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Battery thermal management system

  • US 10,374,272 B1
  • Filed: 11/04/2015
  • Issued: 08/06/2019
  • Est. Priority Date: 11/04/2015
  • Status: Active Grant
First Claim
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1. A power supply device comprising:

  • an enclosure configured to house one or more cell banks; and

    one or more cell banks provided within the enclosure, wherein each cell bank comprises;

    a first cell frame section defining a plurality of recesses for receiving battery cells, each recess configured to receive and register a corresponding battery cell, the first cell frame section configured to provide conductive connections between the received battery cells;

    a second cell frame section spaced apart from and opposite of the first cell frame section;

    a flexible thermal interface material contacting a middle portion of each battery cell, the thermal interface material configured to maintain contact with the middle portion of each battery cell by flexing in response to the battery cells expanding over time, and the middle portion of each battery cell being between first and second end portions of the respective battery cell; and

    a heat bus disposed between and spaced apart from each of the first cell frame section and the second cell frame section, the heat bus defining a plurality of heat bus openings for receiving the battery cells, each heat bus opening aligned with a corresponding recess of the first cell frame section to allow the heat bus to entirely surround the middle portion of each battery cell and the respective thermal interface material, the heat bus including heat pipes extending in between at least some of the battery cells and across the first cell frame section and the second cell frame section, the heat pipes configured to transfer heat conducted from each battery cell through contact between the heat bus and the respective thermal interface material, the heat bus including a heat sink that extends across the heat bus to contact the heat pipes and transfer heat from the heat pipes to the heat sink, the heat sink inserted through a notch in the enclosure to transfer heat to an environment outside of the power supply device, the heat sink configured to form a watertight seal when inserted through the notch in the enclosure.

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