Fingerprint sensor, method for manufacturing fingerprint sensor, and terminal

• US 10,380,406 B2
• Filed: 08/03/2017
• Issued: 08/13/2019
• Est. Priority Date: 08/16/2016
• Status: Active Grant

• Current Assignee: Guangdong OPPO Mobile Telecommunications Corporation Limited
• Original Assignee: Guangdong OPPO Mobile Telecommunications Corporation Limited
• Inventors: Zhang, Wenzhen
• Primary Examiner(s): Shah, Utpal D
• Application Number:
  US15/667,931
• Publication Number:
  US 20180053037A1
• Time in Patent Office: 740 Days
• CPC Class Codes: A61B 5/00 Measuring for diagnostic purposes radiation diagnosis A61B6/00; diagnosis by ultrasonic, sonic or infrasonic waves A61B8/00; Identification of persons
• CPC Class Codes: A61B 5/117 Identification of persons methods or arrangements for recognising patterns, e.g. fingerprints, G06F18/00, G06V40/00; identification of persons by analysing their voice or speech G10L17/00
• CPC Class Codes: G01B 11/24 for measuring contours or curvatures
• CPC Class Codes: G06F 1/1684 Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
• CPC Class Codes: G06V 40/1329 Protecting the fingerprint sensor against damage caused by the finger
• CPC Class Codes: H01L 24/95 at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H04M 1/26 Devices for calling a subscriber H04M1/66 takes precedence
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence

Abstract

A fingerprint sensor, a terminal, and a method for manufacturing a fingerprint sensor are provided. The fingerprint sensor includes a chip unit and a first adhesive layer. The chip unit includes a first surface and a second surface opposite to the first surface. The first surface is configured to receive a touch operation. The first adhesive layer is directly or indirectly attached to the second surface in a peelable manner.

Claims

1. A fingerprint sensor, comprising:

a chip unit having a first surface and a second surface opposite the first surface, the first surface being configured to receive a touch operation;

a first adhesive layer;

a second adhesive layer;

an isolation element arranged on the second surface;

a substrate layer having a first side and a second side opposite the first side, the first side being provided with the second adhesive layer and attached to the isolation element via the second adhesive layer, and the second side being provided with the first adhesive layer; and

a support element attached to the substrate layer to support the chip unit;

the substrate layer being attached to the support element via the first adhesive layer, and the second adhesive layer having a larger glutinosity than the first adhesive layer.

2. The fingerprint sensor of claim 1, wherein the substrate layer comprises a first substrate layer and a second substrate layer, the first substrate layer is attached to a side of the support element facing the chip unit, and the second substrate layer is attached to a side of the support element away from the chip unit.

3. The fingerprint sensor of claim 1, further comprising a base plate, wherein the support element is attached to the base plate to support the chip unit.

4. The fingerprint sensor of claim 1, wherein the support element is configured to be switched between a liquid state and a solid state.

5. The fingerprint sensor of claim 1, wherein the fingerprint sensor further comprises a circuit board arranged between the substrate layer and the second surface, and electrically coupled to the chip unit.

6. A terminal, comprising:

a chip unit having a first surface exposed outside of the terminal, and a second surface opposite the first surface;

a circuit board electrically coupled to the chip unit; and

a first adhesive layer;

a second adhesive layer;

a support element; and

a substrate layer having a first side and a second side opposite the first side, the first side being provided with the first adhesive layer and attached to the second surface via the first adhesive layer, and the second side being provided with the second adhesive layer and attached to the support element via the second adhesive layer;

the second adhesive layer has a larger glutinosity than the first adhesive layer.

7. The terminal of claim 6, wherein the support element is configured to be switched between a liquid state and a solid state.

8. The terminal of claim 6, further comprising a protection element, wherein the chip unit has a peripheral side detachably connected to the protection element.

9. The terminal of claim 6, wherein the terminal further comprises a mother board electrically coupled to the chip unit via the circuit board.

10. A method for manufacturing a fingerprint sensor, comprising:

providing a chip unit, wherein the chip unit comprises a first surface and a second surface opposite the first surface, the first surface being configured to receive a touch operation;

providing a first adhesive layer;

providing a second adhesive layer;

providing an isolation element arranged on the second surface;

providing a substrate layer having a first side and a second side opposite the first side, the first side being provided with the second adhesive layer and attached to the isolation element via the second adhesive layer, and the second side being provided with the first adhesive layer; and

providing a support element attached to the substrate layer to support the chip unit;

the substrate layer being attached to the support element via the first adhesive layer, and the second adhesive layer having a larger glutinosity than the first adhesive layer.