor device package of claim 1, wherein the EMI shield further comprises a second side portion connected to the first side portion, and the EMI shield further defines a second opening on the second side portion.

7. The semiconductor device package of claim 1, wherein the EMI shield further comprises a second side portion opposite the first side portion, and the EMI shield further defines a second opening on the second side portion.

8. The semiconductor device package of claim 1, wherein the EMI shield further comprises a second side portion connected to the first side portion, and the EMI shield further defines a second opening on the second side portion, wherein the first opening and the second opening are formed adjacent to a corner joined by the first side portion and the second side portion.

9. A semiconductor device package comprising:

a substrate having a top surface and a lateral surface perpendicular to the top surface;

a circuit on the top surface of the substrate, the circuit configured for operation at a first frequency;

a package body encapsulating the circuit and having a lateral surface; and

a conformal shield on the package body and covering the lateral surface of the package body, the conformal shield defining a first opening, wherein the conformal shield defining the first opening is configured to shift a resonant frequency that corresponds to the first frequency at which the circuit is configured for operation;

wherein the lateral surface of the package body covered by the conformal shield is substantially coplanar with the lateral surface of the substrate, and

the first opening has a first length L₁ determined by 0.026λ

≤

L₁≤

0.155λ and

λ

is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.

10. The semiconductor device package of claim 9, the conformal shield comprising a first side portion defining the first opening.

11. The semiconductor device package of claim 10, the conformal shield comprising a second side defining a second opening.

12. The semiconductor device package of claim 9, wherein a position of the first opening is configured to reduce an electrical field strength in the semiconductor device package.

13. The semiconductor device package of claim 12, wherein the position is configured to shift the resonance frequency of the semiconductor device package.

14. The semiconductor device package of claim 9, wherein the first opening has a height, and the first length L₁ is greater than the height.

15. A semiconductor device package comprising:

a substrate having a top surface and a lateral surface perpendicular to the top surface;

at least one component on the top surface of the substrate;

a package body encapsulating the at least one component and having a lateral surface; and

an electromagnetic interference (EMI) shield conformally formed on the package body and covering the lateral surface of the package body, the EMI shield comprising an inductor structure;

wherein the lateral surface of the package body covered by the EMI shield is substantially coplanar with the lateral surface of the substrate;

the at least one component is configured to operate at a frequency of operation, and the EMI shield has at least one opening configured to shift a resonant frequency that corresponds to the frequency of operation of the at least one component, and

the at least one opening has a first length L₁ determined by 0.026λ

≤

L₁≤

0.155λ and

λ

is a wavelength related to the frequency of operation of the semiconductor device package, and the frequency of operation is in a range from approximately 5.180 GHz to approximately 5.825 GHz.

16. The semiconductor device package of claim 15, wherein the at least one opening is a first opening, and the inductor structure defines the first opening and a second opening adjacent to the first opening.

17. The semiconductor device package of claim 16, wherein the first opening has the first length, and the first opening and the second opening are separated by a wall portion having a second length, wherein the first length is greater the second length.

18. The semiconductor device package of claim 17, wherein a ratio of the first length to the second length is approximately one to approximately ten.

19. The semiconductor device package of claim 16, the EMI shield defines the opening at a side of the semiconductor device package.