Wafer debonding and cleaning apparatus and method

• US 10,381,254 B2
• Filed: 09/08/2014
• Issued: 08/13/2019
• Est. Priority Date: 11/29/2011
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chiou, Wen-Chih, Lin, Yu-Liang, Tu, Hung-Jung
• Primary Examiner(s): Cormier, David G
• Assistant Examiner(s): Bucci, Thomas
• Application Number:
  US14/479,806
• Publication Number:
  US 20140374031A1
• Time in Patent Office: 1,800 Days
• Field of Search: 134 56 R, 134 26, 134 19, 134 13, 134 3, 134 32, 134 34, 134 61, 134 1, 1341032, 134105, 134137, 134 16, 134 18, 134 11, 134902, 438464, 438458, 438455, 438459, 438460, 438463, 438106, 438118, 438457, 438977
• CPC Class Codes: H01L 21/02057 Cleaning during device manufacture
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68381 Details of chemical or physical process used for separating the auxiliary support from a device or wafer
• CPC Class Codes: Y10T 156/11 Methods of delaminating, per se; i.e. , separating at bonding face
• CPC Class Codes: Y10T 156/19 Delaminating means

Abstract

A wafer debonding and cleaning apparatus comprises a wafer debonding module configured to separate a semiconductor wafer from a carrier wafer. The wafer debonding and cleaning apparatus also comprises a first wafer cleaning module configured perform a first cleaning process to clean a surface of the semiconductor wafer. The wafer debonding and cleaning apparatus further comprises an automatic wafer handling module configured to transfer the semiconductor wafer from one of the wafer debonding module or the first wafer cleaning module to the other of the wafer debonding module or the first wafer cleaning module. The semiconductor wafer has a thickness ranging from about 0.20 μm to about 3 mm.

Claims

1. A wafer debonding and cleaning apparatus comprising:

a wafer debonding module configured to separate semiconductor wafers from carrier wafers;

a first wafer cleaning module configured to perform a first cleaning process to clean surfaces of a first plurality of the semiconductor wafers;

a second wafer cleaning module configured to perform a second cleaning process to clean surfaces of a second plurality of the semiconductor wafers;

a storage unit configured to store multiple wafer assemblies respectively having one of the semiconductor wafers bonded to one of the carrier wafers by an adhesive;

a first automatic wafer handling module comprising a first robotic arm; and

a second automatic wafer handling module comprising a second robotic arm that is separated from the storage unit by the first automatic wafer handling module and that is located between the first wafer cleaning module and the second wafer cleaning module, wherein the second automatic wafer handling module is configured to transfer the first plurality of the semiconductor wafers from the first automatic wafer handling module directly to the first wafer cleaning module and to transfer the second plurality of the semiconductor wafers from the first automatic wafer handling module directly to the second wafer cleaning module.

2. The wafer debonding and cleaning apparatus of claim 1, wherein the storage unit is moveable and is configured to mate with the wafer debonding module.

3. The wafer debonding and cleaning apparatus of claim 1,

wherein the second automatic wafer handling module is separated from the storage unit along a first line extending along a first direction and wherein the second automatic wafer handling module is separated from the first wafer cleaning module and the second wafer cleaning module along a second line extending along a second direction;

and

wherein the first line is perpendicular to the second line.

4. The wafer debonding and cleaning apparatus of claim 1, wherein a film frame directly contacts and completely covers sidewalls of one of the semiconductor wafers, the film frame configured to support the one of the semiconductor wafers after removal of one of the carrier wafers from the one of the semiconductor wafers.

5. The wafer debonding and cleaning apparatus of claim 4, further comprising:

a film frame cleaning module configured to clean the one of the semiconductor wafers having the film frame.

6. The wafer debonding and cleaning apparatus of claim 5, further comprising:

a buffer module configured to polish the semiconductor wafers, wherein the buffer module is located between the first automatic wafer handling module and the second automatic wafer handling module.

7. The wafer debonding and cleaning apparatus of claim 6, wherein the second automatic wafer handling module is closer to both the first wafer cleaning module and the second wafer cleaning module than the first automatic wafer handling module.

8. The wafer debonding and cleaning apparatus of claim 5, wherein the storage unit is a movable storage unit.

9. A wafer debonding and cleaning apparatus comprising:

a wafer debonding module configured to perform a wafer debonding process to separate semiconductor wafers from carrier wafers;

a first wafer cleaning module configured to clean surfaces of a first plurality of the semiconductor wafers;

a second wafer cleaning module configured to clean surfaces of a second plurality of the semiconductor wafers, wherein the first wafer cleaning module and the second wafer cleaning module are configured to perform a same type of cleaning operation;

an automatic wafer handling module configured to transfer the semiconductor wafers into and out of the wafer debonding module, the first wafer cleaning module, and the second wafer cleaning module, wherein the semiconductor wafers have thicknesses ranging from about 0.20 um to about 3 mm; and

a storage unit comprising a front opening unified pod (FOUP), wherein the FOUP is arranged along a first side of the automatic wafer handling module and is configured to mate to the wafer debonding module, and wherein the first wafer cleaning module and the second wafer cleaning module are arranged along a second side of the automatic wafer handling module opposing the first side.

10. The wafer debonding and cleaning apparatus of claim 9, wherein the automatic wafer handling module comprises:

a robotic arm configured to support the semiconductor wafers; and

a blade portion configured to handle a warped semiconductor wafer.

11. The wafer debonding and cleaning apparatus of claim 9,

wherein the storage unit is configured to align and to mate directly with a film frame module that is configured to apply or remove a film frame from respective ones of the semiconductor wafers.

12. The wafer debonding and cleaning apparatus of claim 9, wherein the automatic wafer handling module is configured to transfer the first plurality of the semiconductor wafers from the wafer debonding module directly to the first wafer cleaning module and to transfer the second plurality of the semiconductor wafers from the wafer debonding module directly to the second wafer cleaning module.

13. The wafer debonding and cleaning apparatus of claim 9, wherein a film frame is in direct contact with sidewalls of respective ones of the first plurality of the semiconductor wafers and the second plurality of the semiconductor wafers.

14. A workpiece debonding and cleaning apparatus, comprising:

a debonding module configured to separate semiconductor workpieces from carrier workpieces;

a first cleaning module configured to perform a first cleaning operation on a first plurality of the semiconductor workpieces;

a second cleaning module configured to perform a second cleaning operation, which is a same type as the first cleaning operation, on a second plurality of the semiconductor workpieces different than the first plurality of the semiconductor workpieces;

an automatic workpiece handling module configured to transfer the semiconductor workpieces from the debonding module to the first cleaning module or to the second cleaning module;

a control unit configured to determine if the first cleaning module and the second cleaning module are in use and to operate the automatic workpiece handling module to transfer one of the semiconductor workpieces from the debonding module directly to either the first cleaning module or to the second cleaning module depending on the determined use of the first cleaning module and the second cleaning module; and

a storage unit configured to store the first plurality of the semiconductor workpieces, wherein the storage unit is moveable and is configured to store multiple wafer assemblies and to align to and to mate with the debonding module, and wherein the automatic workpiece handling module is configured to transfer the first plurality of the semiconductor workpieces from the storage unit to the debonding module and to return the first plurality of the semiconductor workpieces from the debonding module to the storage unit.

15. The workpiece debonding and cleaning apparatus of claim 14, wherein the storage unit comprises a front opening unified pod (FOUP).

16. The workpiece debonding and cleaning apparatus of claim 14, wherein the debonding module is configured to utilize laser light, thermal energy, or electromagnetic radiation to weaken bonds between the carrier workpieces and the semiconductor workpieces.

17. The workpiece debonding and cleaning apparatus of claim 14, wherein the first cleaning module is configured to remove an adhesive material from the semiconductor workpieces using a solvent solution comprising a mixture of deionized water, tetramethylammonium hydroxide, potassium hydroxide, methylpyrrolidone, isopropanol, ethanol, acetone, hydrogen peroxide, dimethyl sulfoixde, limonene, menthanol, and tetrabutylammonium fluoride trihydrate.

18. The workpiece debonding and cleaning apparatus of claim 14, further comprising:

a scanning element configured to scan barcodes or markings associated with the semiconductor workpieces prior to the automatic workpiece handling module providing the semiconductor workpieces to the debonding module, the first cleaning module, or the second cleaning module.

19. The workpiece debonding and cleaning apparatus of claim 14, further comprising:

a buffer module configured to polish the semiconductor workpieces; and

a second automatic workpiece handling module, wherein the buffer module is arranged spatially between the automatic workpiece handling module and the second automatic workpiece handling module.

20. The workpiece debonding and cleaning apparatus of claim 19, further comprising:

a film frame module configured to apply or remove a film frame from respective ones of the semiconductor workpieces, wherein the film frame is configured to support the semiconductor workpieces in an absence of the carrier workpieces; and

wherein the automatic workpiece handling module is arranged spatially between the film frame module, the debonding module, and the buffer module; and

wherein the second automatic workpiece handling module is arranged spatially between the first cleaning module, the second cleaning module, and the buffer module.