Placement of vias in printed circuit board circuits
First Claim
1. An electronic device comprising a printed circuit board (PCB) device, the PCB device comprising:
- a first trace on a first layer;
a second trace on a second layer, wherein the second trace is electrically isolated from the first trace;
a first trace via including a first pad on the first layer, wherein the first pad is electrically connected to the first trace;
a second trace via including a second pad on the second layer, wherein the second pad is electrically connected to the second trace;
an antipad surrounding the first trace via and the second trace via;
a first ground via through the first layer and electrically connected to a ground plane, wherein the first ground via includes a first ground pad on the first layer positioned between the first trace and the second trace;
a second ground via through the first layer and electrically connected to the ground plane, wherein the second ground via includes a second ground pad on the first layer, wherein the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad;
a third ground via through the first layer and electrically connected to the ground plane, wherein the third ground via includes a third ground pad on the first layer;
a fourth ground via through the first layer and electrically connected to the ground plane, wherein the fourth ground via includes a fourth ground pad on the first layer, wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.
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Abstract
In some examples, an electronic device includes a printed circuit board (PCB) device that includes a first trace electrically connected to a first pad of a first trace via on a first layer and a second trace electrically connected to a second pad of a second trace via on a second layer. In some examples, the PCB device also includes four ground pads on the first layer and an antipad surrounding the two trace vias, where a first ground pad is positioned between the first trace and the second trace, where the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad, and wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad.
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Citations
15 Claims
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1. An electronic device comprising a printed circuit board (PCB) device, the PCB device comprising:
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a first trace on a first layer; a second trace on a second layer, wherein the second trace is electrically isolated from the first trace; a first trace via including a first pad on the first layer, wherein the first pad is electrically connected to the first trace; a second trace via including a second pad on the second layer, wherein the second pad is electrically connected to the second trace; an antipad surrounding the first trace via and the second trace via; a first ground via through the first layer and electrically connected to a ground plane, wherein the first ground via includes a first ground pad on the first layer positioned between the first trace and the second trace; a second ground via through the first layer and electrically connected to the ground plane, wherein the second ground via includes a second ground pad on the first layer, wherein the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad; a third ground via through the first layer and electrically connected to the ground plane, wherein the third ground via includes a third ground pad on the first layer; a fourth ground via through the first layer and electrically connected to the ground plane, wherein the fourth ground via includes a fourth ground pad on the first layer, wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector of the line from the first pad to the second pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method for constructing a printed circuit board (PCB), the method comprising:
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drilling a first trace via, a second trace via, a first ground via, a second ground via, a third ground via, and a fourth ground via in the PCB; filling the first trace via, a second trace via, a first ground via, a second ground via, a third ground via, and a fourth ground via with conductive material; forming a first pad on a first layer of the PCB that is electrically connected to the conductive material of the first trace via; forming a second pad on a second layer that is electrically connected to the conductive material of the second trace via; forming a first ground pad on the first layer that is electrically connected to the conductive material of the first ground via, wherein the first ground pad is positioned between the first trace and the second trace; forming a second ground pad on the first layer that is electrically connected to the conductive material of the second ground via, wherein the first ground pad and the second ground pad are approximately symmetrically positioned about a perpendicular bisector of a line from the first pad to the second pad; forming a third ground pad on the first layer that is electrically connected to the conductive material of the third ground via; forming a fourth ground pad on the first layer that is electrically connected to the conductive material of the fourth ground via, wherein the third ground pad and the fourth ground pad are approximately symmetrically positioned about the perpendicular bisector; etching an antipad surrounding the first trace via and the second trace via; and forming a first trace on the first layer and a second trace on the second layer, wherein the first trace is electrically connected to the first pad, and wherein the second trace is electrically connected to the second pad. - View Dependent Claims (13, 14, 15)
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Specification