Re-generation and re-transmission of millimeter waves for building penetration

• US 10,374,710 B2
• Filed: 03/20/2018
• Issued: 08/06/2019
• Est. Priority Date: 04/04/2014
• Status: Active Grant

• Current Assignee: Nxgen Partners Ip, LLC (NxGen Partners LLC)
• Original Assignee: Nxgen Partners Ip, LLC (NxGen Partners LLC)
• Inventors: Ashrafi, Solyman
• Primary Examiner(s): Pham, Tuan
• Application Number:
  US15/926,087
• Publication Number:
  US 20180262272A1
• Time in Patent Office: 504 Days
• CPC Class Codes: H04B 10/11 Arrangements specific to free-space transmission, i.e. transmission through air or vacuum
• CPC Class Codes: H04B 10/2575 Radio-over-fibre, e.g. radio frequency signal modulated onto an optical carrier
• CPC Class Codes: H04B 10/2581 Multimode transmission
• CPC Class Codes: H04B 10/50 Transmitters
• CPC Class Codes: H04B 10/5161 Combination of different modulation schemes
• CPC Class Codes: H04B 10/532 Polarisation modulation
• CPC Class Codes: H04B 10/541 Digital intensity or amplitude modulation
• CPC Class Codes: H04J 14/00 Optical multiplex systems
• CPC Class Codes: H04L 2025/0335 characterised by the type of transmission
• CPC Class Codes: H04L 2025/0342 QAM
• CPC Class Codes: H04L 25/00 Baseband systems
• CPC Class Codes: H04L 25/03006 Arrangements for removing intersymbol interference
• CPC Class Codes: H04L 25/03343 Arrangements at the transmitter end
• CPC Class Codes: H04L 27/3405 Modifications of the signal space to increase the efficiency of transmission, e.g. reduction of the bit error rate, bandwidth, or average power
• CPC Class Codes: H04L 27/362 Modulation using more than one carrier, e.g. with quadrature carriers, separately amplitude modulated H04L27/366 takes precedence
• CPC Class Codes: H04L 27/366 Arrangements for compensating undesirable properties of the transmission path between the modulator and the demodulator
• CPC Class Codes: H04L 63/06 for supporting key management in a packet data network cryptographic mechanisms or cryptographic arrangements for key management H04L9/08
• CPC Class Codes: H04L 9/0858 Details about key distillation or coding, e.g. reconciliation, error correction, privacy amplification, polarisation coding or phase coding
• CPC Class Codes: H04L 9/3093 involving Lattices or polynomial equations, e.g. NTRU scheme
• CPC Class Codes: H04W 12/04 Key management, e.g. using generic bootstrapping architecture [GBA]

Abstract

A system for enabling signal penetration into a building includes first circuitry, located on an outside of the building, for receiving signals at a first frequency that experiences losses when penetrating into an interior of the building and converting the received signals at the first frequency into a first format that overcome the losses caused by penetrating into the interior of the building over a wireless communications link. The first circuitry further includes a first transceiver, implementing a first transmission chipset for RF transmissions in the first format that counteracts losses occurring when penetrating into the interior of the building, for receiving the signals at the first frequency and converting the received signals at the first frequency into the first format that overcomes the losses caused by penetrating into the interior of the building. Second circuitry, located on the interior of the building is communicatively linked with the first circuitry for receiving and transmitting the converted received signals in the first format. The second circuitry further includes a second transceiver, implementing the first transmission chipset, for receiving and transmitting the converted signals in the first format from/to the first transceiver on the exterior of the building.

Claims

1. A system for enabling signal penetration into a building, comprising:

first circuitry, located on an outside of the building, for receiving signals at a first frequency that experiences losses when penetrating into an interior of the building and converting the received signals at the first frequency into a first format that overcome losses caused by penetrating into the interior of the building over a wireless communications link, wherein the first circuitry further comprises;

a first transceiver, implementing a first transmission chipset for RF transmissions in the first format that counteracts losses occurring when penetrating into the interior of the building, for receiving the signals at the first frequency and converting the received signals at the first frequency into the first format that overcomes the losses caused by penetrating into the interior of the building; and

second circuitry, located on the interior of the building and communicatively linked with the first circuitry via the wireless communications link, for receiving and transmitting the converted received signals in the first format that counteracts the losses caused by penetrating into the interior of the building from/to the first transceiver, wherein the second circuitry further comprises;

a second transceiver, implementing the first transmission chipset, for receiving and transmitting the converted signals in the first format from/to the first transceiver on the outside of the building.

2. The system of claim 1, further comprising a Wi-Fi router connected to the second transceiver for converting between the converted signals in the first format and a Wi-Fi version of the signals and for transmitting and receiving the Wi-Fi version of the signals within the interior of the building.

3. The system of claim 1, wherein the first frequency is from the group consisting of 3.5 GHz, 24 GHz, 28 GHz, 39 GHz, 60 GHz, 71 GHz, and 81 GHz.

4. The system of claim 1, wherein the received signals at the first frequency are transmitted using a first protocol.

5. The system of claim 4, wherein the first protocol is from the group consisting of 2G, 3G, 4G-LTE, 5G, 5G NR (New Radio) and WiGi.

6. The system of claim 1, wherein the first transceiver further comprises a third transceiver, implementing the first transmission chipset, for transmitting and receiving the converted signals in the first format from/to the first transceiver and transmitting and receiving the converted signals in the first format to/from the second transceiver in the interior of the building.

7. The system of claim 1, wherein the first transmission chipset comprises the Peraso chipset.

8. The system of claim 1 further including at least one solar panel associated with the first circuitry, the at least one solar panel providing power for operating the first circuitry.

9. The system of claim 1 further including a laser power system for providing power to the first circuitry, the laser power system further comprising:

a laser for generating a beam for transmission of light energy from the interior of the building to the outside of the building; and

a photovoltaic receiver for receiving the light energy from the beam and generating electrical energy to power the first circuitry.

10. The system of claim 1 further including an inductive coupling system for providing power to the first circuitry, the inductive coupling system further comprising:

a first inductive coil located on the interior of the building and connected to a power system located in the interior of the building; and

a second inductive coil located on the outside of the building and inductively coupled to the first inductive coil, the second inductive coil connected to provide electrical energy to the first circuitry.

11. The system of claim 1 further including an magnetic resonance coupling system for providing power to the first circuitry, the magnetic resonance coupling system further comprising:

a first magnetic resonance coil located on the interior of the building and connected to a power system located in the interior of the building; and

a second magnetic resonance coil located on the outside of the building and magnetic resonance coupled to the first magnetic resonance coil, the second magnetic resonance coil connected to provide electrical energy to the first circuitry.

12. A system for enabling signal penetration into a building, comprising:

first circuitry, located on an outside of the building, for receiving millimeter wave signals that experience losses when penetrating into an interior of the building and converting the received millimeter wave signals into a first format that overcome losses caused by penetrating into the interior of the building over a wireless communications link, wherein the first circuitry further comprises;

a first transceiver, implementing a Peraso chipset for RF transmissions in the first format that counteracts losses occurring when penetrating into the interior of the building, for receiving the millimeter wave signals and converting the received millimeter wave signals into the first format that overcomes the losses caused by penetrating into the interior of the building; and

second circuitry, located on the interior of the building and communicatively linked with the first circuitry via the wireless communications link, for receiving and transmitting the converted millimeter wave signals in the first format that counteracts the losses caused by penetrating into the interior of the building from/to the first transceiver and converting the converted millimeter wave signals to a second format for transmission to a wireless devices within the building, the second circuitry further comprising;

a second transceiver, implementing the Peraso chipset, for receiving and transmitting the converted millimeter wave signals in the first format from/to the first transceiver on the outside of the building.

13. The system of claim 12, further comprising a Wi-Fi router connected to the second transceiver for converting between the converted signals in the first format and a Wi-Fi version of the signal and for transmitting and receiving the Wi-Fi version of the signal within the interior of the building.

14. The system of claim 12, wherein the received millimeter wave signals at a first frequency are transmitted using a first protocol.

15. The system of claim 14, wherein the first protocol is from the group consisting of 2G, 3G, 4G-LTE, 5G, 5G NR (New Radio) and WiGi.

16. The system of claim 12, wherein the first transceiver further comprises a third transceiver, implementing the Peraso chipset, for transmitting and receiving the converted signals in the first format from/to the first transceiver and transmitting and receiving the converted signals in the first format to/from the interior of the building.

17. The system of claim 12 further including at least one solar panel associated with the first circuitry, the at least one solar panel providing power for operating the first circuitry.

18. The system of claim 12 further including a laser power system for providing power to the first circuitry, the laser power system further comprising:

a laser for generating a beam for transmission of light energy from the interior of the building to the outside of the building; and

a photovoltaic receiver for receiving the light energy from the beam and generating electrical energy to power the first circuitry.

19. The system of claim 12 further including an inductive coupling system for providing power to the first circuitry, the inductive coupling system further comprising:

a first inductive coil located on the interior of the building and connected to a power system located in the interior of the building; and

a second inductive coil located on the outside of the building and inductively coupled to the first inductive coil, the second inductive coil connected to provide electrical energy to the first circuitry.

20. The system of claim 12 further including an magnetic resonance coupling system for providing power to the first circuitry, the magnetic resonance coupling system further comprising:

a first magnetic resonance coil located on the interior of the building and connected to a power system located in the interior of the building; and

a second magnetic resonance coil located on the outside of the building and magnetic resonance coupled to the first magnetic resonance coil, the second magnetic resonance coil connected to provide electrical energy to the first circuitry.