Palladium-based alloys

• US 10,385,424 B2
• Filed: 01/29/2016
• Issued: 08/20/2019
• Est. Priority Date: 01/29/2016
• Status: Active Grant

• Current Assignee: Deringer-Ney, Inc.
• Original Assignee: Deringer-Ney, Inc.
• Inventors: Klein, Arthur S., Smith, III, Edward F., Viswanathan, Srinath
• Primary Examiner(s): Wu, Jenny R
• Application Number:
  US15/010,690
• Publication Number:
  US 20170218481A1
• Time in Patent Office: 1,299 Days
• CPC Class Codes: C22C 5/04 Alloys based on a platinum group metal
• CPC Class Codes: G01R 1/06755 Material aspects

Abstract

Palladium-based ternary or higher alloys include palladium at about 45-55 wt %, copper about 32-42 wt %, silver at about 8-15 wt %, rhenium at about 0-5 wt %, and optionally one or more modifying elements at up to 1.0 wt %. The alloys are age-hardenable, provide hardness in excess of 350 HK (Knoop, 100 g load), have electrical conductivities above 19.5% IACS (International Annealed Copper Standard), have an elevated temperature strength above 100 ksi at temperatures up to 480° F. (250° C.), and remain ductile (tensile elongation >2%) in their fully age-hardened condition. The alloys may be used in static and moveable electrical contact and probe applications.

Claims

1. A palladium-based ternary or higher alloy, consisting of:

(a) palladium at about 45-55 wt %;

(b) copper at about 32-42 wt %;

(C) silver at about 8-15 wt %;

(d) rhenium at about 1.5-5 wt %;

(e) up to 1.0 wt % modifying elements selected from the group consisting of;

ruthenium, zirconium, gallium, and zinc; and

(f) optionally, one or more impurities,

wherein the alloy exhibits a second phase of rhenium,

wherein the alloy has a Pd;

Cu ratio of about 1.05 to 1.6 by weight,

wherein the alloy has a Pd;

Ag ratio of about 3 to 6 by weight, and

wherein a heat-treated electrical conductivity of the alloy exceeds 19.5% IACS.

2. The alloy of claim 1, wherein the palladium is present at about 51-55 wt %, the copper is present at about 32-40 wt %, the silver is present at about 8.5-14 wt %, and the rhenium is present at about 1.5-2.5 wt %.

3. The alloy of claim 1, wherein the palladium is present at about 51-55 wt %, the copper is present at about 32-40 wt %, the silver is present at about 8.5-14 wt %, and zinc is present at about 0.2-0.8 wt %.

4. The alloy of claim 1, wherein a hardness of the heat treated alloy is at least 350 Knoop.

5. The alloy of claim 1, wherein the alloy is age-hardened and maintains a yield strength above 100 ksi at about 60°

F. to about 480°

F.

6. The alloy of claim 1, wherein the alloy is age-hardened and has a tensile elongation of greater than 2%.

7. A semiconductor probe comprising a palladium-based ternary or higher alloy, the ahoy consisting of:

(a) palladium at about 45-55 wt %;

(b) copper at about 32-42 wt %;

(c) silver at about 8-15 wt %;

(d) rhenium at about 1.5-5 wt %;

(e) up to 1.0 wt % modifying elements selected from the group consisting of;

ruthenium, zirconium, gallium, and zinc; and

(f) optionally, one or more impurities,

wherein the ahoy exhibits a second phase of rhenium,

wherein the ahoy has a Pd;

Cu ratio of about 1.05 to 1.6 by weight,

wherein the ahoy has a Pd;

Ag ratio of about 3 to 6 by weight, and

wherein a heat-treated electrical conductivity of the alloy exceeds 19.5% IACS.

8. The semiconductor probe of claim 7, wherein the probe configured as a Cobra probe, a cantilever probe, a vertical probe, or a pogo pin probe.

9. The semiconductor probe of claim 7, wherein a hardness of the heat treated alloy is at least 350 Knoop.

10. The semiconductor probe of claim 7, wherein the alloy is age-hardened and maintains a yield strength above 100 ksi at about 60°

F. to about 480°

F.

11. The semiconductor probe of claim 7, wherein the alloy is age-hardened and has a tensile elongation of greater than 2%.