Methods and devices for fabricating and assembling printable semiconductor elements
First Claim
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1. A wafer of printable elements, the wafer comprising:
- a substrate;
a plurality of printable elements native to the substrate, whereineach printable element is disposed on the substrate,each printable element is at least partially undercut from the substrate, andthe printable elements are mechanically connected to the substrate only by alignment maintaining elements.
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Abstract
The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.
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Citations
19 Claims
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1. A wafer of printable elements, the wafer comprising:
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a substrate; a plurality of printable elements native to the substrate, wherein each printable element is disposed on the substrate, each printable element is at least partially undercut from the substrate, and the printable elements are mechanically connected to the substrate only by alignment maintaining elements. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A wafer of printable elements, the wafer comprising:
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a substrate; a plurality of printable elements native to the substrate, wherein each printable element is disposed on the substrate, each printable element is at least partially undercut from the substrate, and the printable elements are mechanically connected to the substrate by alignment maintaining elements.
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Specification