Intra-die defect detection

• US 10,393,671 B2
• Filed: 04/27/2016
• Issued: 08/27/2019
• Est. Priority Date: 04/29/2015
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Thattaisundaram, Govindarajan, Lee, Hucheng, Gao, Lisheng
• Primary Examiner(s): Czekaj, Dave
• Assistant Examiner(s): Brumfield, Shanika M
• Application Number:
  US15/140,438
• Publication Number:
  US 20160321800A1
• Time in Patent Office: 1,217 Days
• CPC Class Codes: G01N 2021/8883 involving the calculation of gauges, generating models
• CPC Class Codes: G01N 2021/95676 Masks, reticles, shadow masks
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G01N 2201/06113 Coherent sources; lasers
• CPC Class Codes: G01N 2201/0683 Brewster plate; polarisation controlling elements
• CPC Class Codes: G01N 2201/10 Scanning
• CPC Class Codes: G06T 2207/10056 Microscopic image
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer subsystems configured for acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest (POI) within a die formed on the specimen. The multiple instances include two or more instances that are located at aperiodic locations within the die. The computer subsystem(s) are also configured for generating a POI reference image from two or more of the images generated at the multiple instances of the POI within the die. The computer subsystem(s) are further configured for comparing the images generated at the multiple instances of the POI within the die to the POI reference image and detecting defects in the multiple instances of the POI based on results of the comparing.

Claims

1. A system configured to detect defects on a specimen, comprising:

an imaging subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a specimen, and wherein the detector is configured to detect energy from the specimen and to generate images responsive to the detected energy; and

one or more computer subsystems configured for;

acquiring images generated by the imaging subsystem at multiple instances of a pattern of interest within a die formed on the specimen, wherein the multiple instances comprise two or more instances that are located at aperiodic locations within the die;

generating a pattern of interest reference image from two or more of the images generated at the multiple instances of the pattern of interest within the die, wherein the one or more computer subsystems pick a selection of the images used for generating the pattern of interest reference image by eliminating any one or more outliers in the images generated at the multiple instances of the pattern of interest within the die from use in generative the pattern of interest reference image;

comparing the images generated at the multiple instances of the pattern of interest within the die to the pattern of interest reference image; and

detecting defects in the multiple instances of the pattern of interest based on results of the comparing.

2. The system of claim 1, wherein the one or more computer subsystems are further configured for separately performing said acquiring, said generating, said comparing, and said detecting for a different pattern of interest within the die formed on the specimen.

3. The system of claim 1, wherein the results of the comparing comprise difference images for the multiple instances of the pattern of interest, and wherein said detecting comprises applying a defect detection method to the difference images.

4. The system of claim 1, wherein the one or more computer subsystems are further configured for aligning the two or more of the images generated at the multiple instances of the pattern of interest prior to generating the pattern of interest reference image.

5. The system of claim 1, wherein the one or more computer subsystems are further configured for receiving information for the pattern of interest and identifying all of the multiple instances of the pattern of interest in the die based on the information.

6. The system of claim 5, wherein the one or more computer subsystems are further configured for separating all of the identified multiple instances of the pattern of interest into a bin, wherein the bin does not include any instances of any different patterns of interest within the die on the specimen, and wherein the one or more computer subsystems are further configured for separating the multiple instances in the bin into different sub-bins based on neighboring patterns located adjacent to the pattern of interest such that each of the different sub-bins corresponds to a different combination of the pattern of interest and one of the neighboring patterns.

7. The system of claim 1, wherein the one or more computer subsystems are further configured for separately performing said acquiring, said generating, said comparing, and said detecting for different combinations of the pattern of interest and different neighboring patterns located adjacent to the pattern of interest.

8. The system of claim 1, wherein generating the pattern of interest reference image is performed based on the images generated at fewer than all of the multiple instances of the pattern of interest within the die.

9. The system of claim 1, wherein the one or more computer subsystems are further configured for, prior to said generating, reducing image artifacts in the acquired images caused by the imaging subsystem or the specimen.

10. The system of claim 1, wherein the two or more of the images used for generating the pattern of interest reference image are generated in a first pass scan of the specimen performed by the imaging subsystem, and wherein the images compared to the pattern of interest reference image in said comparing are generated in a second pass scan of the specimen performed by the imaging subsystem.

11. The system of claim 1, wherein the one or more computer subsystems comprise a virtual inspection system, wherein the two or more of the images used for generating the pattern of interest reference image are generated in a first pass scan of the specimen performed by the virtual inspection system, and wherein the images compared to the pattern of interest reference image in said comparing are generated in a second pass scan of the specimen performed by the virtual inspection system.

12. The system of claim 1, wherein the two or more of the images used for generating the pattern of interest reference image and the images compared to the pattern of interest reference image in said comparing are generated in the same pass scan of the specimen performed by the imaging subsystem.

13. The system of claim 1, wherein the pattern of interest reference image is not used for detecting defects in any other die on the specimen or any other die on another specimen.

14. The system of claim 1, wherein the multiple instances of the pattern of interest are located within only one of multiple reticle fields within the die formed on the specimen.

15. The system of claim 1, wherein the die is a single instance of multiple dies formed on the specimen, and wherein the multiple instances for which said acquiring, said generating, said comparing, and said detecting are performed are located only within the single instance of the multiple dies.

16. The system of claim 1, wherein the die is the only die formed on the specimen.

17. The system of claim 1, wherein the specimen comprises a wafer.

18. The system of claim 1, wherein the specimen comprises a reticle.

19. The system of claim 1, wherein the energy directed to the specimen comprises light, and wherein the energy detected from the specimen comprises light.

20. The system of claim 1, wherein the energy directed to the specimen comprises electrons, and wherein the energy detected from the specimen comprises electrons.

21. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for detecting defects on a specimen, wherein the computer-implemented method comprises:

acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest within a die formed on a specimen, wherein the multiple instances comprise two or more instances that are located at aperiodic locations within the die, wherein the imaging subsystem comprises at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to the specimen, and wherein the detector is configured to detect energy from the specimen and to generate images responsive to the detected energy;

generating a pattern of interest reference image from two or more of the images generated at the multiple instances of the pattern of interest within the die, wherein the method further comprises nicking a selection of the images used for generating the pattern of interest reference image by eliminating any one or more outliers in the images generated at the multiple instances of the pattern of interest within the die from use in generating the pattern of interest reference image;

comparing the images generated at the multiple instances of the pattern of interest within the die to the pattern of interest reference image; and

detecting defects in the multiple instances of the pattern of interest based on results of the comparing, wherein said acquiring, said generating, said comparing, and said detecting are performed by the computer system.

22. A computer-implemented method for detecting defects on a specimen, comprising:

acquiring images generated by an imaging subsystem at multiple instances of a pattern of interest within a die formed on a specimen, wherein the multiple instances comprise two or more instances that are located at aperiodic locations within the die, wherein the imaging subsystem comprises at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to the specimen, and wherein the detector is configured to detect energy from the specimen and to generate images responsive to the detected energy;

generating a pattern of interest reference image from two or more of the images generated at the multiple instances of the pattern of interest within the die, wherein the method further comprises nicking a selection of the images used for generating the pattern of interest reference image by eliminating any one or more outliers in the images generated at the multiple instances of the pattern of interest within the die from use in generating the pattern of interest reference image;

comparing the images generated at the multiple instances of the pattern of interest within the die to the pattern of interest reference image; and

detecting defects in the multiple instances of the pattern of interest based on results of the comparing, wherein said acquiring, said generating, said comparing, and said detecting are performed by one or more computer systems.