Method of producing a flexible thermoelectric device to harvest energy for wearable applications

• US 10,388,847 B2
• Filed: 03/02/2016
• Issued: 08/20/2019
• Est. Priority Date: 05/14/2015
• Status: Active Grant

• Current Assignee: Nimbus Materials Inc
• Original Assignee: Nimbus Materials Inc
• Inventors: Kasichainula, Sridhar
• Primary Examiner(s): White, Sadie
• Application Number:
  US15/059,286
• Publication Number:
  US 20160336503A1
• Time in Patent Office: 1,266 Days
• CPC Class Codes: H10N 10/01 Manufacture or treatment
• CPC Class Codes: H10N 10/817 the junction being non-separable, e.g. being cemented, sintered or soldered
• CPC Class Codes: H10N 10/82 Connection of interconnections

Abstract

A method and/or apparatus of energy harvesting for wearable technology through a thin flexible thermoelectric device is disclosed. A lower conduction layer is formed on top of a lower dielectric layer. An active layer, comprising at least one thin film thermoelectric conduit and a thermal insulator, is formed above the lower conduction layer. An internal dielectric layer is formed above the active layer, and contact holes are drilled above each thermoelectric conduit. An upper conduction layer and upper dielectric layer are formed, connecting the thermoelectric conduits in series. The resulting flexible thermoelectric device generates a voltage when exposed to a temperature gradient.

Claims

1. A method of producing a flexible thermoelectric device comprising:

forming a lower conduction layer on top of a lower dielectric layer, with the lower conduction layer comprising a plurality of electrically conductive pads and a plurality of lower electrically conductive leads disposed directly across a surface of the lower dielectric layer, wherein the plurality of electrically conductive pads comprise a plurality of N-designated conductive pads and a plurality of P-designated conductive pads, wherein each of the lower electrically conductive leads connects a pair of a neighboring N-designated conductive pad and a P-designated conductive pad, wherein each of the lower electrically conductive leads extends between the N-designated conductive pad and the P-designated conductive pad of the corresponding pair across the surface of the lower dielectric layer, parallel to a length of both the N-designated conductive pad and the P-designated conductive pad of the corresponding pair, wherein the each of the lower electrically conductive leads is narrower in width compared to a width of both the N-designated conductive pad and the P-designated conductive pad of the corresponding pair, and wherein the width of both the N-designated conductive pad and the P-designated conductive pad of the corresponding pair is a dimension perpendicular to the length thereof;

aligning an N-designated mask on top of the lower conduction layer, wherein the N-designated mask has a first pattern based on the plurality of N-designated conductive pads of the lower conduction layer such that the plurality of N-designated conductive pads of the lower conduction layer is exposed through the N-designated mask;

forming a plurality of N-type conduits each on top of one of the N-designated conductive pads exposed through the N-designated mask based on the first pattern;

aligning a P-designated mask on top of the lower conduction layer, wherein the P-designated mask has a second pattern based on the plurality of P-designated conductive pads of the lower conduction layer such that the plurality of P-designated conductive pads of the lower conduction layer is exposed through the P-designated mask;

forming a plurality of P-type conduits each on top of one of the P-designated conductive pads exposed through the P-designated mask based on the second pattern;

laminating a layer of thermal insulator on top of and around the plurality of N-type conduits and P-type conduits, such that the thermal insulator fills a space around each of the N-type conduits and the P-type conduits, with an internal dielectric layer on top of the layer of thermal insulator, the internal dielectric layer comprising flexible material and being electrically insulating, the thermal insulator being an adhesive, and a surface of the internal dielectric layer being parallel to a surface of both the N-type conduits and the P-type conduits;

drilling a plurality of contact holes each through the internal dielectric layer and the layer of thermal insulator such that each contact hole starts from the internal dielectric layer, goes through a thickness thereof directly into a thickness of the thermal insulator, and ends on a top surface of one of the N-type conduits and the P-type conduits;

forming an upper conduction layer on top of the internal dielectric layer;

coupling, through the plurality of contact holes, a plurality of electrically conductive contacts to a top of the one of the N-type conduits and the P-type conduits;

connecting, through each of a plurality of upper electrically conductive leads, each pair of neighboring electrically conductive contacts; and

forming an upper dielectric layer on top of the upper conduction layer,

wherein at least a portion of each of the electrically conductive contacts is between the internal dielectric layer and the upper dielectric layer,

wherein the each of the N-type conduits and the P-type conduits is a thin film thermoelectric conduit, with the each of the N-type conduits comprising at least one N-type thermoelectric material, and the each of the P-type conduits comprising at least one P-type thermoelectric material,

wherein the each of the N-type conduits is electrically connected to one of the P-type conduits in the lower conduction layer and to another one of the P-type conduits in the upper conduction layer, and the each of the P-type conduits is electrically connected to one of the N-type conduits in the lower conduction layer and to another one of the N-type conduits in the upper conduction layer such that the plurality of N-type conduits and the P-type conduits are electrically connected in series, and

wherein the each of the N-type conduits and the P-type conduits is thermally insulated so that a heat energy flows vertically through the thin film thermoelectric conduit without leaking to other thin film thermoelectric conduits on the sides.

2. The method of claim 1:

wherein the internal dielectric layer is a poor thermal conductor having a thermal conductivity value less than 1 watt per meter kelvin (W/(mK)), and

wherein both the upper dielectric layer and the lower dielectric layer are electrical insulators and good thermal conductors having a thermal conductivity value greater than 5 watts per meter kelvin (W/(mK)).

3. The method of claim 1, wherein the thin film thermoelectric conduits comprise at least one layer of thermoelectric material with a combined thickness no greater than 50 microns.

4. The method of claim 1, further comprising:

forming a barrier layer through at least one of the N-designated mask, the P-designated mask, and a PN-designated mask with at least one of the N-designated conductive pads and P-designated conductive pads exposed, such that the barrier layer is between at least one of;

different layers of thermoelectric material within at least one thin film thermoelectric conduit,

an electrically conductive pad and a second thin film thermoelectric conduit, and

an electrically conductive contact and a third thin film thermoelectric conduit,

wherein the barrier layer is electrically conductive and has a higher melting temperature than either of the substances being separated by the barrier layer.

5. The method of claim 1, wherein:

at least one of;

the forming of the lower conduction layer,

the forming of the N-type conduits,

the forming of the P-type conduits,

the forming of the upper conduction layer, and

the forming of the upper dielectric layer

comprises at least one of a vacuum deposition, a sputter deposition, a chemical vapor deposition, a physical vapor deposition, an electrochemical deposition, a molecular beam epitaxy, an atomic layer deposition, an electroplating, a screen printing, an etching, a chemical-mechanical planarization, a lithography, another deposition method and an etching method.

6. The method of claim 1, wherein:

at least one of;

the lower dielectric layer,

the internal dielectric layer, and

the upper dielectric layer

is at least one of a flexible polymer, a polymer composite, a polyimide, a polyacrylate, a polyvinyl acetate and a mylar.

7. The method of claim 1:

wherein the plurality of electrically conductive pads is formed from at least one of a first layer of metal in a first metal clad, a first layer of deposited metal, a first layer of conductive paste, a first electroplated layer, and a first surface plating layer, and

wherein the plurality of electrically conductive contacts is formed from at least one of a second layer of metal in a second metal clad, a second layer of deposited metal, a second layer of conductive paste, a second electroplated layer, and a second surface plating layer.

8. The method of claim 1, wherein the lower conduction layer and at least one of the plurality of N-type conduits and the plurality of P-type conduits are annealed before the upper conduction layer is made.

9. The method of claim 1, wherein the aligning of the N-designated mask, the forming of the N-type conduits, the aligning of the P-designated mask, and the forming of the P-type conduits, are all accomplished within a same vacuum system while continuing to maintain a vacuum.