Formation of epitaxial layers via dislocation filtering

• US 10,388,509 B2
• Filed: 06/19/2017
• Issued: 08/20/2019
• Est. Priority Date: 06/28/2016
• Status: Active Grant

• Current Assignee: ASM IP Holding B.V. (ASM International NV)
• Original Assignee: ASM IP Holding B.V. (ASM International NV)
• Inventors: Margetis, Joe, Tolle, John
• Primary Examiner(s): Smoot, Stephen W
• Application Number:
  US15/627,189
• Publication Number:
  US 20170372884A1
• Time in Patent Office: 792 Days
• CPC Class Codes: H01L 21/02005 Preparing bulk and homogeneous wafers
• CPC Class Codes: H01L 21/0245 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02452 including tin
• CPC Class Codes: H01L 21/02502 consisting of two layers
• CPC Class Codes: H01L 21/02507 Alternating layers, e.g. superlattice
• CPC Class Codes: H01L 21/02532 Silicon, silicon germanium, germanium
• CPC Class Codes: H01L 21/02535 including tin
• CPC Class Codes: H01L 21/0262 Reduction or decomposition of gaseous compounds, e.g. CVD
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/7688 by deposition over sacrificial masking layer, e.g. lift-off lift-off per se H01L21/0272
• CPC Class Codes: H01L 29/161 including two or more of the elements provided for in group H01L29/16 , e.g. alloys H01L29/1604 takes precedence

Abstract

A process for forming a thick defect-free epitaxial layer is disclosed. The process may comprise forming a buffer layer and a sacrificial layer prior to forming the thick defect-free epitaxial layer. The sacrificial layer and the thick defect-free epitaxial layer may be formed of the same material and at the same process conditions.

Claims

1. A process for forming an epitaxial film on a substrate, comprising:

providing a reaction chamber, the reaction chamber enclosing a substrate to be processed;

forming a buffer layer on the substrate;

forming a sacrificial layer on top of the buffer layer; and

forming a bulk layer on top of the sacrificial layer, wherein the bulk layer comprises at least one of germanium-tin or silicon-germanium-tin;

wherein the sacrificial layer comprises at least one dislocation caused by an interfacial strain;

wherein the bulk layer is substantially free from dislocations caused by an interfacial strain; and

wherein the bulk layer and the sacrificial layer comprise the same material having the same chemical formula.

2. The process of claim 1, wherein the forming the sacrificial layer and the forming the bulk layer are alternately repeated.

3. The process of claim 1, wherein the bulk layer has a percentage of tin ranging between 0.5 and 15 at %.

4. The process of claim 1, wherein the sacrificial layer has a percentage of tin ranging between 0.5 and 15 at %.

5. The process of claim 1, wherein the substrate comprises at least one of:

a bulk silicon wafer;

a bulk germanium wafer;

or a wafer made of III-V semiconductor material.

6. The process of claim 1, wherein the at least one dislocation in the sacrificial layer is caused by an interfacial strain energy from a lattice mismatch.

7. The process of claim 1, wherein the forming the buffer layer comprises flowing a precursor gas including at least one of:

germane or digermane.

8. The process of claim 7, wherein a pressure of the reaction chamber during the forming the buffer layer ranges between 5 and 760 Torr;

and

wherein a temperature of the reaction chamber during the forming the buffer layer ranges between 300 and 850°

C.

9. The process of claim 1, wherein the forming the sacrificial layer comprises:

flowing a silicon precursor gas;

flowing a germanium precursor gas; and

flowing a tin precursor gas.

10. The process of claim 9, wherein the silicon precursor gas comprises at least one of:

silane;

disilane;

trisilane;

tetrasilane;

neopentasilane;

or other higher order silanes.

11. The process of claim 9, wherein the germanium precursor gas comprises at least one of:

germane;

or higher order germanes.

12. The process of claim 9, wherein the tin precursor gas comprises at least one of:

tin chloride (SnCl₄), deuterated stannane (SnD₄), and a methyl and/or halide substituted stannane, wherein the methyl and/or halide substituted stannane comprises a compound having a formula represented by at least one of Sn(CH₃)_4-nX_n, in which X is H, D (deuterium), Cl, or Br and n is 0, 1, 2, or 3;

ZSn(CH₃)_3-nX_n in which Z is H or D, X is Cl or Br, and n is 0, 1, or 2;

Z₂Sn(CH₃)_2-nX_n in which Z is H or D, X is Cl or Br, and n is 0 or 1;

or SnBr₄.

13. The process of claim 9, wherein a pressure of the reaction chamber during the forming the sacrificial layer ranges between 500 and 800 Torr;

and

wherein a temperature of the reaction chamber during the forming the sacrificial layer ranges between 200 and 500°

C.

14. The process of claim 1, wherein the forming the bulk layer comprises flowing a precursor gas including at least one of:

germane or digermane.

15. The process of claim 14, wherein a pressure of the reaction chamber during the forming the bulk layer ranges between 500 and 800 Torr;

and

wherein a temperature of the reaction chamber during the forming the bulk layer ranges between 200 and 500°

C.

16. A process for forming an epitaxial film on a substrate, comprising:

providing a reaction chamber, the reaction chamber enclosing a substrate to be processed;

forming a buffer layer on the substrate;

forming a first dislocation filtering layer on top of the buffer layer;

forming a first bulk layer comprising at least one of germanium-tin or silicon-germanium-tin on top of the first dislocation filtering layer;

forming a second dislocation filtering layer on top of the first bulk layer; and

forming a second bulk layer on top of the second dislocation filtering layer;

wherein the first dislocation filtering layer and the second dislocation filtering layer comprise at least one dislocation caused by an interfacial strain;

wherein the first bulk layer and the second bulk layer are substantially free from dislocations caused by an interfacial strain; and

wherein the first dislocation filtering layer, the first bulk layer, the second dislocation filtering layer, and the second bulk layer all comprise the same material having the same chemical formula.