Extremely stretchable electronics
First Claim
1. A stretchable integrated circuit (IC) system comprising:
- a flexible substrate;
a first device island mounted to the flexible substrate and comprising a first integrated circuit (IC) device fabricated from a rigid semiconductor material;
a second device island mounted to the flexible substrate and comprising a second integrated circuit (IC) device fabricated from a rigid semiconductor material;
a third device island mounted to the flexible substrate and comprising a third integrated circuit (IC) device fabricated from a rigid semiconductor material;
a first flexible electrical interconnect electrically connecting the first IC device to the second IC device, such that a distance between the first IC device and the second IC device can be changed in a first dimension while maintaining an electrical connection between the first IC device and the second IC device; and
a second flexible electrical interconnect electrically connecting the second IC device to the third IC device, such that a distance between the second IC device and the third IC device can be changed in a second dimension while maintaining an electrical connection between the second IC device and third IC device.
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Accused Products
Abstract
In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the unstretched distance.
504 Citations
23 Claims
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1. A stretchable integrated circuit (IC) system comprising:
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a flexible substrate; a first device island mounted to the flexible substrate and comprising a first integrated circuit (IC) device fabricated from a rigid semiconductor material; a second device island mounted to the flexible substrate and comprising a second integrated circuit (IC) device fabricated from a rigid semiconductor material; a third device island mounted to the flexible substrate and comprising a third integrated circuit (IC) device fabricated from a rigid semiconductor material; a first flexible electrical interconnect electrically connecting the first IC device to the second IC device, such that a distance between the first IC device and the second IC device can be changed in a first dimension while maintaining an electrical connection between the first IC device and the second IC device; and a second flexible electrical interconnect electrically connecting the second IC device to the third IC device, such that a distance between the second IC device and the third IC device can be changed in a second dimension while maintaining an electrical connection between the second IC device and third IC device. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23)
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Specification