Multi-electrode molecular sensing devices and methods of making the same

• US 10,378,103 B2
• Filed: 10/04/2018
• Issued: 08/13/2019
• Est. Priority Date: 07/26/2016
• Status: Expired due to Fees

• Current Assignee: Roswell Me Incorporated (Soulbrain Holdings Co., Ltd.)
• Original Assignee: Roswell Biotechnologies Inc.
• Inventors: Jin, Sungho, Merriman, Barry L., Geiser, Tim, Choi, Chulmin, Mola, Paul
• Primary Examiner(s): Wallenhorst, Maureen
• Application Number:
  US16/152,190
• Publication Number:
  US 20190033244A1
• Time in Patent Office: 313 Days
• Field of Search: 436 86, 436 89, 436 94, 436149, 436150, 436151, 436174, 436512, 436518, 436527, 422 8201, 422 8202, 422 8203, 422 8204, 435 61, 427 971, 427 973, 427 974, 427 984, 427117, 427118, 427123, 427124, 427125, 4271261-1266
• CPC Class Codes: B81B 2201/0214 Biosensors; Chemical sensors
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: B81B 2203/04 Electrodes
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: C12Q 1/6869 Methods for sequencing
• CPC Class Codes: C23C 16/01 on temporary substrates, e.g. substrates subsequently removed by etching
• CPC Class Codes: G01N 27/04 by investigating resistance
• CPC Class Codes: G01N 27/221 by investigating the dielectric properties using microwaves G01N22/00; measuring loss factors or dielectric constants per se G01R27/26
• CPC Class Codes: G01N 27/3278 involving nanosized elements, e.g. nanogaps or nanoparticles nanopores G01N33/48721; magnetic beads G01N27/745
• CPC Class Codes: G01N 27/4145 specially adapted for biomolecules, e.g. gate electrode with immobilised receptors

Abstract

A molecular sensor includes a substrate defining a substrate plane, and a plurality of pairs of electrode sheets above or below the substrate at an angle to the substrate plane. The molecular sensor further includes a plurality of inner dielectric sheets between each electrode sheet in each pair of electrode sheets of the plurality of pairs, and an outer dielectric sheet between each pair of electrode sheets of the plurality of pairs.

Claims

1. A method of manufacturing structure usable in a molecular sensor device, the method comprising:

forming a stack by at least;

providing a first outer dielectric layer;

depositing a first electrode layer on the first outer dielectric layer;

depositing an inner dielectric layer on the first electrode layer;

depositing a second electrode layer on the inner dielectric layer; and

depositing a second outer dielectric layer on the second electrode layer, wherein the inner dielectric layer has a first thickness and the second outer dielectric layer has a second thickness at least one order of magnitude greater than the first thickness, wherein the first electrode layer and second electrode layer are deposited with a thickness of 1 to 40 nm, wherein the inner dielectric layer is deposited with a thickness of 1 to 40 nm, and wherein the second outer dielectric layer is deposited with a thickness between 50 to 2,000 nm;

slicing through the stack at least once at an angle to the layers in the stack to form a plurality of chips from the sliced portions of the stack; and

attaching the plurality of chips to a substrate so that the sliced portions of the first electrode layer and the second electrode layer form a plurality of pairs of electrode sheets at an angle to a substrate plane defined by the substrate, and so that the sliced portions of the inner dielectric layer forms a plurality of inner dielectric sheets with each inner dielectric sheet between each electrode sheet in each pair of electrode sheets.

2. The method of claim 1, wherein forming the stack further includes repeating the deposition of the first electrode layer, the inner dielectric layer, the second electrode layer, and the second outer dielectric layer at least once so that each chip of the plurality of chips includes multiple pairs of electrode sheets.

3. The method of claim 1, further comprising forming a groove located on an exposed end portion of each inner dielectric sheet.

4. The method of claim 1, further comprising depositing a dielectric cover layer at an angle or perpendicular to the plurality of pairs of electrode sheets opposite the substrate to define a gap exposing a portion of the plurality of pairs of electrode sheets.

5. The method of claim 1, further comprising roughening an exposed edge of each electrode sheet.

6. The method of claim 1, further comprising depositing a gate electrode parallel to the substrate plane and perpendicular to an electrode plane defined by an electrode sheet in the plurality of pairs of electrode sheets.

7. The method of claim 1, further comprising forming a plurality of channels, each channel arranged to introduce a fluid to exposed portions of at least two pairs of electrode sheets of the plurality of pairs of electrode sheets.