Shield indent trench termination for shielded gate MOSFETs

• US 10,374,076 B2
• Filed: 06/30/2017
• Issued: 08/06/2019
• Est. Priority Date: 06/30/2017
• Status: Active Grant

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Inventors: Wu, Xiaoli, Yedinak, Joseph
• Primary Examiner(s): Parker, Allen L
• Assistant Examiner(s): Ramallo, Gustavo G
• Application Number:
  US15/639,961
• Publication Number:
  US 20190006512A1
• Time in Patent Office: 767 Days
• CPC Class Codes: H01L 29/0649 Dielectric regions, e.g. SiO2 regions, air gaps
• CPC Class Codes: H01L 29/0684 characterised by the shape, relative sizes or dispositions of the semiconductor regions or junctions between the regions
• CPC Class Codes: H01L 29/404 Multiple field plate structures
• CPC Class Codes: H01L 29/407 Recessed field plates, e.g. trench field plates, buried field plates
• CPC Class Codes: H01L 29/41 characterised by their shape, relative sizes or dispositions
• CPC Class Codes: H01L 29/7811 with an edge termination structure guard regions per se H01L29/0619; field plates per se H01L29/402
• CPC Class Codes: H01L 29/7813 with trench gate electrode, e.g. UMOS transistors trench gate electrodes per se H01L29/4236

Abstract

In a general aspect, a power semiconductor device can include a semiconductor region having an active region and a termination region. The device can also include a plurality of trench shield electrodes each having a first portion disposed in the active region and a second portion disposed in the termination region. One or more of the trench shield electrodes can have a second portion that extends a first distance into the termination region, while one or more other trench shield electrodes can have a second portion that extends a second distance into the termination region, the second distance being less than the first distance. The trench shield electrode(s) having the second portion that extends the second distance into the termination region can be interleaved with the trench shield electrode(s) having the second portion that extends the first distance into the termination region.

Claims

1. A power semiconductor device comprising:

a semiconductor region having an active region and a termination region;

a first trench shield electrode defined in the semiconductor region, the first trench shield electrode extending along a longitudinal axis, the first trench shield electrode having a first portion disposed in the active region and a second portion disposed in the termination region, the second portion of the first trench shield electrode extending, along the longitudinal axis, a first distance into the termination region from the active region;

a second trench shield electrode defined in the semiconductor region, the second trench shield electrode extending along the longitudinal axis in parallel with the first trench shield electrode, the second trench shield electrode having a first portion disposed in the active region and a second portion disposed in the termination region, the second portion of the second trench shield electrode extending, along the longitudinal axis, the first distance into the termination region from the active region; and

a third trench shield electrode defined in the semiconductor region between the first trench shield electrode and the second trench shield electrode, the third trench shield electrode extending along the longitudinal axis in parallel with the first trench shield electrode and the second trench shield electrode, the third trench shield electrode having a first portion disposed in the active region and a second portion disposed in the termination region, the second portion of the third trench shield electrode extending, along the longitudinal axis, a second distance into the termination region from the active region, the second distance being less than the first distance.

2. The power semiconductor device of claim 1, further comprising an extension trench that extends along the longitudinal axis, the extension trench being disposed in the termination region between the first trench shield electrode and the second trench shield electrode, the extension trench extending from an end of the third trench shield electrode, the extension trench having a dielectric disposed therein.

3. The power semiconductor device of claim 2, wherein the extension trench is a first extension trench, the power semiconductor device further comprising a second extension trench that extends along the longitudinal axis in parallel with the first extension trench between the first trench shield electrode and the second trench shield electrode, the second extension trench extending from the end of the third trench shield electrode, the second extension trench having a dielectric disposed therein.

4. The power semiconductor device of claim 2, wherein the extension trench has:

a width, along a horizontal axis that is orthogonal to the longitudinal axis, that is less than a width of the third trench shield electrode along the horizontal axis; and

a depth, along a vertical axis that is orthogonal to the longitudinal axis and the horizontal axis, that is less than a depth of the third trench shield electrode along the vertical axis.

5. The power semiconductor device of claim 1, further comprising an extension trench including:

a first extension trench portion that extends along the longitudinal axis, the first extension trench portion being disposed in the termination region between the first trench shield electrode and the second trench shield electrode, the first extension trench portion extending from an end of the third trench shield electrode, the first extension trench portion having a dielectric disposed therein; and

a second extension trench portion that extends along the longitudinal axis, the second extension trench portion being disposed in the termination region between the first trench shield electrode and the second trench shield electrode, the second extension trench portion extending from an end of the first extension trench portion, the second extension trench portion being dielectric filled or having a floating conductive electrode disposed therein.

6. The power semiconductor device of claim 5, wherein:

the first extension trench portion has;

a width, along a horizontal axis that is orthogonal to the longitudinal axis, that is less than a width of the third trench shield electrode along the horizontal axis; and

a depth, along a vertical axis that is orthogonal to the longitudinal axis and the horizontal axis, that is less than a depth of the third trench shield electrode along the vertical axis; and

the second extension trench portion has;

a width, along the horizontal axis, that is greater than the width of the third trench shield electrode along the horizontal axis; and

a depth, along the vertical axis, that is greater than a depth of the third trench shield electrode along the vertical axis.

7. The power semiconductor device of claim 5, wherein the extension trench further includes:

a third extension trench portion that extends along the longitudinal axis, the third extension trench portion being disposed in the termination region between the first trench shield electrode and the second trench shield electrode, the third extension trench portion extending from an end of the second extension trench portion, the third extension trench portion being dielectric filled or having a floating conductive electrode disposed therein; and

a fourth extension trench portion that extends along the longitudinal axis, the fourth extension trench portion being disposed in the termination region between the first trench shield electrode and the second trench shield electrode, the fourth extension trench portion extending from an end of the third extension trench portion, the fourth extension trench portion being dielectric filled or having a floating conductive electrode disposed therein.

8. The power semiconductor device of claim 7, wherein:

the third extension trench portion has;

a width, along a horizontal axis that is orthogonal to the longitudinal axis, that is less than a width of the third trench shield electrode along the horizontal axis; and

a depth, along a vertical axis that is orthogonal to the longitudinal axis and the horizontal axis, that is less than a depth of the third trench shield electrode along the vertical axis; and

the fourth extension trench portion has;

a width, along the horizontal axis, that is greater than the width of the third trench shield electrode along the horizontal axis; and

a depth, along the vertical axis, that is greater than a depth of the third trench shield electrode along the vertical axis.

9. The power semiconductor device of claim 1, wherein the first trench shield electrode, the second trench shield electrode and the third trench shield electrode each includes a conductive electrode disposed on a dielectric layer, the dielectric layer insulating the conductive electrode from the semiconductor region, the conductive electrode being electrically coupled to a source potential of the power semiconductor device.

10. The power semiconductor device of claim 1, wherein the semiconductor region includes an epitaxial layer having a graded doping concentration that increases, from an upper surface of the epitaxial layer, over a depth of the epitaxial layer.

11. The power semiconductor device of claim 1, further comprising a trench-gate metal-oxide field-effect transistor (MOSFET) disposed in the active region.

12. The power semiconductor device of claim 1, wherein the longitudinal axis is a first longitudinal axis, the power semiconductor device further comprising a border trench disposed in the termination region, the border trench extending along a second longitudinal axis that is orthogonal to the first longitudinal axis, the border trench being fluidically associated with an extension trench extending between the third trench shield electrode and the border trench, the border trench being isolated from the first trench shield electrode and the second trench shield electrode by respective mesas defined in the semiconductor region, the border trench being dielectric filled or having a floating conductive electrode disposed therein.

13. The power semiconductor device of claim 12, wherein the extension trench includes a first portion and a second portion, the first portion being dielectric filled and the second portion having a floating conductive electrode disposed therein.