Selectively cross-linked thermal interface materials
First Claim
1. A process of forming a thermal interface material structure, the process comprising:
- selectively masking a putty pad that includes ultraviolet (UV) curable crosslinkers to form a masked putty pad, the masked putty pad having a first area that is exposed and a second area that is masked;
exposing the masked putty pad to UV light to form a selectively cross-linked putty pad;
disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly; and
compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.
1 Assignment
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Accused Products
Abstract
A process of forming a thermal interface material structure includes selectively masking a putty pad that includes ultraviolet (UV) curable cross-linkers to form a masked putty pad. The masked putty pad has a first area that is exposed and a second area that is masked. The process also includes exposing the masked putty pad to UV light to form a selectively cross-linked putty pad. The process includes disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly. The process further includes compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.
12 Citations
9 Claims
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1. A process of forming a thermal interface material structure, the process comprising:
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selectively masking a putty pad that includes ultraviolet (UV) curable crosslinkers to form a masked putty pad, the masked putty pad having a first area that is exposed and a second area that is masked; exposing the masked putty pad to UV light to form a selectively cross-linked putty pad; disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly; and compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification