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Selectively cross-linked thermal interface materials

  • US 10,381,324 B2
  • Filed: 11/15/2017
  • Issued: 08/13/2019
  • Est. Priority Date: 03/22/2017
  • Status: Active Grant
First Claim
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1. A process of forming a thermal interface material structure, the process comprising:

  • selectively masking a putty pad that includes ultraviolet (UV) curable crosslinkers to form a masked putty pad, the masked putty pad having a first area that is exposed and a second area that is masked;

    exposing the masked putty pad to UV light to form a selectively cross-linked putty pad;

    disposing the selectively cross-linked putty pad between an electrical component and a heat spreader to form an assembly; and

    compressing the assembly to form a thermal interface material structure that includes a selectively cross-linked thermal interface material.

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