Vibration sensor with low-frequency roll-off response curve

• US 10,386,223 B2
• Filed: 08/23/2017
• Issued: 08/20/2019
• Est. Priority Date: 08/26/2016
• Status: Active Grant

• Current Assignee: Sonion Nederland BV
• Original Assignee: Sonion Nederland BV
• Inventors: Mogelin, Raymond, Post, Peter Christiaan
• Primary Examiner(s): Huls, Natalie
• Assistant Examiner(s): Nath, Suman K
• Application Number:
  US15/684,349
• Publication Number:
  US 20180058915A1
• Time in Patent Office: 727 Days
• Field of Search: 73644, 73652, 73609, 73488, 7351415
• CPC Class Codes: G01H 3/00 Measuring characteristics of vibrations by using a detector in a fluid G01H7/00, G01H9/00, G01H11/00 take precedence
• CPC Class Codes: G01H 3/06 by electric means
• CPC Class Codes: H04R 1/2807 Enclosures comprising vibrating or resonating arrangements for the reduction of undesired resonances or vibrations H04R1/2869
• CPC Class Codes: H04R 17/02 Microphones
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/04 Microphones H04R19/01 takes precedence
• CPC Class Codes: H04R 2201/003 Mems transducers or their use of the electrostatic type H04R19/005

Abstract

A vibration sensor comprising a pressure detecting arrangement adapted to detect generated pressure variations, and provide an output signal in response to the detected pressure variations, and a pressure generating arrangement adapted to generate pressure variations in response to movements thereof wherein the pressure generating arrangement is secured to an exterior surface portion of the pressure detecting arrangement. In a preferred embodiment the pressure detecting arrangement comprises a stand-alone and self-contained MEMS microphone unit comprising a MEMS microphone cartridge and a signal processing unit.

Claims

1. A vibration sensor comprising:

a pressure detecting arrangement configured to detect generated pressure variations, and provide an output signal in response to the detected pressure variations, wherein the pressure detecting arrangement includes a microphone unit, the microphone unit having a first PCB, and

a pressure generating arrangement configured to generate pressure variations in response to movements thereof,

wherein the pressure generating arrangement is secured to an exterior surface portion of the pressure detecting arrangement, the pressure generating arrangement including a suspension member, wherein an intermediate volume exists between an outer surface of the first PCB and a surface of the suspension member, and wherein the first PCB includes a through-going opening acoustically connected to the intermediate volume.

2. The vibration sensor according to claim 1, wherein the pressure generating arrangement further includes a moveable mass secured thereto.

3. The vibration sensor according to claim 2, wherein the area of the suspension member is larger than 0.5 mm² or larger than 2 mm² or larger than 4 mm² or larger than 8 mm² or larger than 10 mm².

4. The vibration sensor according to claim 2, wherein the mass of the moveable mass is larger than 0.004 mg or larger than 0.04 mg or larger than 0.4 mg.

5. The vibration sensor according to claim 2, wherein the mass of the moveable mass is around 4 mg.

6. The vibration sensor according to claim 2, wherein the microphone unit comprises a microphone cartridge and a signal processing unit.

7. The vibration sensor according to claim 2, wherein the microphone unit comprises a stand-alone and self-contained MEMS microphone unit.

8. The vibration sensor according to claim 7, wherein MEMS microphone unit comprises a MEMS microphone cartridge and the signal processing unit.

9. The vibration sensor according to claim 8, wherein the stand-alone and self-contained MEMS microphone unit comprises the first PCB to which the MEMS microphone cartridge and the signal processing unit are electrically connected.

10. The vibration sensor according to claim 9, wherein the stand-alone and self-contained MEMS microphone unit comprises a second PCB comprising a plurality of contact zones arranged thereon.

11. The vibration sensor according to claim 10, wherein the second PCB is oppositely arranged relative to the first PCB.

12. The vibration sensor according to claim 1, wherein the intermediate volume is smaller than 5 mm³ or smaller than 1 mm³ or smaller than 0.5 mm³ or smaller than 0.1 mm³.