Semiconductor device

• US 10,380,472 B2
• Filed: 04/30/2018
• Issued: 08/13/2019
• Est. Priority Date: 12/27/2006
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Tsuchiya, Kaoru
• Primary Examiner(s): Lee, Michael G
• Assistant Examiner(s): Tardif, David
• Application Number:
  US15/966,578
• Publication Number:
  US 20180247174A1
• Time in Patent Office: 470 Days
• Field of Search: 235492
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card

Abstract

A semiconductor device that is resistant to bending stress and has a structure in which an antenna circuit, an electric double layer capacitor for storing electricity, and the like are formed over a signal processing circuit that is provided over a substrate and has a charging circuit. The signal processing circuit having the charging circuit is provided over a substrate, and the antenna circuit and the electric double layer capacitor are provided over the signal processing circuit. The antenna circuit is electrically connected to the signal processing circuit, and the electric double layer capacitor is electrically connected to the charging circuit. With such a structure, a wiring for connecting the charging circuit and the electric double layer capacitor can be made short. Accordingly, a semiconductor device that is resistant to bending stress can be provided.

Claims

1. A semiconductor device comprising:

a flexible substrate;

a signal processing circuit comprising a charging circuit over the flexible substrate;

an insulating film over the signal processing circuit;

a conductive layer over the insulating film;

an antenna over the insulating film and electrically connected to the signal processing circuit through the conductive layer; and

a battery over the insulating film and electrically connected to the charging circuit,

wherein the insulating film comprises a first surface provided with the battery, the antenna and the conductive layer and a second surface facing the signal processing circuit opposite to the first surface.

2. The semiconductor device according to claim 1, wherein the charging circuit and the battery are overlapped with each other.

3. The semiconductor device according to claim 1, wherein the charging circuit includes a regulator for controlling voltage and a diode having a rectification property.

4. The semiconductor device according to claim 1, wherein the battery includes an electric double layer capacitor.

5. A semiconductor device comprising:

a flexible substrate;

a circuit comprising a first transistor and a second transistor over the flexible substrate;

an insulating film over the circuit;

a conductive layer over the insulating film;

an antenna over the insulating film and electrically connected to the first transistor through the conductive layer; and

a battery over the insulating film and electrically connected to the second transistor,

wherein the insulating film comprises a first surface provided with the battery, the antenna and the conductive layer and a second surface facing the circuit opposite to the first surface.

6. The semiconductor device according to claim 5, wherein the second transistor and the battery are overlapped with each other.

7. The semiconductor device according to claim 5, wherein the battery includes an electric double layer capacitor.