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Fingerprint sensor, method for manufacturing fingerprint sensor, and terminal

  • US 10,380,406 B2
  • Filed: 08/03/2017
  • Issued: 08/13/2019
  • Est. Priority Date: 08/16/2016
  • Status: Active Grant
First Claim
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1. A fingerprint sensor, comprising:

  • a chip unit having a first surface and a second surface opposite the first surface, the first surface being configured to receive a touch operation;

    a first adhesive layer;

    a second adhesive layer;

    an isolation element arranged on the second surface;

    a substrate layer having a first side and a second side opposite the first side, the first side being provided with the second adhesive layer and attached to the isolation element via the second adhesive layer, and the second side being provided with the first adhesive layer; and

    a support element attached to the substrate layer to support the chip unit;

    the substrate layer being attached to the support element via the first adhesive layer, and the second adhesive layer having a larger glutinosity than the first adhesive layer.

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