Balun structure

• US 10,374,571 B2
• Filed: 10/24/2017
• Issued: 08/06/2019
• Est. Priority Date: 11/01/2016
• Status: Active Grant

• Current Assignee: Semiconductor Manufacturing International Corporation
• Original Assignee: Semiconductor Manufacturing International Corporation
• Inventors: Wang, Xi Ning, Cheng, Jen Hao, Zhou, Zhi Jiang, Gao, Jin Feng
• Primary Examiner(s): Takaoka, Dean O
• Application Number:
  US15/792,291
• Publication Number:
  US 20180123550A1
• Time in Patent Office: 651 Days
• Field of Search: 333 25, 333 26, 336200
• CPC Class Codes: H01F 17/0013 with stacked layers
• CPC Class Codes: H01F 2017/0073 with a special conductive pattern, e.g. flat spiral
• CPC Class Codes: H01F 21/12 discontinuously variable, e.g. tapped
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01L 23/5227 Inductive arrangements or effects of, or between, wiring layers other inductive arrangements H01L23/645
• CPC Class Codes: H03H 7/42 Networks for transforming balanced signals into unbalanced signals and vice versa, e.g. baluns

Abstract

A balun structure is provided. The balun structure includes a substrate, a first coil structure and a second coil structure having a spiral shape and on the substrate. The first coil structure includes a first single-layer coil surrounding by first laminated coils that are connected to the first single-layer coil. The second coil structure can include a second single-layer coil and second laminated coils that are connected to the second single-layer coil. A projection of the first single-layer coil and a projection of the second single-layer coil on a surface of the substrate overlap with each other. A number of the second laminated coils is larger than or equal to a number of the first laminated coils. The second laminated coils are arranged alternately with the first laminated coils or the first single-layer coil in a plane parallel to the surface of the substrate.

Claims

1. A balun structure, comprising:

a substrate;

a first coil structure having a spiral shape and on the substrate, the first coil structure including;

a first single-layer coil, and

at least one first laminated coil connected to the first single-layer coil,

wherein the first single-layer coil is surrounded by the at least one first laminated coil; and

a second coil structure having a spiral shape and on the substrate, the second coil structure including;

a second single-layer coil, a projection of the second single-layer coil on a surface of the substrate overlaps a projection of the first single-layer coil on the surface of the substrate, and

at least one second laminated coil connected to the second single-layer coil,

wherein a number of the at least one second laminated coil is larger than or equal to a number of the at least one first laminated coil, and the at least one second laminated coil is arranged alternately with the at least one first laminated coil or the first single-layer coil in a plane parallel to the surface of the substrate.

2. The balun structure of claim 1, wherein:

the second single-layer coil is on the substrate;

the first single-layer coil is on a dielectric layer; and

the first laminated coil includes;

a plurality of first upper-layer metal wires positioned on the dielectric layer,

a plurality of first lower-layer metal wires on the substrate, each first lower-layer metal wire being located corresponding to one first upper-layer metal wire, and

a plurality of first conductive plugs located between the first upper-layer metal wires and the first lower-layer metal wires.

3. The balun structure of claim 2, wherein:

the first coil structure further includes;

a first connecting line on the dielectric layer for connecting the first single-layer coil and one adjacent first upper-layer metal wire,

a second connecting line on the substrate and connecting the first single-layer coil and one adjacent first lower-layer metal wire, and

a first connecting plug located at one end of the second connecting line for connecting the second connecting line and the first single-layer coil; and

the at least one second laminated coil includes an outer second laminated coil surrounding the second single-layer coil, the outer second laminated coil including;

a plurality of outer second upper-layer metal wires on the dielectric layer,

a plurality of outer second lower-layer metal wires on the substrate, each outer second lower-layer metal wire being located corresponding to one outer second upper-layer metal wire, and

a plurality of second conductive plugs between the outer second upper-layer metal wires and the outer second lower-layer metal wires; and

the second coil structure further includes;

a third connecting line on the substrate for connecting the second single-layer coil and one adjacent outer second lower-layer metal wire,

a fourth connecting line on the dielectric layer for connecting the second single-layer coil and one adjacent outer second upper-layer metal wire, and

a second connecting plug located at one end of the fourth connecting line for connecting the fourth connecting line and the second single-layer coil.

4. The balun structure of claim 3, wherein:

a linewidth of the first upper-layer metal wire is longer than a linewidth of the first lower-layer metal wire, and a linewidth of the outer second upper-layer metal wire is shorter than a linewidth of the outer second lower-layer metal wire;

or

the linewidth of the first upper-layer metal wire is shorter than the linewidth of the first lower-layer metal wire, and the linewidth of the outer second upper-layer metal wire is longer than the linewidth of the outer second lower-layer metal wire.

5. The balun structure of claim 3, wherein:

the at least one second laminated coil further includes an inner second laminated coil surrounded by the second single-layer coil;

the inner second laminated coil includes;

a plurality of inner second upper-layer metal wires on the dielectric layer,

a plurality of inner second lower-layer metal wires on the substrate, each inner second lower metal wire is located corresponding to one inner second upper-layer metal wire, and

a plurality of third conductive plugs between the inner second upper-layer metal wires and the inner second lower-layer metal wires and the inner second upper metal wire; and

the second coil structure further includes;

a fifth connecting line on said substrate for connecting the second single-layer coil and one adjacent inner second lower-layer metal wire,

a sixth connecting line on the dielectric layer for connecting the second single-layer coil and one adjacent inner second upper-layer metal wire, and

a third connecting plug located at one end of the sixth connecting line for connecting the sixth connecting line and the second single-layer coil.

6. The balun structure of claim 5, wherein:

a linewidth of the first upper-layer metal wire is longer than a linewidth of the first lower-layer metal wire, a linewidth of the outer second upper-layer metal wire is shorter than a linewidth of the outer second lower-lay metal wire, and a linewidth of the inner second upper-layer metal wire is shorter than a linewidth of the inner second lower-layer metal wire;

or

the linewidth of the first upper-layer metal wire is shorter than the linewidth of the first lower-layer metal wire, the linewidth of the outer second upper-layer metal wire is longer than the linewidth of the outer second lower-lay metal wire, and the linewidth of the inner second upper-layer metal wire is longer than the linewidth of the inner second lower-layer metal wire.

7. The balun structure of claim 1, wherein:

a number of the at least one first laminated coil is less than or equal to four.

8. The balun structure of claim 1, wherein:

a number of the at least one second laminated coil is less than or equal to four.

9. The balun structure of claim 1, wherein:

a linewidth of the first single-layer coil is in a range from about 1 μ

m to about 100 μ

m; and

a linewidth of the second single-layer coil is in a range from about 1 μ

m to about 100 μ

m.

10. The balun structure of claim 4, wherein:

a linewidth of the first upper-layer metal wire s in a range from about 1 μ

m to about 100 μ

m; and

a linewidth of the first lower-layer metal wire is in a range from about 1 μ

m to about 100 μ

m.

11. The balun structure of claim 4, wherein:

a linewidth of the outer second upper-layer metal wire s in a range from about 1 μ

m to about 100 μ

m; and

a linewidth of the outer second lower-layer metal wire is in a range from about 1 μ

m to about 100 μ

m.

12. The balun structure of claim 4, wherein:

a linewidth of the inner second upper-layer metal wire is in a range from about 1 μ

m to about 100 μ

m; and

a linewidth of the inner second lower-layer metal wire is in a range from about 1 μ

m to about 100 μ

m.

13. The balun structure of claim 3, wherein:

a distance between the first upper-layer metal wire and the second upper-layer metal wire is shorter than a distance between the first lower-layer metal wire and the second lower-layer metal wire.

14. The balun structure of claim 13, wherein:

the distance between the first upper-layer metal wire and the second upper-layer metal wire is in a range from about 1 μ

m to about 100 μ

m.

15. The balun structure of claim 13, wherein:

the distance between the first lower-layer metal wire and the second lower-layer metal wire is in a range from about 1 μ

m to about 100 μ

m.

16. The balun structure of claim 3, wherein:

a material of the first single-layer coil, the first upper-layer metal wire, the first connecting line, the outer second upper-layer metal wire, and the fourth connecting line is copper.

17. The balun structure of claim 3, wherein:

a material of the second single-layer coil, the first lower-layer metal wire, the second connecting line, the outer second lower-layer metal wire, and the third connecting line is aluminum.

18. The balun structure of claim 5, wherein:

a material of the first single-layer coil, the first upper-layer metal wire, the first connecting line, the outer second upper-layer metal wire, the fourth connecting line, the inner second upper-layer metal wire, and the sixth connecting line is copper.

19. The balun structure of claim 5, wherein:

a material of the second single-layer coil, the first lower-layer metal wire, the second connecting line, the outer second lower-layer metal wire, the third connecting line, the inner second lower-layer metal wire, and the fifth connecting line is aluminum.

20. The balun structure of claim 1, wherein:

the first coil structure is a differential coil, and the second coil structure is a spiral coil;

or

the first coil structure is a spiral coil, and the second coil structure is a differential coil.